公开(公告)号：EP3349556A3

公开(公告)日：2018-07-25

申请号：EP18151124.7

申请日：2018-01-11

申请人： Hewlett Packard Enterprise Development LP

发明人： NORTON, John ,  LEIGH, Kevin ,  LIEBER, Peter

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2321/0251 ,  G02B6/4268 ,  H05K1/181 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20209 ,  H05K7/20727 ,  H05K2201/10121

摘要： An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.

公开(公告)号：EP3349556A2

公开(公告)日：2018-07-18

申请号：EP18151124.7

申请日：2018-01-11

申请人： Hewlett Packard Enterprise Development LP

发明人： NORTON, John ,  LEIGH, Kevin ,  LIEBER, Peter

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2321/0251 ,  G02B6/4268 ,  H05K1/181 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20209 ,  H05K7/20727 ,  H05K2201/10121

摘要： An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.

公开(公告)号：EP3325161A1

公开(公告)日：2018-05-30

申请号：EP16753501.2

申请日：2016-07-22

申请人： Cepheid

发明人： FROMM, David ,  PHAN, Tien ,  PICCINI, Matthew

IPC分类号： B01L7/00

CPC分类号： F25B21/04 ,  B01L7/52 ,  B01L2200/025 ,  B01L2300/1822 ,  F25B2321/0212 ,  F25B2321/0251

摘要： Thermal control devices adapted to provide improved control and efficiency in temperature cycling are provided herein. Such thermal control device can include a thermoelectric cooler controlled in coordination with another thermal manipulation device to control an opposing face of the thermoelectric cooler and/or a microenvironment. Some such thermal control devices include a first and second thermoelectric cooler separated by a thermal capacitor. The thermal control devices can be configured in a planar configuration with a means for thermally coupling with a planar reaction vessel of a sample analyzer for use in thermal cycling in a polymerase chain reaction of the fluid sample in the reaction vessel. Methods of thermal cycling using such a thermal control devices are also provided.

公开(公告)号：EP2737266B1

公开(公告)日：2018-03-28

申请号：EP12817503.1

申请日：2012-07-25

申请人： Coway Co., Ltd.

发明人： LEE, Young-Jae ,  MO, Byung-Sun ,  SON, Joung-Ho

IPC分类号： F25B21/02 ,  G05F1/565 ,  F25B21/04

CPC分类号： F25B21/04 ,  F25B2321/0212 ,  F25D2700/16

摘要： An electronic temperature control apparatus a cooler using the same, a heater using the same, and a control method thereof are provided. The electronic temperature control apparatus includes: a thermoelectric module including a first metal member having one end in contact with an object and a second metal member having one end joined with the other end of the first metal member, a voltage applied to one end of the first metal member and the other end of the second metal member; a voltage supply unit supplying a first voltage or a variable voltage having a range from a second voltage to a third voltage to the thermoelectric module; and a controller controlling a voltage supplied to the thermoelectric module by the voltage supply unit according to a difference between a temperature of the object or the first metal member and a target temperature.

公开(公告)号：EP3146277A4

公开(公告)日：2017-05-31

申请号：EP14892506

申请日：2014-05-23

申请人： LAIRD DURHAM INC

发明人： CROCCO PAUL ,  MAHADEVAN RAMASWAMY ,  DEANE PHILIP A

IPC分类号： F25B21/02

CPC分类号： F25B21/02 ,  B01L7/52 ,  B01L2300/1827 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2400/01

摘要： A thermoelectric heating/cooling device may include first and second thermally conductive headers. A plurality of thermoelectric elements thermally may be coupled in parallel between the first and second thermally conductive headers. In addition, a resistive heating element may be provided on the second header, and the second header may be between the resistive heating element and the plurality of thermoelectric elements.

摘要翻译： 热电加热/冷却装置可以包括第一和第二导热集管。 多个热电元件可以热并联在第一和第二导热集管之间。 另外，电阻加热元件可以设置在第二集管上，并且第二集管可以在电阻加热元件和多个热电元件之间。

公开(公告)号：EP2847524B1

公开(公告)日：2016-11-02

申请号：EP13724982.7

申请日：2013-05-07

申请人： Phononic Devices, Inc.

发明人： EDWARDS, Jesse, W. ,  THERRIEN, Robert, Joseph ,  JUNE, M., Sean ,  YADAV, Abhishek ,  SUMMERS, III, James, Barton

IPC分类号： F25B21/02

CPC分类号： F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2700/2104 ,  Y02B30/66

摘要： Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

公开(公告)号：EP3065583A1

公开(公告)日：2016-09-14

申请号：EP14861324.3

申请日：2014-11-09

申请人： Icetron Technologies Ltd.

发明人： KARMONA, Roee ,  TETRO, Liran ,  BEN AMRAM, Haim

IPC分类号： A41D13/005 ,  F25B21/02

CPC分类号： A61F7/007 ,  A41D13/005 ,  A61F7/02 ,  A61F2007/0034 ,  A61F2007/0075 ,  A61F2007/0078 ,  A61F2007/0086 ,  A61F2007/0096 ,  F25B21/02 ,  F25B2321/0212

摘要： A body temperature control apparatus comprising: a container comprising a heat absorbent substance; a heat sink in communication with the container; a thermal isolation element connected with the container; a plate supported on thermal isolation element and designed to contact the human skin; a thermoelectric module connected with the heat sink and with the plate; a temperature sensor connected with the plate; and a controller configured to electrically control the thermoelectric module and the temperature sensor.

公开(公告)号：EP2722252B1

公开(公告)日：2015-11-18

申请号：EP13187488.5

申请日：2013-10-07

申请人： Valeo Schalter und Sensoren GmbH

发明人： Poslowsky, Georg ,  Raber, Ingo

IPC分类号： B62D1/06 ,  H05B3/50

CPC分类号： B62D1/065 ,  F25B2321/0212 ,  H05B1/0236

公开(公告)号：EP2102564B1

公开(公告)日：2015-09-02

申请号：EP08713716.2

申请日：2008-01-10

申请人： Gentherm Incorporated

发明人： PETROVSKI, Dusko

IPC分类号： F25B21/02 ,  H01L35/32 ,  B60N2/56

CPC分类号： H01L35/32 ,  B60N2/5628 ,  F25B2321/0212

公开(公告)号：EP2910921A1

公开(公告)日：2015-08-26

申请号：EP15154652.0

申请日：2015-02-11

申请人： Anton Paar ProveTec GmbH

发明人： Kindt, Carsten ,  Eilers, Helmut

IPC分类号： G01N1/40 ,  B01L7/00 ,  F25B21/02 ,  F25B21/04 ,  G01N1/42 ,  G01N1/44 ,  H01L35/32 ,  G01N3/54 ,  G01N11/00 ,  G01N35/00 ,  G01N25/14

CPC分类号： G01N1/4022 ,  B01L7/52 ,  B01L2300/0832 ,  B01L2300/1822 ,  F25B21/04 ,  F25B2321/0212 ,  F25B2400/24 ,  G01N1/42 ,  G01N1/44 ,  G01N3/54 ,  G01N11/00 ,  G01N25/145 ,  G01N33/2811 ,  G01N2011/002 ,  G01N2035/00366 ,  G01N2035/00376 ,  G01N2035/00425 ,  G01N2035/00445 ,  G01N2203/0226 ,  G01N2203/0228

摘要： Die Erfindung betrifft ein Verfahren zur Einstellung der Temperatur in einem zur Aufnahme einer Probe ausgerüsteten Temperierbehälter (2) unter Einsatz zumindest eines unter Sicherstellung eines Wärmeübergangskontaktes an der Außenwandfläche des Behälters (2) angebrachten Peltier-Elementes (3).
Erfindungsgemäß ist unter anderem vorgesehen,
- dass an der dem Behälter (2) abgewandten Fläche des Peltier-Elementes (3) unter Sicherstellung eines Wärmeübergangskontaktes ein Speicherblock (4) aus metallischem Material angebracht wird,
- dass an der dem Peltier-Element (3) abgewandten Rückfläche des Speicherblockes (4) ein weiteres Peltier-Element (4) oder eine Peltier-Element-Kaskade unter Sicherstellung eines Wärmeübergangskontaktes angebracht wird,
- dass zur Veränderung des Temperaturniveaus des Behälters (2) auf eine angestrebte Zieltemperatur hin oder in Richtung dieser Zieltemperatur der Speicherblock (4) mit dem weiteren Peltier-Element (5) oder der Peltier-Element-Kaskade in Richtung dieser Zieltemperatur hin oder darüber hinaus erwärmt oder abgekühlt wird.

摘要翻译： 本发明涉及一种方法，用于调节配备用于通过使用至少一个的接收样品回火箱（2），同时确保对（2）安装在所述珀耳帖元件（3）在所述容器的外壁表面的传热接触在烧瓶中的温度。 本发明提供了特别是通过： - （2）从珀耳帖元件背向所述容器（3），同时确保传热接触，一个存储块（4）的金属材料被放置在该表面上， - ，在珀耳帖元件（3） 背面从存储块（4）的背离，另一珀耳帖元件（4）或珀耳帖元件级联被同时确保传热接触，施加 - 在所述容器（2）的温度，所述变化到所希望的目标温度朝向或在该目标温度的方向 加热该存储块（4）到另一珀耳帖元件（5）或在该目标温度的方向上的珀耳帖元件的级联或也或冷却。