摘要:
A semiconductor memory device has at least one memory cell (MC11 to MCMN) which includes first and second tunnel diodes (TD1 and TD2) connected in series in a forward-bias direction between first and second power source terminals (VD and VS). The first and second power source terminals (VD and VS) are held at constant potentials. A switching MOS transistor (TR1) is connected at one end to a connection point between the first and second tunnel diodes (TD1 and TD2). The potential at the connection point between the first and second tunnel diodes (TD1 and TD2) is determined by the potential at the other end of the switching MOS transistor (TR1).
摘要:
A two state memory cell includes a bipolar transistor (11) and a tunnel diode (16) shunted across the base-collector junction thereof. A constant operating current is established through the transistor (11) and the tunnel diode (16). The voltage across the tunnel diode (16) may thus be maintained at one of two stable levels, while the bipolar transistor (11) is kept on regardless of the tunnel diode voltage, which determines the ZERO or ONE state of the cell. Since the transistor (11) is not switched on and off when the memory state (corresponding to the two tunnel diode voltage levels) changes, memory cell switching speed is not degraded by transistor switching delay. Moreover, since the current in the tunnel diode (16) is maintained constant, preferably at a value midway between the tunnel diode peak and valley currents, the noise margin of the memory cell is enhanced and the possibility of false switching reduced. The tunnel diode/bipolar transistor combination may be formed on a semiconductor substrate as an integrated structure, thereby providing a high density memory cell.
摘要:
A memory bistable cell well suited for integration in memory integrated circuits, comprising a voltage source, a load resistor and a resonant-tunneling semiconductor diode (in lieu of two-transistor flip-flop). A device comprising an InAlAs-InGaAs-InAlAs single quantum well resonant-tunneling structure formed between an InP-InGaAs substrate/buffer structure and an InGaAs cap layer. An undoped InGaAs layer is further formed between the resonant-tunneling structure and the cap layer in order to accelerate the emitted carriers and provide more gradual current peaks. The device can be operated at temperatures greater than look, and in particular at or near room temperature. A three terminal resonant-tunneling composite structure is further disclosed.
摘要:
A two state memory cell includes a bipolar transistor (11) and a tunnel diode (16) shunted across the base-collector junction thereof. A constant operating current is established through the transistor (11) and the tunnel diode (16). The voltage across the tunnel diode (16) may thus be maintained at one of two stable levels, while the bipolar transistor (11) is kept on regardless of the tunnel diode voltage, which determines the ZERO or ONE state of the cell. Since the transistor (11) is not switched on and off when the memory state (corresponding to the two tunnel diode voltage levels) changes, memory cell switching speed is not degraded by transistor switching delay. Moreover, since the current in the tunnel diode (16) is maintained constant, preferably at a value midway between the tunnel diode peak and valley currents, the noise margin of the memory cell is enhanced and the possibility of false switching reduced. The tunnel diode/bipolar transistor combination may be formed on a semiconductor substrate as an integrated structure, thereby providing a high density memory cell.
摘要:
[0042] An SBAM memory device having improved stability including two series connected devices, at least one of the devices being a chalcogenide device exhibiting differential negative resistance characteristics. One of the two devices serves as the load of the other. A switch is provided to bias a middle input node and switch the memory device between two logic states.
摘要:
A static RAM memory cell (30) uses cross-coupled enhancement mode, N-channel MOS drive transistors (36) to form a bistable flip-flop. A load circuit (34) couples between I/O ports (40) of the drive transistors (36) and Vcc. For each drive transistor (36), the load circuit includes a depletion mode, N-channel MOS load transistor (54) and a forward biased tunnel diode (32). The drain and gate of the load transistor (54) couple across the anode and cathode of the tunnel diode (32) so that the forward voltage (Vf) of the tunnel diode (32) controls the Vgs transfer curve (56) of the load transistor.
摘要:
A memory cell comprises at least three conducting layers (20) spaced with insulating layers (10), a first voltage application means (24) for applying a predetermined voltage between first and third conducting layers (20a, 20c) of the at least three conducting layers, no tunnelling current flowing directly between the first and third conducting layers, and a second voltage application means (5) connected to a second conducting layer (20b) of at least three conducting layers, a tunnelling current being able to flow between the first and second conducting layers and between the second and third conducting layers. Within these conducting layers (20), quantum-mechanical confinement of free electrons has been made. This provides a storage method of a static memory using a quantum device and a structure therefor. A memory cell according to the present invention has a structure simpler than static memories being presently used. Also, an area that this structure is substantially equal to the cell area of a DRAM. Further, since the circuit is complementary, a standby current can greatly be reduced.