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11.发明公开
公开(公告)号：EP0664547A4
公开(公告)日：1995-12-27
申请号：EP94914587
申请日：1994-05-02
发明人： KIYOKAWA TADASHI
IPC分类号： H01C7/00 , H01C17/16 , H01H69/02 , H01H85/046 , H01H85/048 , H05K1/00 , H05K1/16 , H01C13/00
CPC分类号： H01C7/006 , H01C17/16 , H01H69/022 , H01H85/046 , H01H85/048 , H05K1/0293 , H05K1/167
摘要： This film resistor is formed of an alloy whose principal components are nickel and phosphorus. On the surface of an electrically insulating base made of ceramic or the like, a conductor is provided by etching, activating, and electroless plating in that order. Then an alloy film whose principal components are nickel and phosphorus is formed not by electroless plating, but by electroplating. By adapting electroplating, it is possible to make the alloy film thinner in the central part of the surface of the insulating base than the parts of the edges. If an overcurrent is applied, fusing starts preferably at this thin part.
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12.发明授权
公开(公告)号：EP0380545B1
公开(公告)日：1993-10-27
申请号：EP88908520.5
申请日：1988-08-19
发明人： RICE, James, M.
CPC分类号： C25D3/562 , C23F1/02 , H01C17/16 , H05K1/167 , H05K3/067 , H05K3/384 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , H05K2203/0392 , H05K2203/0723 , H05K2203/124 , Y10S205/92 , Y10S428/901 , Y10T428/12778 , Y10T428/24917
摘要： An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
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13.发明公开Resistive metal layers and method for making same 失效Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung。
公开(公告)号：EP0530003A1
公开(公告)日：1993-03-03
申请号：EP92307753.1
申请日：1992-08-26
CPC分类号： H01C7/006 , H01C17/06 , H01C17/16 , H05K1/167 , H05K3/022 , H05K3/06 , H05K3/384 , H05K2201/0323 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723 , Y10T428/12438 , Y10T428/12535
摘要： Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000 Ω per square.
摘要翻译： 公开了电沉积的平面电阻层，其可以与导电层和绝缘层组合以产生用于制备印刷电路板的层压板。 电阻层通过电镀从包含常规导电金属组分的源和非金属电阻增加添加剂的源的电镀浴制备。 可以制造平面电阻器，其具有在约15至约1000欧姆每平方的范围内的薄层电阻。
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14.发明公开Resistive metal layers and method for making same 失效Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung。
公开(公告)号：EP0330210A2
公开(公告)日：1989-08-30
申请号：EP89103215.3
申请日：1989-02-23
CPC分类号： H05K1/167 , H01C7/006 , H01C17/16 , H05K3/384 , H05K2201/0323 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723
摘要： Electrodeposited planar resistive layers comprising nickel·sulfur and chromium·carbon·oxygen composites (10) are provided. The planar resistors may be combined with conductive layers (10) and insulative layers (12) to produce laminates (10) useful in the preparation of printed circuit boards. The resistive layers (16) are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 Ω per square.
摘要翻译： 提供了包含镍硫和铬碳氧合物（10）的电沉积平面电阻层。 平面电阻器可以与导电层（10）和绝缘层（12）组合以产生用于制备印刷电路板的层压板（10）。 电阻层（16）由含有通常导电金属成分源和非金属电阻增加添加剂源如氧，碳和/或硫的电镀浴电镀制备。 平面电阻器具有在约15至约1000欧姆每平方的范围内的薄层电阻。
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公开(公告)号：EP0240206A3
公开(公告)日：1988-12-14
申请号：EP87302357
申请日：1987-03-19
CPC分类号： H01C7/021 , H01C17/16 , H01C17/23 , H01C17/265 , Y10T29/49083
摘要： A temperature-sensitive resistance element comprises an alumina substrate (l) having terminals (3) and a sinuous temperature-sensitive resistance layer (2) thereon. The layer (2) and terminals (3) are formed of electroplated palladium which has been recrystallised.
摘要翻译： 温度敏感电阻元件包括其上具有端子（3）的氧化铝基底（1）和其上的弯曲温度敏感电阻层（2）。 层（2）和端子（3）由已经重结晶的电镀钯形成。
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公开(公告)号：EP0224572A1
公开(公告)日：1987-06-10
申请号：EP86903927.0
申请日：1986-05-28
发明人： RICE, James, M. , MAHLER, Bruce, P.
CPC分类号： H01C7/006 , C25D3/562 , H01C17/16 , H05K1/167 , H05K3/022 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723 , Y10T428/12854
摘要： Matériau à couches multiples pour cartes de circuits et son procédé de fabrication. Le matériau comprend une couche de support en matériau isolant, une couche en matériau de résistance électrique adhérant à la couche de support et une couche de matériau conducteur adhérant à la couche en matériau de résistance, en contact étroit avec celle-ci. La couche en matériau de résistance électrique comprend du nickel-phosphore électroplaqué contenant jusqu'à 30% en poids de phosphore; cependant, des quantités significatives de soufre sont absentes dans au moins les dix couches atomiques supérieures de la couche en matériau de résistance électrique. Par conséquent, la stabilité du matériau de résistance électrique s'accroît sensiblement. En outre, le bain d'électroplaquage ne contient pas de sels de chlorure, ce qui réduit la formation d'alvéoles dans la couche en matériau de résistance électrique.
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