利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

160 条记录 (耗时 0.014 秒)

    PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
    2.
    发明公开
    PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION 审中-公开

    公开(公告)号：EP3242535A2

    公开(公告)日：2017-11-08

    申请号：EP17172059.2

    申请日：2012-03-05

    申请人： MediaTek Inc.

    发明人： CHEN, Nan-Jang

    IPC分类号： H05K1/02 ,  H01P3/08

    CPC分类号： H05K1/0219 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09236

    摘要： A printed circuit board (PCB) is disclosed. The PCB (200) includes a substrate (202) have a top surface (202a) and a bottom surface (202b). A first conductive layer (203) is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net (203a) and a second signal net (203b). An outermost insulating layer (204) is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening (209) to expose a portion of the second signal net. And, a second conductive layer (207) is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential. The thickness of outermost insulating layer (204) is less than 1 mm.

    ELECTRONIC COMPONENT STORING PACKAGE AND ELECTRONIC DEVICE
    3.
    发明公开
    ELECTRONIC COMPONENT STORING PACKAGE AND ELECTRONIC DEVICE 审中-公开
    AUFBEWAHRUNGSPACKUNGFÜREINE ELEKTRONISCHE KOMPONENTE UND ELEKTRONISCHE VORRICHTUNG

    公开(公告)号：EP3076426A1

    公开(公告)日：2016-10-05

    申请号：EP14864242.4

    申请日：2014-11-18

    申请人： Kyocera Corporation

    发明人： NIINO,Noritaka

    IPC分类号： H01L23/02 ,  H01L23/08 ,  H03H9/02 ,  H03H9/25

    CPC分类号： H01L23/053 ,  H01L21/50 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L41/053 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H03H9/1014 ,  H03H9/1071 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/183 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K9/0098 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/10371 ,  H01L2924/00014

    摘要： An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package (10) includes an insulating substrate (1) including a plurality of insulating layers (11) stacked on top of each other, an upper surface of the insulating substrate (1) being provided with an electronic component (4) mounting section. The plurality of insulating layers (11) each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer (2) in frame-like form disposed on an upper surface of an uppermost one (11) of the plurality of insulating layers (11). The first metal layer (2) contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

    摘要翻译： 提供能够减少红外线加热操作时间的电子部件外壳封装等。 一种电子部件壳体封装（10），包括绝缘基板（1），绝缘基板（1）包括堆叠在彼此顶部的多个绝缘层（11），所述绝缘基板（1）的上表面设置有电子部件（4） 安装部分。 多个绝缘层（11）各自含有第一金属氧化物作为主要成分。 所述绝缘基板还包括设置在所述多个绝缘层（11）的最上面（11）的上表面上的框状形式的第一金属层（2）。 第一金属层（2）含有与第一金属氧化物相比红外线吸收率更高的第二金属氧化物。

    PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
    6.
    发明公开
    PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION 审中-公开
    ENTWURF EINERBESTÜCKTENLEITERPLATTEFÜREINE HOCHGESCHWINDIGKEITSANWENDUNG

    公开(公告)号：EP2684431A4

    公开(公告)日：2014-12-10

    申请号：EP12755093

    申请日：2012-03-05

    申请人： MEDIATEK INC

    发明人： CHEN NAN-JANG

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0219 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09236

    摘要： A printed circuit board (PCB) is disclosed. The PCB (200) includes a substrate (202) have a top surface (202a) and a bottom surface (202b). A first conductive layer (203) is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net (203a) and a second signal net (203b). An outermost insulating layer (204) is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening (209) to expose a portion of the second signal net. And, a second conductive layer (207) is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential. The thickness of outermost insulating layer (204) is less than 1 mm.

    摘要翻译： 公开了印刷电路板（PCB）。 PCB包括具有顶表面和底表面的基底。 第一导电层设置在基板的顶表面上。 第一导电层包括第一信号网和第二信号网。 最外层绝缘层设置在基板的顶表面上以覆盖基板和第一导电层。 最外层绝缘层包括露出第二信号网的一部分的开口。 并且，第二导电层设置在最外绝缘层上并且基本覆盖第一信号网的至少一部分。 第二导电层被填充到开口中以电连接到能够提供地电位和功率电位之一的第二信号网。

    Verbundbauteil mit elektrischen Leitungen
    10.
    发明公开
    Verbundbauteil mit elektrischen Leitungen 审中-公开

    公开(公告)号：EP2716437A1

    公开(公告)日：2014-04-09

    申请号：EP12187229.5

    申请日：2012-10-04

    申请人： Magna Steyr Fahrzeugtechnik AG & Co KG

    发明人： Hofer, Bernhard

    IPC分类号： B29C70/88

    CPC分类号： H05K1/038 ,  B29C70/885 ,  H01B7/0861 ,  H01B7/0876 ,  H05K1/0224 ,  H05K1/0366 ,  H05K1/0393

    摘要： Es wird ein Verbundbauteil aus Kunststoff- Faser- Verbundwerkstoff mit mindestens zwei Lagen aus faserverstärktem Material vorgeschlagen, wobei zwischen die mindestens zwei Lagen von faserverstärktem Material mindestens eine elektrische Leitung eingebracht ist.

    摘要翻译： 该复合部件具有以预设方式布置的两个纤维增强材料层（3）。 电线（6）设置在两个纤维增强材料层之间，并连接到电气端子（7）。 电线部分由金属线或电线（4）组成。 金属线由相互扭曲和/或编织的单根线组成。