公开(公告)号：EP2856228A4

公开(公告)日：2016-02-17

申请号：EP12877339

申请日：2012-05-24

申请人： HEWLETT PACKARD DEVELOPMENT CO

发明人： PANOTOPOULOS GEORGIOS ,  TAN MICHAEL RENNE TY ,  ROSENBERG PAUL KESSLER ,  SORIN WAYNE VICTOR ,  MATHAI SAGI VARGHESE ,  PATRA SUSANT K

IPC分类号： G02B6/38

CPC分类号： G02B6/293 ,  G02B6/2817 ,  G02B6/29311 ,  G02B6/29367 ,  G02B6/3827 ,  G02B6/3845 ,  G02B6/3885

公开(公告)号：EP2839329A4

公开(公告)日：2015-12-16

申请号：EP12874816

申请日：2012-04-16

申请人： HEWLETT PACKARD DEVELOPMENT CO

发明人： ROSENBERG PAUL KESSLER ,  TAN MICHAEL RENNE TY ,  MATHAI SAGI VARGHESE ,  STRAZNICKY JOSEPH

IPC分类号： G02B6/43 ,  G02B6/42

CPC分类号： G02B6/12 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/425 ,  G02B6/4259 ,  G02B6/4274 ,  G02B6/4279 ,  G02B6/4295 ,  H01L21/02 ,  Y10T29/41

摘要： An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

公开(公告)号：EP2810111A4

公开(公告)日：2015-09-23

申请号：EP12867223

申请日：2012-01-31

申请人： HEWLETT PACKARD DEVELOPMENT CO

发明人： MATHAI SAGI VARGHESE ,  TAN MICHAEL RENNE TY ,  ROSENBERG PAUL KESSLER ,  SORIN WAYNE VICTOR ,  PANOTOPOULOS GEORGIOS ,  PATRA SUSANT K ,  STRAZNICKY JOSEPH

IPC分类号： G02B6/42 ,  G02B6/12 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/167 ,  H04B10/25 ,  H05K1/02

CPC分类号： H04B10/2504 ,  G02B6/4245 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/0305 ,  H05K2201/10121 ,  H05K2201/10977

摘要： A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

公开(公告)号：EP2425287A4

公开(公告)日：2012-09-19

申请号：EP09844148

申请日：2009-04-28

申请人： HEWLETT PACKARD DEVELOPMENT CO

发明人： ROSENBERG PAUL KESSLER ,  TAN MICHAEL RENNE TY ,  PETERSON ERIC ,  KUO HUEI PEI ,  MATHAI SAGI VARGHESE

IPC分类号： G02B6/32 ,  G02B6/032 ,  G02B6/38 ,  G02B6/42

CPC分类号： G02B6/32 ,  G02B6/3885 ,  G02B6/4214