公开(公告)号：EP0125619A2

公开(公告)日：1984-11-21

申请号：EP84105224.4

申请日：1984-05-09

申请人： HITACHI, LTD.

发明人： Nakazawa, Terumi ,  Minorikawa, Hiroshi ,  Kawakami, Kazuhiko

IPC分类号： H05K5/02

CPC分类号： H05K5/0056 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/148 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/36 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10651

摘要： @ An electronic device for an automobile is roughly divided into individual parts (5) and control circuit elements (2a) which are mounted in a casing (1) divided into two compartments (20, 30), according to the present invention. The individual parts (5) are arranged in one compartment (30) and are covered with silicon rubber to improve their water resistance. The control circuit elements (2a) are arranged in the other compartment (20) and are covered with a silicon gel to prevent any stresses acting upon the control circuit elements, such as ICs, and provide these elements with moisture resistance. The control circuit elements (2a) are bonded by high-temperature solder to improve their heat resistance, but the individual parts (5) are bonded by eutectic solder.