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公开(公告)号：EP2146924B1
公开(公告)日：2013-03-06
申请号：EP08733447.0
申请日：2008-05-06
发明人： PAPWORTH, Paul, Andrew , THELANDER, Jason, Mark , FOOTE, Roger, Mervyn, Lloyd , VELLA, Andrew, Leon , JOHNSTONE, David, Mcleod , SILVERBROOK, Kia
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T156/1153 , Y10T156/19 , Y10T156/1911
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公开(公告)号：EP2146924A1
公开(公告)日：2010-01-27
申请号：EP08733447.0
申请日：2008-05-06
发明人： PAPWORTH, Paul, Andrew , THELANDER, Jason, Mark , FOOTE, Roger, Mervyn, Lloyd , VELLA, Andrew, Leon , JOHNSTONE, David, Mcleod , SILVERBROOK, Kia
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T156/1153 , Y10T156/19 , Y10T156/1911
摘要： A method of removing MEMS devices (2) from a handle substrate (1), where the MEMS devices are individually bonded to it via a thermal release adhesive (3) that reduces its adhesion when heated above a threshold temperature. The method heats the MEMS devices (2) individually with a heat source (10) to conductively heat the thermal release adhesive (11) above the threshold temperature. With the adhesive (11) directly in contact with the back side (5) of the MEMS device (2) no longer bonding it to the glass handle (1), the devices (2) can be individually removed by a die picker (6). This method quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, heating the die by conduction, will in turn conductively heat the adhesive s that only that adhesive which is closely localized to the die is released. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.
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