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公开(公告)号：EP0700947A2
公开(公告)日：1996-03-13
申请号：EP95113576.3
申请日：1995-08-29
CPC分类号： H01L23/293 , C08G59/226 , C08G59/245 , C08G59/38 , C08G59/621 , C08L63/00 , H01L2924/0002 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition comprising
(A) an epoxy resin represented by the general formula (1)
wherein R₁ represents hydrogen, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups or halogen, and X represents
and n represents an integer of 0 to 4, and
(B) a curing agent, which composition provides a cured product having low hygroscopic property and high adhesiveness.摘要翻译： 一种环氧树脂组合物，它含有（A）通式（1）表示的环氧树脂，其中R 1代表氢，具有1-6个碳原子的烷基，取代或未取代的苯基或卤素，X代表和n代表 0至4的整数，和（B）固化剂，该组合物提供具有低吸湿性和高粘合性的固化产物。
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公开(公告)号：EP0415437A3
公开(公告)日：1991-11-27
申请号：EP90116752.8
申请日：1990-08-31
发明人： Nakajima, Nobuyuki , Kanagawa, Shuichi , Sakamoto, Hideshi , Saito, Noriaki , Ikushima, Tadashi
CPC分类号： C08L61/06 , C08L63/00 , C08L2666/22 , C08L61/04
摘要： A curing agent for epoxy resins which agent comprises a polyhydric phenol obtainable by condensating a phenol compound comprising a substituted phenol having at least one hydrophobic substituent on the aromatic ring and a p-hydroxybenzaldehyde compound, which cures an epoxy compound having at least two glycidyl groups in the molecule to give a cured product having balanced heat resistance and moisture resistance.
摘要翻译： 一种环氧树脂用固化剂，其特征在于，含有多元酚，其可通过将包含在芳香环上具有至少一个疏水性取代基的取代苯酚和酚羟基化合物缩合成苯酚化合物，所述对羟基苯甲醛化合物固化具有至少两个缩水甘油基的环氧化合物 在分子中得到具有平衡的耐热性和耐湿性的固化产物。
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3.发明授权Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom 失效多元酚和环氧树脂生产它与环氧树脂
公开(公告)号：EP0536749B1
公开(公告)日：1998-03-11
申请号：EP92117201.1
申请日：1992-10-08
发明人： Saito, Noriaki , Morimoto, Takashi , Takebe, Kazuo , Shiomi, Yutaka , Naitoh, Shigeki , Kanagawa, Shuichi
CPC分类号： C08G59/08 , C08G59/3218 , C08G59/621 , Y10T428/239 , Y10T428/24917
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公开(公告)号：EP0424872A2
公开(公告)日：1991-05-02
申请号：EP90120295.2
申请日：1990-10-23
发明人： Nakajima, Nobuyuki , Kanagawa, Shuichi , Sakamoto, Hideshi , Saito, Noriaki , Ikushima, Tadashi
摘要： A curing agent for an epoxy resin comprising (A) a polyhydric phenol obtainable by condensing a phenol compound and a hydroxybenzaldehyde and (B) a dihydric phenol, which gives a cured material of an epoxy resin having improved moisture and heat resistance and a small coefficient of linear thermal expansion.
摘要翻译： 一种用于环氧树脂的固化剂，其包含（A）通过使酚化合物和羟基苯甲醛缩合得到的多元酚和（B）二元酚，其得到具有改善的耐湿性和耐热性的环氧树脂的固化物质和小系数 的线性热膨胀。
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公开(公告)号：EP0536748B1
公开(公告)日：1997-09-10
申请号：EP92117199.7
申请日：1992-10-08
发明人： Takebe, Kazuo , Morimoto, Takashi , Shiomi, Yutaka , Sugiyama, Yasuhide , Naitoh, Shigeki , Saito, Noriaki , Kanagawa, Shuichi , Kamio, Kunimasa
CPC分类号： C08G59/08 , C07D303/24 , C08G8/04 , C08G59/3218 , H01L23/293 , H01L2924/0002 , H01L2924/00
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6.发明公开Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom 失效Polyhydrisches苯酚和水分子Epoxydharz und Epoxydharzzusammensetzung。
公开(公告)号：EP0536749A1
公开(公告)日：1993-04-14
申请号：EP92117201.1
申请日：1992-10-08
发明人： Saito, Noriaki , Morimoto, Takashi , Takebe, Kazuo , Shiomi, Yutaka , Naitoh, Shigeki , Kanagawa, Shuichi
CPC分类号： C08G59/08 , C08G59/3218 , C08G59/621 , Y10T428/239 , Y10T428/24917
摘要： A novel polyhydric phenol represented by the general formula:
wherein R₁ to R₄ independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl group, and n represents an average number of repeating units of 0.1 to 10. With the above polyhydric phenol as starting material, there is provided an epoxy resin represented by the general formula:
wherein R₁ to R₄, X and n are as defined above. There is provided an epoxy resin composition comprising the above epoxy resin and a curing agent. The cured products from the above epoxy resin are excellent in less hygroscopicity and have a balance between thermal resistance and curing performance.摘要翻译： 由以下通式表示的新型多元酚：
其中R 5至R 8独立地表示氢，具有1至9个碳原子的烷基或环烷基或卤素，X表示氢，烷基 具有1至9个碳原子或芳基，n表示重复单元的平均数为0.1至10.以上述多元酚为原料，提供由以下通式表示的环氧树脂： 其中R 5至R 8，X和n如上所定义。 提供了包含上述环氧树脂和固化剂的环氧树脂组合物。 来自上述环氧树脂的固化产物具有优异的吸湿性，并且在耐热性和固化性能之间具有平衡性。 -
公开(公告)号：EP0424872A3
公开(公告)日：1991-11-27
申请号：EP90120295.2
申请日：1990-10-23
发明人： Nakajima, Nobuyuki , Kanagawa, Shuichi , Sakamoto, Hideshi , Saito, Noriaki , Ikushima, Tadashi
摘要： A curing agent for an epoxy resin comprising (A) a polyhydric phenol obtainable by condensing a phenol compound and a hydroxybenzaldehyde and (B) a dihydric phenol, which gives a cured material of an epoxy resin having improved moisture and heat resistance and a small coefficient of linear thermal expansion.
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8.发明公开Epoxy resin composition for encapsulating semiconductor 有权Epoxyharzzusammensetzung zum Verkapseln von Halbleitern
公开(公告)号：EP1174455A1
公开(公告)日：2002-01-23
申请号：EP01117045.3
申请日：2001-07-12
CPC分类号： C08G59/08 , C08G59/3218 , C08G59/621 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Provided is an epoxy resin composition having low moisture absorption and excellent solder-crack resistance for encapsulating semiconductor comprising:
(A) an epoxy resin represented by formula (1)
(B) a curing agent having a phenolic hydroxyl group, and
(C) inorganic filler in an amount of 60 to 98% by weight based on the whole composition, and the epoxy resin composition is preferably used for a resin-encapsulated type semiconductor apparatus.摘要翻译： 本发明提供一种环氧树脂组合物，其包含半导体的吸湿性和耐焊接裂纹性优异，其包括：（A）由式（1）表示的环氧树脂
（B）具有酚羟基的固化剂和（ C）基于整个组合物的含量为60至98重量％的无机填料，并且环氧树脂组合物优选用于树脂封装型半导体装置。 -
公开(公告)号：EP0567919A3
公开(公告)日：1994-04-06
申请号：EP93106477.8
申请日：1993-04-21
CPC分类号： H01B3/40 , C08L61/06 , C08L63/00 , C08L2666/22 , C08L61/04
摘要： An epoxy resin composition having a lower hygroscopicity and a good balance between the heat-resistance, curability and adhesiveness and a resin-encapsulated semiconductor device produced by using the same composition, which epoxy resin composition comprises an epoxy resin having at least two epoxy groups in a molecule and a polyhydric phenol represented by the following general formula:
摘要翻译： 本发明提供一种环氧树脂组合物，其吸湿性低，耐热性，固化性，密合性的平衡良好，并且使用相同组成制造的树脂封装半导体装置，其中，环氧树脂组合物含有环氧树脂 分子和由以下通式表示的多元酚：
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10.发明公开Epoxy resin composition and resin-encapsulated semiconductor device 失效Epoxidharzzusammensetzung undKunststoffumhüllteHalbleiteranordnung。
公开(公告)号：EP0567919A2
公开(公告)日：1993-11-03
申请号：EP93106477.8
申请日：1993-04-21
CPC分类号： H01B3/40 , C08L61/06 , C08L63/00 , C08L2666/22 , C08L61/04
摘要： An epoxy resin composition having a lower hygroscopicity and a good balance between the heat-resistance, curability and adhesiveness and a resin-encapsulated semiconductor device produced by using the same composition, which epoxy resin composition comprises an epoxy resin having at least two epoxy groups in a molecule and a polyhydric phenol represented by the following general formula:
摘要翻译： 一种环氧树脂组合物，其具有较低的吸湿性和耐热性，固化性和粘合性之间的良好平衡以及通过使用相同组成制备的树脂封装的半导体器件，该环氧树脂组合物包含具有至少两个环氧基团的环氧树脂 分子和由以下通式表示的多元酚：
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