摘要:
An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) wherein R₁ represents hydrogen, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups or halogen, and X represents and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product having low hygroscopic property and high adhesiveness.
摘要:
An unsaturated imide compound represented by formula (1):
wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R₁, R₂, R₃, R₄, R i and R j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a + b ≦ 4 , c + d ≦ 4 and e + f ≦ 4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译:由式(1)表示的不饱和酰亚胺化合物:其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1,R 2,R 3,R 4,R 1和R 3中的每一个表示氢原子,卤素原子,具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a,b,c,d,e和f中的每一个表示满足+ b = 4,c + d 4和e + f 4的0〜4的整数,D表示二价有机物 具有2-24个碳原子和烯属不饱和双键的基团,制备式(1)的不饱和酰亚胺化合物的方法和制备式(1)的不饱和酰亚胺化合物的中间体。 式(1)的不饱和酰亚胺化合物在有机溶剂中很好溶解,可以得到耐热性,低吸水性和柔软性优异的固化产物。
摘要:
The stilbene epoxy resin having two different aryl groups of the following formula: wherein R 1 through R 8 independently represent acyclic or cyclic alkyl groups having 1 through 6 carbon atoms, hydrogen atom or halogen atoms, and the epoxy resin mixture including such stilbene epoxy resin according to the present invention have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture including such stilbene epoxy resin. Compared with the conventional resins, the resin or resin mixture of the present invention accordingly has improved working and molding properties, thereby shortening the time required for the molding and working process and giving economical advantages and preferable productivity. The epoxy resin or resin mixture according to the present invention is preferably used as adhesive, coating, or insulating material, as electrical or electronic material for laminated sheets or the like, and especially as material for encapsulating electronic parts.