GLASS COMPOUND ARRANGEMENT
    8.
    发明公开

    公开(公告)号:EP3812352A1

    公开(公告)日:2021-04-28

    申请号:EP19205115.9

    申请日:2019-10-24

    摘要: An enclosure is shown, comprising at least a base substrate and a cover substrate, which constitute at least a part of the enclosure, and a function zone situated such that it is circumferentially enclosed in the enclosure. At least the cover substrate comprises preferably a glass or glass-like material. The base substrate and the cover substrate are hermetically welded by means of at least one laser weld line, where the laser weld line comprises a height HL in a direction perpendicular to its connecting plane, and wherein the mechanical stress in the at least one laser weld line is reduced, thus improving the mechanical stability of the enclosure.