公开(公告)号：EP1983809B1

公开(公告)日：2018-09-12

申请号：EP08007057.6

申请日：2008-04-09

Applicant: YAZAKI CORPORATION

Inventor： Masaoki, Yoshida ,  Nakayama, Takuya ,  Ueyama, Koji

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Since the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

公开(公告)号：EP2467002A3

公开(公告)日：2013-01-09

申请号：EP11194069.8

申请日：2011-12-16

Applicant: Panasonic Electric Works Co., Ltd.

Inventor： Kinugasa, Noriaki ,  Konishi, Jun ,  Ogawa, Masanori

IPC: H05K3/30

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078

Abstract: [Object] An electronic component on-substrate mounting structure capable of mounting an electronic component having a round external shape on a substrate in a predetermined attitude and keeping an allowance of a lead to a predetermined value is provided.
[Means for Settlement] A lead 12 of an electronic component 11 is inserted into a lead hole 31 of a substrate 30, thereby mounting the electronic component 11 on the substrate 30. The lead 12 includes a base part 16 extending from an electronic component main body 13, a support part 17 bent from the base part 16, abutting an electronic-component mount surface 30A of the substrate 30 at a predetermined length, and supporting the electronic component main body 13, and an insertion part 18 bent from the support part 17 and inserted into a lead hole 31 of the substrate 30.

公开(公告)号：EP1983809A3

公开(公告)日：2010-07-21

申请号：EP08007057.6

申请日：2008-04-09

Applicant: YAZAKI CORPORATION

Inventor： Masaoki, Yoshida ,  Nakayama, Takuya ,  Ueyama, Koji

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Since the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

Abstract translation: 本发明提供一种能够可靠地防止由端子引起的导体图案的损伤的印刷布线板。 印刷线路板具有板，导电图案，通孔和非导电区域。 将安装在印刷线路板上的电阻引线插入到通孔4中。引线从电路板的表面突出，并弯曲靠近表面。 非导电区域形成为从通孔的中心向引线的末端扩大的扇形形状。 由于弯曲引线布置在非导电区域上，因此非导电区域可以防止由于引线接触导电图案而导致的导电图案的损坏。

公开(公告)号：EP1943888B1

公开(公告)日：2009-07-29

申请号：EP06809589.2

申请日：2006-10-13

Applicant: Koninklijke Philips Electronics N.V.

Inventor： DONNERS, Maurice, A., H.

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

公开(公告)号：EP1853095A4

公开(公告)日：2009-05-13

申请号：EP06712245

申请日：2006-01-24

Applicant: FURUKAWA ELECTRIC CO LTD

Inventor： ENOMOTO NORITSUGU ,  UTSUNOMIYA HIROFUMI ,  KAMIMURA KEN ,  MOTOMURA SHIGEKI ,  AOYAGI SHIGEHARU ,  TAKEDA JUNICHI

IPC: H05K1/02 ,  H01B7/08 ,  H05K1/18

CPC classification number: H05K3/326 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2009 ,  H05K2203/1189 ,  H05K2203/302

Abstract: A three-dimensional wiring body for mounted with an electronic component in which a flat wiring body mounted with a large number of electronic components is bend previously to be suited to the shape of a base structure where the flat wiring body is disposed and formed as a three-dimensional flat wiring body. An electronic component mounting structure where the three-dimensional wiring body for mounting an electronic component is mounted on a base structure formed three-dimensionally using a plurality of base members and coupling members is also provided. An electronic component is connected electrically and mechanically with the flat wiring body through a connector composed of a back plate portion and a piercing piece.

公开(公告)号：EP2030493A2

公开(公告)日：2009-03-04

申请号：EP07825796.1

申请日：2007-06-05

Applicant: Koninklijke Philips Electronics N.V.

Inventor： BHATTACHARYA, Rabin ,  SNIJDER, Pieter, J. ,  VAN PIETERSON, Liesbeth ,  VAN DRIEL, Jacquline ,  KRANS, Martijn ,  DOUGLAS, Alexander, U. ,  ASVADI, Sima ,  HACK, Martinus, J.J. ,  ZAINZINGER, Erich

IPC: H05K3/30 ,  A41D1/00

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

公开(公告)号：EP1613134A3

公开(公告)日：2008-03-05

申请号：EP05252296.8

申请日：2005-04-13

Applicant: Hitachi, Ltd.

Inventor： Sakama, Isao, c/o Hitachi, Ltd., IP Group ,  Ashizawa, Minoru, c/o Hitachi, Ltd., IP Group

IPC: H05K1/18 ,  H05K1/16 ,  G06K19/077

CPC classification number: H05K1/16 ,  H01Q1/2225 ,  H01Q9/285 ,  H01Q19/24 ,  H05K1/0266 ,  H05K1/184 ,  H05K3/403 ,  H05K2201/10098 ,  H05K2201/10446 ,  H05K2201/10651

Abstract: To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surface la and a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.

公开(公告)号：EP1152647A1

公开(公告)日：2001-11-07

申请号：EP00109595.9

申请日：2000-05-05

Applicant: THOMSON multimedia

Inventor： Lim, Yoon Choy

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K3/308 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10651

Abstract: This invention relates to arranging components of an electric circuit within an apparatus while taking into consideration safety requirements especially due to IEC 60065.
According to the present invention a faulty contact or interruption which can constitute a Potential Ignition Source is avoided by providing at least two separate solder pads (12,13;22,23;33,34,35,36) for at least the relevant one of the connection wires (11;21;31) of an electric component (diode 1;ceramic capacitor 2;transistor 3) to be inserted and soldered particularly on a printed circuit board (4).

Abstract translation: 本发明涉及在考虑到IEC 60065的安全要求的同时考虑安全要求的同时在设备中布置电路的部件。根据本发明，可以通过提供至少两个分开的方式来避免构成潜在点火源的故障接触或中断 用于电气部件（二极管1;陶瓷电容器2;晶体管3）中的至少相关一条连接线（11; 21; 31）的焊盘（12,13; 22,33; 33,34,35,36） ）被特别插入和焊接在印刷电路板（4）上。

公开(公告)号：EP0892592A3

公开(公告)日：2000-05-17

申请号：EP98305617.7

申请日：1998-07-15

Applicant: Teikoku Tsushin Kogyo Co. Ltd.

Inventor： Yagi, Nobuyuki, Teikoku Tsushin Kogyo Co., Ltd., ,  Kinoshita, S., Teikoku Tsushin Kogyo Co., Ltd., ,  Tohma, Noburo, Teikoku Tsushin Kogyo Co., Ltd., ,  Nomura, Osamu, Teikoku Tsushin Kogyo Co., Ltd., ,  Nagatomo, Ikuo, Teikoku Tsushin Kogyo Co., Ltd., ,  Hosokawa Mitsuru, Teikoku Tsushin Kogyo Co., Ltd.,

IPC: H05K3/32 ,  H05K7/12

CPC classification number: H05K3/326 ,  H05K1/189 ,  H05K7/12 ,  H05K2201/09081 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: The invention provides a mounting construction in which an electronic component is mounted on a flexible substrate. The mounting construction comprises a flexible substrate 10 including a flexible sheet 11, bendable electrode pattern forming portions 17 and 17 formed on the flexible sheet, and electrode patterns 13 and 13 formed on the electrode pattern forming portions, an electronic component 30 having electrode portions 33 and 33, and a clamping member 40 having clamping pieces 41 and 41 for clamping the electronic component 30 therebetween. The electrode pattern forming portions 17 and 17 are deflected, so as to cause the electrode patterns 13 and 13 to be contacted with the electrode portions 33 and 33 of the electronic component 30 placed on the flexible substrate 10. By this, the electronic component 30 is clamped by the clamping pieces 41 and 41 of the clamping member 40 through the deflected electrode pattern forming portions 17 and 17. Thus, the electronic component 30 may be easily and positively secured to the flexible substrate 10, without employing additional reinforcing means such as adhesives.

Abstract translation: 本发明提供了一种安装结构，其中电子部件安装在柔性基板上。 安装结构包括柔性基板10，柔性基板10包括柔性片11，形成在柔性片上的可弯曲电极图案形成部分17和17以及形成在电极图案形成部分上的电极图案13和13，具有电极部分33 33以及具有用于将电子部件30夹持在其间的夹紧片41,41的夹持部件40。 电极图案形成部分17和17被偏转，以使电极图案13和13与放置在柔性基板10上的电子部件30的电极部分33和33接触。由此，电子部件30 被夹持构件40的夹持件41和41通过偏转的电极图案形成部分17和17夹紧。因此，电子部件30可以容易且牢固地固定到柔性基板10，而不需要额外的加强装置，例如 粘合剂。

公开(公告)号：EP0870642A3

公开(公告)日：2000-03-15

申请号：EP98106225.0

申请日：1998-04-06

Applicant: Hermann Stahl GmbH

Inventor： Stahl, Hermann ,  Windt, Uwe

IPC: H05K3/32 ,  H01R4/06 ,  B60Q1/02

CPC classification number: H05K3/326 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/1084 ,  Y10S439/937

Abstract: Die Erfindung betrifft einen Träger zum mechanischen Halten und elektrischen Verbinden von Leuchtdioden. Der Träger (1) besteht aus einem elektrisch leitfähigen Blech (2, 3), auf dem die Anschlußfahnen (11) der Leuchtdioden (10) elektrisch leitend festgelegt sind. Zur Erzielung einer gut leitenden elektrischen Verbindung bei hoher mechanischer Stabilität ist vorgesehen, zumindest auf der Kontaktseite (17) des Trägers (1) noppenartige Haltezapfen (5) vorzusehen, die als Hohlnieten aus dem Blechmaterial des Trägers (1) ausgeprägt sind und eine Öffnung (12) in der Anschlußfahne (11) der Leuchtdioden (10) durchragen, wobei das mechanisch verformte Kopfende (7) des Haltezapfens (5) den Rand (13) der Öffnung (12) in der Anschlußfahne (11) übergreift.