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161.发明公开
公开(公告)号：EP1099782A1
公开(公告)日：2001-05-16
申请号：EP00403078.9
申请日：2000-11-07
申请人： USINOR
发明人： Fritzinger, Bernard , Sardoy, Marc
CPC分类号： C25D21/14
摘要： L'installation comprend :
une cellule d'électrolyse (1") dotée d'une anode soluble (2") et d'une cathode insoluble (3") sans membrane interposée,
des moyens pour introduire et prélever du bain dans la cellule,
des moyens pour maintenir un gradient de densité de bain dans ladite cellule adapté pour que, si D1 est la densité du bain au voisinage de la cathode et si D2 est la densité du bain au voisinage de l'anode, (D2 - D1) ≥ 100 g/l.
Procédé associé.
Grâce à la séparation densitométrique, le métal dissous ne se redépose pas sur la cathode et le rendement global de dissolution est amélioré.摘要翻译： 电解金属溶解装置具有具有贱金属的可溶性阳极和不溶性阴极的电解池。 电极不被膜分离，并且至少部分地浸入电解质中以由贱金属的离子富集。 阳极附近的电解质密度超过阴极附近的密度≥100g/ l。 包括用于使用上述装置生产金属溶液的独立权利要求。优选特征：密度梯度通过≥15℃的温度梯度保持，阴极区域更热。 阳极由金属颗粒制成。 电解质基于磺酸盐，硫酸，卤素基化合物，氟硅酸盐或氟硼酸盐。
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162.发明授权
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公开(公告)号：EP0859876B1
公开(公告)日：2000-01-05
申请号：EP96935001.6
申请日：1996-10-15
IPC分类号： C25D3/32
CPC分类号： C25D3/32
摘要： There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: a) one or more acids selected from sulphuric acid, sulphamic acid, aryl sulphonic acids, alkyl sulphonic acids and alkanol sulphonic acids, b) one or more addition agents comprising a mono-, di- or tri-substituted phenol (each optionally alkyoxylated) or a mixture of two or more such compounds, in which at least one of the substituents includes a secondary, tertiary or quaternary nitrogen atom, c) a tin source and d) water. There is also disclosed a method of tin plating using the composition of this invention.
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公开(公告)号：EP0825281A1
公开(公告)日：1998-02-25
申请号：EP97306123.7
申请日：1997-08-12
发明人： Zhang, Yun
摘要： A process for plating tin or tin alloy onto metal substrates is described. In the process, a metal substrate is placed in an electroplating bath that contains a stannous sulfate and an organic compound additive in which the organic compound has a heterocyclic moiety in an aqueous solution of sulfonic acid. The bath is then subjected to pulse plating conditions that plate a layer of tin or tin alloy onto the metal substrate wherein the tin in the tin layer has a grain size of about 2 µm to about 8 µm. During pulse plating, a current density of about 65 ASF to about 250 ASF is applied to the electroplating bath in a pulsed manner, i.e. the current is cycled on and off during plating. The duty cycle of the pulse is about twenty-five percent to about thirty percent. The duration of the on pulse during the cycle is about 50 µs to about 500 µs.
摘要翻译： 描述了将锡或锡合金电镀到金属基底上的工艺。 在该方法中，将金属基底放置在含有硫酸亚锡和有机化合物添加剂的电镀浴中，其中有机化合物在磺酸水溶液中具有杂环部分。 然后对该浴进行脉冲电镀条件，其将锡或锡合金层铺在金属基底上，其中锡层中的锡具有约2μm至约8μm的晶粒尺寸。 在脉冲电镀过程中，脉冲方式将电流密度约为65 ASF至约250 ASF施加到电镀槽，即在电镀期间电流循环开启和关闭。 脉搏的占空比约为百分之二十五至百分之三十。 循环期间的通脉冲持续时间约为50μs至约500μs。
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165.发明授权Tin, lead or tin/lead alloy electrolytes for high speed electroplating 失效锡，铅和锡 - 铅合金的电解质为Elekroplattieren高速。
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公开(公告)号：EP0490575A3
公开(公告)日：1992-11-25
申请号：EP91311302.3
申请日：1991-12-04
IPC分类号： C25D3/32
CPC分类号： C25D3/32
摘要： A composition suitable for use in a process for electroplating surfaces with tin, which comprises
(a) an alkane sulphonic acid, (b) an aryl sulphonic acid, (c) an additive,
and (d) a tin source. A composition suitable for use in a process for electroplating surfaces with tin, which comprises
(a) an alkane sulphonic acid (b) a tin source,
and (c) a reaction product of a sulphonating agent with Bisphenol A.-
公开(公告)号：EP0490575A2
公开(公告)日：1992-06-17
申请号：EP91311302.3
申请日：1991-12-04
IPC分类号： C25D3/32
CPC分类号： C25D3/32
摘要： A composition suitable for use in a process for electroplating surfaces with tin, which comprises
(a) an alkane sulphonic acid,
(b) an aryl sulphonic acid,
(c) an additive,
and
(d) a tin source.
A composition suitable for use in a process for electroplating surfaces with tin, which comprises
(a) an alkane sulphonic acid
(b) a tin source,
and
(c) a reaction product of a sulphonating agent with Bisphenol A.摘要翻译： 一种适合用于用锡电镀表面的方法中的组合物，其包含（a）烷烃磺酸，（b）芳基磺酸，（c）添加剂和（d）锡源。 一种适合用于用锡电镀表面的方法的组合物，其包含（a）烷烃磺酸（b）锡源，和（c）磺化剂与双酚A.e的反应产物
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168.发明公开Plating bath and method for electroplating tin and/or lead 失效Plattierungsbad und Verfahren zum Elektroplattieren von Zinn und / oder Blei。
公开(公告)号：EP0196232A2
公开(公告)日：1986-10-01
申请号：EP86302269.5
申请日：1986-03-26
申请人： MCGEAN-ROHCO, INC.
CPC分类号： C25D3/60 , C25D3/32 , C25D3/36 , H05K3/3473
摘要： A tin and/or lead electroplating bath is free from fluoride or fluoborate ions and comprises
(A) a bath-soluble metal salt which is a stannous salt, a lead salt, or a mixture of stannous and lead salts;
(B) an alkane sulphonic acid or alkanol sulphonic acid;
(C) a nonionic, cationic or amphoteric surfactant;
(D) a primary brightening agent which is an aromatic aldehyde, an acetophenone or a carbonyl compound of the formula:
in which Ar is a substituted or unsubstituted phenyl, naphthyl, pyridyl, thiophenyl or furyl group; and
(E) a secondary brightening agent which is a lower aliphatic aldehyde or a substituted olefin of the formula:
in which R, is a carboxy, carboxamide, alkali metal car boxylate, ammonium carboxylate, amine carboxylate or allyl carboxylate group; and R 2 , R 3 and R 4 are each independently hydrogen or lower alkyl groups.摘要翻译： 锡和/或铅电镀浴不含氟化物或氟硼酸根离子，包括：（A）金属盐，铅盐或亚锡和铅盐的混合物的浴溶性金属盐;（B） 烷基磺酸或链烷醇磺酸;（C）非离子，阳离子或两性表面活性剂;（D）作为芳族醛的主增亮剂，下式的苯乙酮或羰基化合物：Ar-CH = CH-CO-CH 3（III）其中Ar是取代或未取代的苯基，萘基，吡啶基，噻吩基或呋喃基; 和（E）二级增白剂，其为低级脂族醛或下式的取代烯烃：其中R 1为羧基，羧酰胺，碱金属羧酸盐，羧酸铵，胺羧酸盐或烯丙基羧酸盐基团 ; 并且R 2，R 3和R 4各自独立地为氢或低级烷基。
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