Unsaturated imide compounds containing alicyclic structure
    12.
    发明公开
    Unsaturated imide compounds containing alicyclic structure 失效
    UngesältigteImide-Verbindungen die eine alicyclische Struktur enthalten。

    公开(公告)号:EP0595230A1

    公开(公告)日:1994-05-04

    申请号:EP93117252.2

    申请日:1993-10-25

    摘要: An unsaturated imide compound represented by formula (1):

    wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R₁, R₂, R₃, R₄, R i and R j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a + b ≦ 4 , c + d ≦ 4 and e + f ≦ 4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

    摘要翻译: 由式(1)表示的不饱和酰亚胺化合物:其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1,R 2,R 3,R 4,R 1和R 3中的每一个表示氢原子,卤素原子,具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a,b,c,d,e和f中的每一个表示满足+ b = 4,c + d 4和e + f 4的0〜4的整数,D表示二价有机物 具有2-24个碳原子和烯属不饱和双键的基团,制备式(1)的不饱和酰亚胺化合物的方法和制备式(1)的不饱和酰亚胺化合物的中间体。 式(1)的不饱和酰亚胺化合物在有机溶剂中很好溶解,可以得到耐热性,低吸水性和柔软性优异的固化产物。

    Epoxy resin, resin composition, and resin-encapsulated semiconductor device
    17.
    发明公开
    Epoxy resin, resin composition, and resin-encapsulated semiconductor device 失效
    Epoxyharz,Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung

    公开(公告)号:EP0739877A2

    公开(公告)日:1996-10-30

    申请号:EP96106558.8

    申请日:1996-04-25

    摘要: The stilbene epoxy resin having two different aryl groups of the following formula:
    wherein R 1 through R 8 independently represent acyclic or cyclic alkyl groups having 1 through 6 carbon atoms, hydrogen atom or halogen atoms, and the epoxy resin mixture including such stilbene epoxy resin according to the present invention have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture including such stilbene epoxy resin. Compared with the conventional resins, the resin or resin mixture of the present invention accordingly has improved working and molding properties, thereby shortening the time required for the molding and working process and giving economical advantages and preferable productivity. The epoxy resin or resin mixture according to the present invention is preferably used as adhesive, coating, or insulating material, as electrical or electronic material for laminated sheets or the like, and especially as material for encapsulating electronic parts.

    摘要翻译: 具有下式的两个不同芳基的二苯乙烯环氧树脂:其中R 1至R 8独立地表示具有1至6个碳原子的无环或环状烷基,氢原子或卤素原子,并且环氧树脂混合物包括这种茋环氧树脂 根据本发明的树脂具有比具有两个相同芳基的二苯乙烯环氧树脂和包含这种二苯乙烯环氧树脂的环氧树脂混合物的熔点低的熔点。 与常规树脂相比,本发明的树脂或树脂混合物相应地具有改进的加工和模塑性能,从而缩短了模制和加工过程所需的时间,并提供了经济的优点和优选的生产率。 根据本发明的环氧树脂或树脂混合物优选用作粘合剂,涂层或绝缘材料,作为层压片材等的电气或电子材料,特别是作为用于封装电子部件的材料。