PIEZOELECTRIC TRANSFORMER WITH VOLTAGE FEEDBACK
    11.
    发明授权
    PIEZOELECTRIC TRANSFORMER WITH VOLTAGE FEEDBACK 失效
    电压反馈压电变压器

    公开(公告)号:EP1027738B1

    公开(公告)日:2007-08-29

    申请号:EP98934174.8

    申请日:1998-06-26

    申请人: CTS Corporation

    IPC分类号: H01L41/107

    CPC分类号: H01L41/107

    摘要: A piezoelectric transformer (200) with voltage feedback is disclosed. The transformer comprises a piezoelectric plate of predetermined length (L), width (W) and height (H) with a driving section (202) having alternatingly stacked plurality of piezoelectric ceramic layers having internal interdigitated layers. A driven section (206) including an unpolarized dielectric section (208), a voltage feedback section (220) in the form of a multilayer electrode structure or an outer strip, and a normally unpolarized dielectric section (222) is also disclosed. The transformer generates an output voltage at an output terminal by the piezoelectric vibration transmitted from the driving section. A feedback control circuit is connected to the voltage feedback section. The isolated voltage feedback provides feedback control to keep the transformer operating at the proper resonant frequency even if there is a change in output load of the transformer.

    Pressure sensor
    13.
    发明公开
    Pressure sensor 审中-公开
    Druckwandler

    公开(公告)号:EP1522834A2

    公开(公告)日:2005-04-13

    申请号:EP04104363.9

    申请日:2004-09-09

    申请人: CTS Corporation

    IPC分类号: G01L9/06

    摘要: A pressure sensor for sensing a pressure level of a pressurized medium has, in one embodiment, a high pressure side and a low pressure side. An aperture may extend through at least a portion of the sensor assembly, and a seal is located in the aperture. The seal seals the high pressure side from the low pressure side. Electrical leads extend through the seal between the high pressure side and the. low pressure side. A substrate is located on the high pressure side. A pressure sensitive resistor is mounted on the substrate such that the resistor is directly exposed to the pressurized medium. The resistor changes resistance in response to a change in pressure. The resistor is connected to the electrical leads.

    摘要翻译: 在一个实施例中,用于感测加压介质的压力水平的压力传感器具有高压侧和低压侧。 孔可以延伸穿过传感器组件的至少一部分,并且密封件位于孔中。 密封件将高压侧从低压侧密封。 电气引线延伸穿过高压侧之间的密封。 低压侧。 衬底位于高压侧。 压敏电阻器安装在基板上,使得电阻器直接暴露于加压介质。 电阻响应于压力的变化而改变电阻。 电阻连接到电线。

    Pressure sensor
    14.
    发明公开
    Pressure sensor 审中-公开
    Drucksensor

    公开(公告)号:EP1503195A1

    公开(公告)日:2005-02-02

    申请号:EP04005504.8

    申请日:2004-03-08

    申请人: CTS Corporation

    摘要: A pressure sensor for sensing a pressure level of a medium. The pressure sensor includes a rigid substrate having a medium contacting side and a pressure sensitive resistor mounted on the medium contacting side. The resistor exhibits a change in resistance in response to pressure changes on the resistor above a predetermined threshold. Other embodiments of the invention are shown using a Wheatstone bridge with pressure sensitive resistors and resistors that are insensitive to pressure changes.

    摘要翻译: 用于感测介质的压力水平的压力传感器。 压力传感器包括具有介质接触侧的刚性基板和安装在介质接触侧上的压敏电阻器。 电阻器响应于电阻器上的压力变化高于预定阈值而呈现电阻变化。 使用具有对压力变化不敏感的压敏电阻器和电阻器的惠斯登电桥示出本发明的其它实施例。

    OCTAGONAL ELECTRODE FOR CRYSTALS
    15.
    发明公开
    OCTAGONAL ELECTRODE FOR CRYSTALS 审中-公开
    八角电极上对晶体

    公开(公告)号:EP1421685A1

    公开(公告)日:2004-05-26

    申请号:EP02739972.4

    申请日:2002-06-26

    申请人: CTS Corporation

    IPC分类号: H03H9/13

    CPC分类号: H03H9/132 H03H9/177

    摘要: A crystal electrode that reduces coupled mode noise. A crystal blank has a top surface and a bottom surface. A first electrode is located on the top surface. The first electrode has a contact portion and a polygonal portion. A second electrode is located on the bottom surface. The second electrode has a contact portion and a polygonal portion. The polygonal portions of the first and second electrodes are arranged such that they oppose each other.

    VEHICLE SEAT SENSOR
    17.
    发明公开
    VEHICLE SEAT SENSOR 审中-公开
    车辆座椅传感器

    公开(公告)号:EP1314008A1

    公开(公告)日:2003-05-28

    申请号:EP01964423.6

    申请日:2001-08-24

    申请人: CTS Corporation

    IPC分类号: G01G19/414 G01L1/20

    摘要: A weight sensor (10) for sensing an applied weight. The sensor includes a first (20) and second (22) outer substrate that have a first (20C, 22C) and second (20D, 22D) end and an inner surface (20B, 22B) and an outer surface (20A, 22A). The first and second outer substrates (20, 22) are fixedly attached together. Several strain gauge resistors (50, 52) are located on the outer surfaces of the first and second outer substrates (20A, 22A) to generate an electrical signal in response to the substrate being stressed by the applied weight. The electrical signal changes as a function of the applied weight. The sensor is useful in measuring the weight of a vehicle seat occupant.

    HERMETIC GROUNDED PIN ASSEMBLY
    18.
    发明公开
    HERMETIC GROUNDED PIN ASSEMBLY 有权
    HERMETIC地面导管布置

    公开(公告)号:EP1251909A1

    公开(公告)日:2002-10-30

    申请号:EP01906780.0

    申请日:2001-01-30

    申请人: CTS Corporation

    发明人: IBRAHIM, Shawki

    IPC分类号: A61N1/375 H01R4/02

    摘要: A hermetic ground pin assembly for making an electrical connection between a hermetically sealed enclosure and an external circuit. A case has an aperture and a plug located within the aperture. A low temperature braze alloy is located between the plug and the case to attach the plug within the aperture. Two different pins are attached to opposite sides of the plug. A high temperature braze alloy attaches one of the pins to the plug and the low temperature braze alloy attaches the other pin to the plug.

    Flip chip package for micromachined semiconductors
    19.
    发明公开
    Flip chip package for micromachined semiconductors 审中-公开
    Flip-Chip-Gehäusefürmikrogefertigte Halbleiter

    公开(公告)号:EP1057779A3

    公开(公告)日:2002-09-11

    申请号:EP00303286.9

    申请日:2000-04-18

    申请人: CTS Corporation

    发明人: Hinds, Ronald L

    IPC分类号: B81B7/00

    摘要: A hermetic multilayered ceramic semiconductor package for micromachined semiconductor devices. A low temperature co-fired ceramic assembly has a cavity and a top and bottom surface. Several vias extend between the top and bottom surfaces and several solder spheres are located on the top surface and are electrically connected to the vias. A micrornachined semiconductor device abuts the bottom surface and covers the cavity such that a movable portion of the micromachined semiconductor device is unconstrained to move within the cavity. Solder is used to connect the vias to solder bumps on the semiconductor device. A seal ring is located between the micromachined semiconductor device and the ceramic assembly for hermetically sealing the micromachined semiconductor device.

    摘要翻译: 一种用于微加工半导体器件的密封多层陶瓷半导体封装。 低温共烧陶瓷组件具有空腔和顶部和底部表面。 几个通孔在顶表面和底表面之间延伸,并且几个焊球位于顶表面上并且电连接到通孔。 微加工半导体器件邻接底表面并覆盖空腔,使得微加工半导体器件的可移动部分不受约束以在腔内移动。 焊接用于将通孔连接到半导体器件上的焊料凸块。 密封环位于微加工半导体器件和陶瓷组件之间,用于气密密封微加工半导体器件。

    OSCILLATOR MODE SUPPRESSION CIRCUIT
    20.
    发明公开
    OSCILLATOR MODE SUPPRESSION CIRCUIT 审中-公开
    模式抑制电路,用于OSCILLATORS

    公开(公告)号:EP1219018A1

    公开(公告)日:2002-07-03

    申请号:EP00963398.3

    申请日:2000-09-13

    发明人: WORDELMAN, James

    IPC分类号: H03B5/36

    CPC分类号: H03B5/30 H03B5/36

    摘要: An oscillator circuit suppresses unwanted oscillation frequencies and allows oscillation in the selected frequency band. The circuit has less sensitivity to aging of components that cause a shift in operating frequency. The oscillator includes a first and second inverting amplifier that each have an input terminal and an output terminal. A crystal resonator is connected between the input terminal of the first amplifier and the output terminal of the second amplifier. A suppression trap is connected between the first and second amplifier for suppressing oscillation outside the desired range of frequencies. The trap includes a parallel tank circuit that is connected between the output terminal of the first amplifier and the input terminal of the second amplifier. A capacitor is connected between the input terminal of the second amplifier and a ground.