公开(公告)号：EP1869479A4

公开(公告)日：2012-06-27

申请号：EP06738613

申请日：2006-03-16

Applicant: FORMFACTOR INC

Inventor： MILLER CHARLES A ,  BARBARA BRUCE J

IPC: G01R31/36 ,  G01R31/02 ,  G01R31/26

CPC classification number: G01R1/36 ,  G01R31/2889

公开(公告)号：EP1807868A4

公开(公告)日：2008-07-16

申请号：EP05800083

申请日：2005-09-26

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MILLER CHARLES A ,  BARBARA BRUCE J ,  VASQUEZ BARBARA

IPC: H01L23/02 ,  H01L21/44 ,  H01L23/34 ,  H01L23/52

CPC classification number: H01L24/48 ,  H01L23/13 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85186 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Semiconductor dies (101/104/106) are stacked offset from one another so that terminals (122/124/126) located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections (130/132/134) may connect terminals on one die with terminals on another die and the stack may be disposed on a wiring substrate (112) to which the terminals of the dies may be electrically connected.