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1.发明公开PRINTHEAD WITH INCREASING DRIVE PULSE TO COUNTER HEATER OXIDE GROWTH 审中-公开PRINTHEAD增加驱动脉冲，以对抗加热器氧化物增长
公开(公告)号：EP2346695A1
公开(公告)日：2011-07-27
申请号：EP08877915.2
申请日：2008-11-10
发明人： SILVERBROOK, Kia , FOOTE, Roger, Mervyn, Lloyd , NORTH, Angus, John , FISHBURN, Jennifer, Mia , LUNSMANN, Paul, David , C.S., Lakshmi , CROUS, Frederik, Jacobus , WALKER, Matthew, Stewart , MALLINSON, Samuel, George , REICHL, Paul, Justin
CPC分类号： B41J2/0458 , B41J2/04563 , B41J2/1412 , B41J2202/03 , B41J2202/11
摘要： An inkjet printer that has a printhead with an array of ejection devices for ejecting drops of liquid onto a media substrate. Each of the ejection devices having a chamber for holding liquid, a nozzle in fluid communication with the chamber and a heater positioned in the chamber for contact with the liquid such that resistive heating of the heater generates a vapour bubble that ejects a drop of the liquid through the nozzle. The printer also has a controller for receiving print data and generating drive pulses to energize the heaters in accordance with the print data. The controller increases the drive pulse energy during the printhead lifetime.
摘要翻译： 一种喷墨打印机，其具有带有用于将液滴喷射到介质基板上的喷射装置阵列的打印头。 每个喷射装置具有用于保持液体的腔室，与腔室流体连通的喷嘴以及位于腔室中用于与液体接触的加热器，使得加热器的电阻加热产生蒸汽气泡，其喷射一滴液体 通过喷嘴。 打印机还具有控制器，用于接收打印数据并产生驱动脉冲以根据打印数据激励加热器。 控制器在打印头使用寿命期间增加驱动脉冲能量。
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公开(公告)号：EP2146924B1
公开(公告)日：2013-03-06
申请号：EP08733447.0
申请日：2008-05-06
发明人： PAPWORTH, Paul, Andrew , THELANDER, Jason, Mark , FOOTE, Roger, Mervyn, Lloyd , VELLA, Andrew, Leon , JOHNSTONE, David, Mcleod , SILVERBROOK, Kia
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T156/1153 , Y10T156/19 , Y10T156/1911
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公开(公告)号：EP2146924A1
公开(公告)日：2010-01-27
申请号：EP08733447.0
申请日：2008-05-06
发明人： PAPWORTH, Paul, Andrew , THELANDER, Jason, Mark , FOOTE, Roger, Mervyn, Lloyd , VELLA, Andrew, Leon , JOHNSTONE, David, Mcleod , SILVERBROOK, Kia
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T156/1153 , Y10T156/19 , Y10T156/1911
摘要： A method of removing MEMS devices (2) from a handle substrate (1), where the MEMS devices are individually bonded to it via a thermal release adhesive (3) that reduces its adhesion when heated above a threshold temperature. The method heats the MEMS devices (2) individually with a heat source (10) to conductively heat the thermal release adhesive (11) above the threshold temperature. With the adhesive (11) directly in contact with the back side (5) of the MEMS device (2) no longer bonding it to the glass handle (1), the devices (2) can be individually removed by a die picker (6). This method quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, heating the die by conduction, will in turn conductively heat the adhesive s that only that adhesive which is closely localized to the die is released. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.
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