公开(公告)号：EP2221396A1

公开(公告)日：2010-08-25

申请号：EP09155456.8

申请日：2009-03-18

申请人： Rohm and Haas Electronic Materials LLC

发明人： Luo, Yu ,  Brown, Neil D. ,  Toben, Michael P.

IPC分类号： C23C18/54 ,  C25D3/32

CPC分类号： C23C18/54 ,  C25D3/60

摘要： Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

摘要翻译： 公开了用于在基材上沉积锡合金的电解质组合物。 电解质组合物包括锡离子，一种或多种合金金属的离子，黄酮化合物和二羟基双硫化物。 电解质组合物不含铅和氰化物。 还公开了在基板上沉积锡合金的方法以及在半导体器件上形成互连凸点的方法。

公开(公告)号：EP2141261A3

公开(公告)日：2010-07-28

申请号：EP09155197.8

申请日：2009-03-16

申请人： Rohm and Haas Electronic Materials LLC

发明人： Imanari, Masaaki ,  Ting, Fai Lung ,  Shimazu, Motoya ,  Ohta, Yasuo

IPC分类号： C23C18/54 ,  C25D3/32

CPC分类号： C25D3/30 ,  C25D7/12 ,  C25D17/16

摘要： A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method.

摘要翻译： 本发明提供不使用络合剂，并且在进行电镀锡时提供良好的焊料润湿性和非常低的偶联率的电镀液和电镀方法，并且特别是当使用滚镀方法进行电解锡电镀时。

公开(公告)号：EP2199315A1

公开(公告)日：2010-06-23

申请号：EP08172330.6

申请日：2008-12-19

申请人： BASF SE

发明人： Röger Cornelia Dr. ,  Raether Roman Benedikt Dr. ,  Ebert Sophia Dr. ,  Emnet Charlotte Dr. ,  Haag Alexandra Dr. ,  mayer Dieter Dr.

IPC分类号： C08G73/02 ,  C08L79/02 ,  C25D3/02 ,  C25D3/38 ,  H05K3/42 ,  C25D3/32 ,  C25D3/58

CPC分类号： C08G73/024 ,  C08L79/02 ,  C25D3/02 ,  C25D3/38 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

摘要： A composition comprising a source of metal ions and at least one leveling agent obtainable by
condensing at least one trialkanolamine of the general formula N(R 1 -OH) 3 (Ia) and/or at least one dialkanolamine of the general formula R 2 -N(R 1 -OH) 2 (Ib) to give a polyalkanolamine(II),
wherein
- the R 1 radicals are each independently selected from a divalent, linear or branched aliphatic hydrocarbon radical having from 2 to 6 carbon atoms, and
- the R 2 radicals are each selected from hydrogen and linear or branched aliphatic, cycloaliphatic and aromatic hydrocarbon radicals having from 1 to 30 carbon atoms,

or derivatives obtainable by alkoxylation, substitution or alkoxylation and substitution of said polyalkanolamine(II).

摘要翻译： 包含金属离子源和至少一种流平剂的组合物，所述流平剂可通过缩合至少一种通式N（R 1 -OH）3（Ia）的三链烷醇胺和/或至少一种通式R 2 -N（ R1-OH）2（Ib）反应，得到聚链烷醇胺（II），其中-R1基团各自独立地选自具有2至6个碳原子的二价，直链或支链脂族烃基，并且-R2基团各自 选自具有1至30个碳原子的氢和直链或支链脂族，脂环族和芳族烃基，或可通过所述聚链烷醇胺（II）的烷氧基​​化，取代或烷氧基化和取代获得的衍生物。

公开(公告)号：EP1978134A1

公开(公告)日：2008-10-08

申请号：EP08251284.9

申请日：2008-04-02

申请人： Rohm and Haas Electronic Materials LLC

发明人： Reddington, Erik ,  Desmaison, Gonzalo Urrutia ,  Niazimbetova, Zuhkra I. ,  Cleary, Donald E. ,  Lefebvre, Mark

IPC分类号： C25D3/02 ,  C25D3/32 ,  C25D3/38 ,  C25D3/60 ,  H05K3/18

CPC分类号： C25D7/123 ,  C25D3/38 ,  H05K3/423

摘要： Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

摘要翻译： 公开了用于在衬底上镀金属的金属镀敷组合物。 金属电镀组合物包括影响金属电镀组合物的流平性和投掷性能的化合物。 还公开了在基底上沉积金属的方法。

公开(公告)号：EP1432848A4

公开(公告)日：2007-11-14

申请号：EP02759235

申请日：2002-08-01

申请人： MACDERMID INC

发明人： CROTTY DAVID

IPC分类号： C25D3/32 ,  C25D3/60

CPC分类号： C25D3/32 ,  C25D3/60

摘要： A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is particularly suited to high speed reel to reel or strip steel plating.

公开(公告)号：EP1819848A1

公开(公告)日：2007-08-22

申请号：EP05823346.1

申请日：2005-11-15

申请人： Technic, Incorporated

发明人： HRADIL, George ,  STAVITSKY, Robert ,  SCHETTY, Robert, A., III

IPC分类号： C25D3/32 ,  C25D3/60

CPC分类号： C25D3/60 ,  C25D3/32

摘要： The present invention relates to a solution for use in connection with the deposition of tin or tin alloys on platable portions of substrates. This solution comprises water; tin ions in an amount sufficient to provide a tin deposit on platable portions of substrates; a complexing agent of an acid or salt thereof that is stable at a pH of above 5.5 and below 10 present in an amount sufficient to render the metal ion soluble in the solution; and a surfactant of an alkoxylated polyalcohol present in an amount sufficient to complex the metal and render it soluble in the solution to facilitate deposition of tin upon the platable portions of the substrates.

公开(公告)号：EP1520064B1

公开(公告)日：2006-08-23

申请号：EP03732736.8

申请日：2003-06-20

申请人： DANA CORPORATION

发明人： JOHAL, Charan, P. S., DANA Glacier Vandervell Bgs. ,  CAREY, John, DANA Glacier Vandervell Bearings

IPC分类号： C25D7/10 ,  C25D3/32 ,  C25D5/12

CPC分类号： C25D7/10 ,  C25D3/32 ,  Y10S384/912 ,  Y10T29/49636

摘要： A plain bearing and method for making the plain bearing are described, the plain bearing having an overlay alloy layer at a sliding surface of the plain bearing, the plain bearing comprising a layer of a strong backing material, a layer of a first bearing alloy bonded to the strong backing material and a layer of a second bearing material comprising said overlay material bonded to said first bearing alloy layer wherein said second bearing material comprises tin having included in the matrix thereof an organic levelling agent.

公开(公告)号：EP1167582A1

公开(公告)日：2002-01-02

申请号：EP01305682.5

申请日：2001-06-29

申请人： Shipley Company LLC

发明人： Egli, Andre ,  Vinckier, Anja ,  Heber, Jochen ,  Zhang, Wan

IPC分类号： C25D3/32 ,  C25D3/60

CPC分类号： C25D3/30 ,  C25D3/32 ,  C25D3/60 ,  C25D7/12 ,  H05K3/244 ,  Y10S428/935 ,  Y10T428/12493 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/24917 ,  Y10T428/31678

摘要： The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having π electrons that can be delocalized, e.g., an α,β unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

摘要翻译： 本发明尤其提供了电镀组合物，组合物和由组合物形成的产品的使用方法。 本发明的电镀组合物的特征在于重要部分是晶粒细化剂/稳定剂添加剂，其包含一种或多种具有可以离域的π电子的非芳族化合物，例如α，β不饱和体系或其它含有邻近电子的共轭体系 牵制组。 本发明的组合物提供增强的晶粒细化和增加金属电镀溶液的稳定性，特别是在锡和锡合金电镀配方中。

公开(公告)号：EP0857226B1

公开(公告)日：2001-12-19

申请号：EP96934999.2

申请日：1996-10-15

申请人： MACDERMID INCORPORATED

发明人： O'DRISCOLL, Cavan Hugh, 61 East View Barlby Road

IPC分类号： C25D3/32

CPC分类号： C25D3/32

摘要： There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: an unsubstituted or substituted para alkylbenzene sulphonic acid (component a), one or more acids capable of giving good plating at low current density (component b), one or more addition agents, a tin source, water. There are also described methods of tin plating by the compositions of the invention.

公开(公告)号：EP1138805A2

公开(公告)日：2001-10-04

申请号：EP01302990.5

申请日：2001-03-29

申请人： Shipley Company LLC

发明人： Brown, Neil D. ,  Federman, George A. ,  Chirafisi, Angelo B. ,  Lai, Gregory

IPC分类号： C25D3/32

CPC分类号： C25D3/60 ,  C25D3/32

摘要： Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.

摘要翻译： 公开了用于以各种电流密度沉积锡或锡合金的电解质组合物。 还公开了在诸如钢的高速镀锡的基底上电镀这种锡或锡合金的方法。