公开(公告)号：EP3337301A1

公开(公告)日：2018-06-20

申请号：EP17207467.6

申请日：2017-12-14

Applicant: Siteco Beleuchtungstechnik GmbH

Inventor： Wimmer, Kilian ,  Wuppinger, Bernhard

IPC: H05K1/02 ,  H05K3/20 ,  F21K9/00 ,  F21V23/00 ,  H05K1/05 ,  H05K3/10 ,  H05K3/30 ,  H05K3/38

CPC classification number: H05K1/0265 ,  H05K1/056 ,  H05K3/103 ,  H05K3/202 ,  H05K3/305 ,  H05K3/386 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: Verfahren zur Herstellung eines LED-Moduls (400), wobei das Verfahren umfasst:
- Befestigen von Leiterflächen (440) mit einer selbstklebenden Schicht (430) auf einem Trägerelement (410), und
- Befestigen einer LED (460) auf den Leiterflächen,
wobei das Befestigen der Leiterflächen durch einen SMD-Bestückungsautomaten erfolgt

公开(公告)号：EP3295774A1

公开(公告)日：2018-03-21

申请号：EP16717620

申请日：2016-04-19

Applicant: OSRAM GMBH ,  HERAEUS DEUTSCHLAND GMBH & CO KG ,  ALANOD GMBH & CO KG

Inventor： SORG JOERG ERICH ,  ZIEGLER STEFAN ,  AUSTGEN MICHAEL ,  PEETSCH ALEXANDER ,  DITZEL ECKHARD ,  BENEDIKT MICHAEL

IPC: H05K1/05 ,  B32B15/08 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K1/056 ,  B32B15/00 ,  B32B15/04 ,  B32B15/08 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2457/00 ,  B32B2457/14 ,  H01L2224/48091 ,  H01L2224/97 ,  H05K3/0097 ,  H05K3/103 ,  H05K3/386 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2203/1545 ,  H01L2924/00014

Abstract: The invention relates to a method for producing at least one connection support, said method having the following steps: A) provision of a sheet metal support (1) comprising a level cover surface (1a), B) application of at least one electrically insulating insulation strip (2) to the cover surface (1a) and bonding of the sheet metal support (1) to the insulation strip (2), C) application of at least one electrically conductive conductor strip (3) to an adhesion surface (2a) of the insulation strip (2) and bonding of the insulation strip (2) to the conductor strip (3), the conductor strip (3) and the sheet metal support (1) being electrically insulated from one another by means of the insulation strip (2).

公开(公告)号：EP2916353A1

公开(公告)日：2015-09-09

申请号：EP13850020.2

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： SUNAGA, Takashi ,  KANEKO, Noboru ,  MIYOSHI, Osamu

IPC: H01L23/48 ,  H01L21/60 ,  H01L25/07 ,  H01L25/18

CPC classification number: H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module (30) includes a copper connector (36a, 36b) jointing an electrode (S, G) formed on a top surface of a bear-chip transistor (35) and a wiring pattern (33b, 33c) out of plural wiring patterns (33a to 33d) via a solder (34b, 34c). The copper connector (36bb) includes an electrode-jointing portion (36bb) jointed to the electrode (G) of the bare-chip transistor (35) and a substrate-jointing portion (36bc) arranged to face the electrode-jointing portion (36bb) and jointed to the wiring pattern (33c). The width W1 of the electrode-jointing portion (36bb) in a direction perpendicular to one direction is smaller than the width W2 of the substrate-jointing potion (36bb) in the direction perpendicular to the one direction.

Abstract translation: 半导体模块（30）包括铜连接器（36a，36b），其连接形成在承载芯片晶体管（35）的顶表面上的电极（S，G）和多个布线中的布线图案（33b，33c） 图案（33a至33d）经由焊料（34b，34c）。 铜连接器（36bb）包括与裸芯片晶体管（35）的电极（G）连接的电极接合部（36bb）和与电极接合部（36bb）相对配置的基板接合部（36bc） ）并连接到布线图案（33c）。 电极接合部（36bb）在与一个方向垂直的方向上的宽度W1小于在与该一个方向垂直的方向上的基板接合部（36bb）的宽度W2。

公开(公告)号：EP2779806A2

公开(公告)日：2014-09-17

申请号：EP14159197.4

申请日：2014-03-12

Applicant: Grote Industries, LLC

Inventor： Brooks, Timothy Webster ,  Jones, Scott J. ,  Marx, Martin J. ,  Perez-Bolivar, Cesar ,  Roberts, James E. ,  Richardson II, George M.

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  F21V29/00

CPC classification number: H01L33/644 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/1028 ,  H05K2201/10977 ,  H01L2924/00

Abstract: A flexible lighting element, comprising:
a first flexible substrate (510, 1110); first conductive element (130) and second conductive element (140) located on the first flexible substrate (510, 1110); a light-emitting element (210) having first and second contacts (230, 240) that are both on a first surface of the light-emitting element (210), the first contact (230) being electrically connected to the first conductive element (130), the second contact (240) being electrically connected to the second conductive element (140), and the light-emitting element (210) emitting light from a second surface opposite the first surface; a flexible top layer located adjacent to the second surface; an affixing layer (540) located between the first flexible substrate (510, 1110) and the flexible top layer, the affixing layer (540) affixing the flexible top layer to the first flexible substrate (510, 1110); and a heat spreading layer (1370, 1470) having a third surface and a fourth surface opposite the third surface, the heat spreading layer (1370, 1470) being affixed beneath the first flexible substrate (510, 1110) at the third surface, wherein the flexible top layer is substantially transparent to the selected wavelength of light.

公开(公告)号：EP2568784A2

公开(公告)日：2013-03-13

申请号：EP11194944.2

申请日：2011-12-21

Applicant: Primax Electronics Ltd

Inventor： Su, Chun-nan ,  Peng, Chun-Ching

IPC: H05K5/02

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract translation: 本发明揭露一种USB应用装置，其包括主体，电路板，多个第一电性接脚以及多个电性元件。 电路板设置在主体中。 多个第一电引脚设置在电路板上并且扩展到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚与电路板之间形成空间，使得多个电元件可以设置在该空间上。 因此电路板的长度变短，并且USB应用装置的体积减小。

公开(公告)号：EP2235768A4

公开(公告)日：2011-12-21

申请号：EP08855426

申请日：2008-11-27

Applicant: LG CHEMICAL LTD

Inventor： PARK YOUNGSUN ,  LEE JEONGSUK ,  AHN KEUNPYO ,  KIM CHUNYEON ,  HA JOUNG HO ,  WAKEBE MASAYUKI

IPC: H01M2/34 ,  H01M2/10 ,  H01M2/30 ,  H05K1/00

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: Disclosed herein is a battery pack comprising: a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state; and a protection circuit module (PCM) electrically connected to the battery cell, wherein the PCM is provided with a safety device of which a circuit is cut off when temperature is high or a large amount of current flows, wherein the PCM is provided with a safety device, the battery cell has an electrode assembly mounted in a metal container together with an electrolyte, the metal container having an open top sealed by a top cap, the battery pack further comprises: an insulative mounting member constructed in a structure in which the PCM is loaded at a top of the insulative mounting member, the insulative mounting member being mounted to the top cap of the battery cell; and an insulative cap coupled to an upper end of the battery cell for covering the insulative mounting member in a state in which the PCM is loaded on the insulative mounting member, and the top cap is provided with a pair of protrusion-type electrode terminals (a first protrusion-type electrode terminal and a second protrusion-type electrode terminal) connected to a cathode and an anode of the electrode assembly, respectively, the insulative mounting member is provided with through-holes corresponding to the protrusion-type electrode terminals, the PCM is provided with through-holes corresponding to the protrusion-type electrode terminals, and the coupling of the insulative mounting member and the PCM to the battery cell is achieved by successively fixedly inserting the protrusion-type electrode terminals through the through-holes of the insulative mounting member and the PCM.

公开(公告)号：EP1446000B1

公开(公告)日：2011-11-09

申请号：EP03388026.1

申请日：2003-04-25

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Andersson, Niklas ,  Palmqvist, Fredrik

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K2201/09018 ,  H05K2201/1028 ,  H05K2201/10371 ,  H05K2201/10916 ,  Y02P70/613

公开(公告)号：EP1901350A4

公开(公告)日：2010-03-10

申请号：EP06767882

申请日：2006-07-05

Applicant: TOYOTA JIDOSHOKKI KK ,  SHOWA DENKO KK

Inventor： OTOSHI KOTA ,  KONO EIJI ,  TOH KEIJI ,  TANAKA KATSUFUMI ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1931183A3

公开(公告)日：2009-09-30

申请号：EP07023165.9

申请日：2007-11-29

Applicant: Hitachi, Ltd.

Inventor： Yokozuka, Takehide ,  Ikeda, Ukyo ,  Harada, Masahide ,  Yoshinari, Hideto

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/0979 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10856 ,  H05K2201/10924 ,  H05K2203/0285 ,  H01L2924/00

Abstract: An electronic device of the present invention has a pair of joint pieces 2a, 2b formed on one end of its body and extending to both sides of the body. Both of these joint pieces 2a, 2b are connected to one substrates 5, 7 to improve the joining strength between a lead frame connector 1 and the substrate and ensure the reliability of electrical connection between the lead frame connector 1 and the substrate 5,7.

公开(公告)号：EP1985163A1

公开(公告)日：2008-10-29

申请号：EP07702782.9

申请日：2007-01-16

Applicant: Häusermann GmbH

Inventor： JANESCH, Rudolf ,  STRUMMER, Erich ,  HACKL, Johann

IPC: H05K3/00 ,  H05K1/00

CPC classification number: H05K1/0281 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/0278 ,  H05K3/0017 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/328 ,  H05K3/4691 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/1028 ,  H05K2201/2009 ,  H05K2203/302

Abstract: The invention relates to a multifunctional printed circuit board for use as rigid/flexible or semi-flexible printed circuit board in the form of a through-hole printed circuit board or multilayer printed circuit board or flexible printed circuit board. At least one additional functional element is fastened in at least some sections on a copper foil by ultrasound or friction welding in a planar manner, thereby producing an intermetal compound. A notch is milled into said section allowing the printed circuit board to be bent like a rigid/flexible printed circuit board or semi-flexible printed circuit board. When two notches are milled, the printed circuit board can be bent twice by approximately 45° by a total of 90°. The invention also relates to a method for producing multifunctional printed circuit boards which comprise at least one additional functional element and a milled notch.