Abstract:
A method of testing a probe card (156) includes the step of positioning the probe card (156) in a prober (152) over a verification wafer (501) that is placed on a stage (159). The probe card (156) is brought in contact with a contact region (503) on the verification wafer (501). The verification wafer (501) includes a shorting plane (502) surrounding the contact region (503). A test signal is sent through the verification wafer (501) to the probe card (156). A response signal from the probe card (156) is received and analyzed.