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公开(公告)号：EP4393869A1
公开(公告)日：2024-07-03
申请号：EP22216975.7
申请日：2022-12-28
申请人： SCHOTT AG , SCHOTT Primoceler Oy
CPC分类号： B81C1/00357 , C03B23/245 , B23K26/20 , B81C2203/011820130101 , B81C1/00904
摘要： The invention relates to a method for welding substrates comprising: bringing a first substrate and a second substrate in contact with each other such that a contact area between the two substrates is formed; introducing at least two outer weld lines extending next to each other within the contact area into the first and second substrates such that the first and second substrates are welded together by each of the outer weld lines and such that a dicing area is defined between the two outer weld lines; and introducing one or more inner weld lines extending between the two outer weld lines within the dicing area into at least one of the two substrates. The invention further relates to welded substrates and to singulated chips, in particular hermetically sealed enclosures.
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12.发明公开
公开(公告)号：EP4332642A1
公开(公告)日：2024-03-06
申请号：EP22192686.8
申请日：2022-08-29
申请人： SCHOTT AG
摘要： The invention relates to a structured substrate (1), preferably for applications in micro systems technology, such as for micro optical systems, comprising: a planar substrate (10), preferably comprising glass material, and having two opposing planar surfaces (12, 14), at least one through-hole (20) extending through the material of the planar substrate forming an inner wall surface surrounding the through-hole and connecting the two opposing planar surfaces, and a light absorbing coating (30) covering at least some areas of the inner wall surface of the through-hole. The invention further relates to method of manufacturing said structured substrate and to use of said structured substrate.
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公开(公告)号：EP4241300A1
公开(公告)日：2023-09-13
申请号：EP21806207.3
申请日：2021-11-04
申请人： SCHOTT AG , Schott Primoceler Oy
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公开(公告)号：EP4003904A1
公开(公告)日：2022-06-01
申请号：EP20751479.5
申请日：2020-07-24
申请人： SCHOTT AG
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