公开(公告)号：EP0567016A2

公开(公告)日：1993-10-27

申请号：EP93106238.4

申请日：1993-04-16

申请人： Sumitomo Electric Industries, Ltd.

发明人： Hattori, Hisao, c/o Itami Works of Sumitomo Elec. ,  Yoshino, Hiroshi, c/o Itami Works of Sumitomo Elec ,  Ihara, Tomohiko, c/o Itami Works of Sumitomo Elec ,  Yamanaka, Shosaku, c/o Itami Works Sumitomo Elec.

IPC分类号： H05K3/46

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0306 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09018 ,  H05K2201/09681 ,  H05K2201/09736 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2924/00

摘要： A multilayered wiring board having a multilayered wiring structure. A first meshed wiring layer (1) having a plurality of holes formed therein and a second wiring layer (2) having a plurality of wirings are provided. The wirings of the second wiring layer wind up and down so as to partially sink in the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding into spaces between the adjacent ones of the wirings of the second wiring layer. The crosstalks between the wirings are reduced.

公开(公告)号：EP0567016B1

公开(公告)日：1995-10-11

申请号：EP93106238.4

申请日：1993-04-16

申请人： Sumitomo Electric Industries, Ltd.

发明人： Hattori, Hisao, c/o Itami Works of Sumitomo Elec. ,  Yoshino, Hiroshi, c/o Itami Works of Sumitomo Elec ,  Ihara, Tomohiko, c/o Itami Works of Sumitomo Elec ,  Yamanaka, Shosaku, c/o Itami Works Sumitomo Elec.

IPC分类号： H05K3/46

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0306 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09018 ,  H05K2201/09681 ,  H05K2201/09736 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2924/00

公开(公告)号：EP0567016A3

公开(公告)日：1994-03-23

申请号：EP93106238.4

申请日：1993-04-16

申请人： Sumitomo Electric Industries, Ltd.

发明人： Hattori, Hisao, c/o Itami Works of Sumitomo Elec. ,  Yoshino, Hiroshi, c/o Itami Works of Sumitomo Elec ,  Ihara, Tomohiko, c/o Itami Works of Sumitomo Elec ,  Yamanaka, Shosaku, c/o Itami Works Sumitomo Elec.

IPC分类号： H05K3/46

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0306 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09018 ,  H05K2201/09681 ,  H05K2201/09736 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2924/00

摘要： A multilayered wiring board having a multilayered wiring structure. A first meshed wiring layer (1) having a plurality of holes formed therein and a second wiring layer (2) having a plurality of wirings are provided. The wirings of the second wiring layer wind up and down so as to partially sink in the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding into spaces between the adjacent ones of the wirings of the second wiring layer. The crosstalks between the wirings are reduced.

摘要翻译： 一种具有多层布线结构的多层布线板。 提供其中形成有多个孔的第一网状布线层（1）和具有多个布线的第二布线层（2）。 第二布线层的布线上下卷绕以部分地沉入形成在第一布线层中的孔中。 在另一种布置中，第一布线层具有多个突起，所述多个突起突出到第二布线层的相邻布线之间的空间中。 线路之间的串扰减少。