公开(公告)号：EP2288481A1

公开(公告)日：2011-03-02

申请号：EP09757323.2

申请日：2009-06-05

申请人： Gebr. Schmid GmbH + Co.

发明人： HUBER, Reinhard

IPC分类号： B28D5/00 ,  C09J11/00

CPC分类号： B28D5/0082 ,  C09J5/06 ,  C09J9/02 ,  C09J2205/302 ,  C09J2400/143 ,  Y10T156/10 ,  Y10T428/24 ,  Y10T428/2419

摘要： In order to fasten a silicon block (13) on a support (16) for improved further handling, fibre material (22) which is impregnated with adhesive (23) and consists of glass fibres is introduced into an adhesive join (20) between the silicon block and the support. The silicon block (13) is then positioned on the support (16). The fibre material (22) means that the adhesive join (20) is not pressed together too far and is more stable.

公开(公告)号：EP2277203A1

公开(公告)日：2011-01-26

申请号：EP09733502.0

申请日：2009-04-09

申请人： Gebr. Schmid GmbH + Co.

发明人： HABERMANN, Dirk

IPC分类号： H01L31/0216 ,  H01L31/0224 ,  H01L31/068 ,  H01L21/225

CPC分类号： H01L31/1804 ,  H01L21/2255 ,  H01L31/022425 ,  H01L31/068 ,  Y02E10/547 ,  Y02P70/521

摘要： A method for the selective doping of silicon of a silicon substrate (1) for producing a pn-junction in the silicon is characterized by the following steps: a) Providing the surface of the silicon substrate (1) with a doping agent (2) based on phosphorous, b) heating the silicon substrate (1) for creating a phosphorous silicate glass (2) on the surface of the silicon, wherein phosphorous diffuses into the silicon as a first doping (3), c) applying a mask (4) on the phosphorous silicate glass (2), covering the regions (5) that are later highly doped, d) removing the phosphorous silicate glass (2) in the non-masked regions, e) removing the mask (4) from the phosphorous silicate glass (2), f) again heating for the further diffusion of phosphorous from the phosphorous silicate glass (2) into the silicon as a second doping for creating the highly doped regions (5), g) complete removal of the phosphorous silicate glass (2) from the silicon.

公开(公告)号：EP2229265A1

公开(公告)日：2010-09-22

申请号：EP08858959.3

申请日：2008-12-11

申请人： Gebr. Schmid GmbH & Co.

发明人： HUBER, Reinhard

IPC分类号： B28D5/00 ,  B65G59/04

CPC分类号： B28D5/0094 ,  B65G59/045 ,  H01L21/67706 ,  H01L21/67748 ,  H01L21/6776 ,  H01L21/67778 ,  H01L21/6838

摘要： In a method of separating wafers (12) from a vertical wafer stack (16), the wafers (12) are transported away individually from above via movement means (23) which act from above. The movement means (23) are designed as circulating belts (24), with a suction surface (25) against which the uppermost wafer (12) is made to abut, wherein the abutment of the wafer (12) against the suction surface (25) is enhanced by negative pressure or suction. In order to separate a plurality of wafers (12) located one upon the other, the movement means (23) are subjected to at least one of the following two steps: a) water (30) is jetted with force against the leading edge of the uppermost wafer (12), the water being directed obliquely from beneath the latter b) the movement means (23) guide the wafer (12) over a stripping device (32) which butts against the underside of the moving wafer (12) from beneath and both forces the wafer (12) against the suction surface (25) and generates a braking action thereon. Thereafter, the wafer (12) is moved on to a transporting path (35, 37) in order to be transported on for further processing.

公开(公告)号：EP1442155B1

公开(公告)日：2009-12-09

申请号：EP02774761.7

申请日：2002-10-31

申请人： Gebr. Schmid GmbH & Co.

发明人： FAUSER, Heidi ,  ZIELONKA, Andreas ,  SCHMID, Christian ,  ROGOLL, Volker ,  FREUDENBERGER, Renate

IPC分类号： C23F1/00 ,  C25F3/02 ,  H05K3/07

CPC分类号： C25F3/02 ,  H05K3/06 ,  H05K3/07 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemical etching. As a result, anisotropic removal of the metal is possible and structures which are deeper than the width thereof are obtained.

公开(公告)号：EP1623056B1

公开(公告)日：2009-07-15

申请号：EP04732981.8

申请日：2004-05-14

申请人： Gebr. Schmid GmbH & Co.

发明人： SCHMID, Christian

IPC分类号： C25D5/20

CPC分类号： C25D21/04 ,  C25D5/20 ,  C25D7/0621 ,  C25D7/123 ,  C25D17/001 ,  H05K3/0085 ,  H05K3/187 ,  H05K2203/0285 ,  H05K2203/1509

摘要： The invention relates to a method and a device (11, 111) for coating, for example, printed circuit boards (17, 117), using a coating bath (13, 113). Said coating bath (13) contains sound sources (21) which generate ultrasound towards the surface of the printed circuit board (17) in such a way that gas bubbles are driven out of the treatment liquid of the coating bath (13), improving the coating of the printed circuit board (17).

公开(公告)号：EP1623057B1

公开(公告)日：2008-10-15

申请号：EP04732978.4

申请日：2004-05-14

申请人： Gebr. Schmid GmbH & Co.

发明人： SCHMID, Christian

IPC分类号： C25D17/00

CPC分类号： C25D17/00 ,  C25D7/0621 ,  C25D17/005 ,  H05K3/241

摘要： The invention relates to a plating device equipped with a contact roller (11) that is provided with contact elements (20), said device being used to create electric contacts on a printed circuit board (13). The contact roller (11) comprises a roller body (17) consisting of a soft material. Contact elements (20) comprising outward-facing flat contact surfaces (21) are located on the exterior face of said body. As the contact roller rotates (11) with a certain pressure on the printed circuit board (13), the entire contact surface (21) of the respective contact elements (20) makes contact with the printed circuit board (13).

公开(公告)号：EP1960119A1

公开(公告)日：2008-08-27

申请号：EP06840992.9

申请日：2006-12-15

申请人： Gebr. Schmid GmbH + Co.

发明人： KAPPLER, Heinz

IPC分类号： B05C1/02 ,  B05C1/08 ,  B05C1/10 ,  H05K3/00 ,  B05C1/16 ,  B05C13/02

CPC分类号： B05C1/025 ,  B05C1/027 ,  B05C1/0808 ,  B05C1/0813 ,  B05C1/10 ,  B05C1/165 ,  B05C13/02 ,  H01L21/6715 ,  H01L21/67706 ,  H01L21/6776 ,  H05K3/0085 ,  H05K2203/0143 ,  H05K2203/1509

摘要： The invention relates to a device (1, 1') for treating the surfaces of silicon wafers (2), comprising transport rollers (3) for transporting the silicon wafers (2) on a transport plane (5) which is determined by the transport rollers (3), and at least one conveyor device (3a) which wets the silicon wafer (2) with an aqueous process medium (10). The conveyor device (3a) is arranged in such a manner below the transport plane (5) that it touches the transport plane for wetting the substrate surface, which is oriented in the downward direction, with a process medium (10). Said conveyor device is in direct contact with the substrate surface.

公开(公告)号：EP1913179A1

公开(公告)日：2008-04-23

申请号：EP06776724.4

申请日：2006-08-09

申请人： Gebr. Schmid GmbH + Co.

发明人： SCHMID, Christian

IPC分类号： C25D17/00 ,  C25D17/08 ,  C25D7/06

CPC分类号： C25D7/0621 ,  C25D17/00 ,  C25D17/001 ,  C25D17/005 ,  C25D17/08 ,  H05K3/241

摘要： In order to treat solar cells (26) in an electroplating device (30), they can be inserted into a grid-like or tray-like picking-up device (11). They are thus mechanically held and electrical contact is made with them via contacts (24). Instead of individual solar cells (26), the picking-up devices (11) are moved with a large number of inserted solar cells through the electroplating device (30) for treatment. Electrical contact is in this case made with the solar cells (26) by means of the contacts (24) and the frame limbs (12, 14) on a projecting angle section (16) together with edge strips (17) of the pick-up. Contact rollers (42) rest on the edge strips and are connected to an electrical power source (44).

公开(公告)号：EP1623057A2

公开(公告)日：2006-02-08

申请号：EP04732978.4

申请日：2004-05-14

申请人： Gebr. Schmid GmbH & Co.

发明人： SCHMID, Christian

IPC分类号： C25D17/00

CPC分类号： C25D17/00 ,  C25D7/0621 ,  C25D17/005 ,  H05K3/241

摘要： The invention relates to a plating device equipped with a contact roller (11) that is provided with contact elements (20), said device being used to create electric contacts on a printed circuit board (13). The contact roller (11) comprises a roller body (17) consisting of a soft material. Contact elements (20) comprising outward-facing flat contact surfaces (21) are located on the exterior face of said body. As the contact roller rotates (11) with a certain pressure on the printed circuit board (13), the entire contact surface (21) of the respective contact elements (20) makes contact with the printed circuit board (13).

公开(公告)号：EP1442646A1

公开(公告)日：2004-08-04

申请号：EP02802632.6

申请日：2002-10-26

申请人： Gebr. Schmid GmbH & Co.

发明人： KAPPLER, Heinz

IPC分类号： H05K13/00

CPC分类号： H05K13/0061

摘要： A transport system for circuit boards (12) in treatment devices (11) is disclosed, which runs the circuit boards (12) between pairs of rollers (20, 21). The pairs of rollers are arranged in roller tracks (17, 18), running parallel to the edge of the circuit board (12) in a narrowly defined boundary region (16). The rollers are arranged with the axes (22) and shafts (23) thereof arranged at an angle (α) relative to the transport direction (14) or the perpendicular (35) thereof, such as to exert a tensile force on the circuit boards in the transverse direction thereof and thus stiffening the same. A transport through the treatment devices, for example galvanisation, etching, cleaning etc, without contact with the useful region (15) of the circuit board (12) is thus possible.