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    CIRCUIT BOARD MATERIAL AND PROCESS OF MAKING.
    5.
    发明公开
    CIRCUIT BOARD MATERIAL AND PROCESS OF MAKING. 失效
    SHEET材料，电路及其生产。

    公开(公告)号：EP0224572A4

    公开(公告)日：1989-02-02

    申请号：EP86903927

    申请日：1986-05-28

    申请人： OHMEGA TECHNOLOGIES INC

    发明人： RICE JAMES M ,  MAHLER BRUCE P

    IPC分类号： C25D3/12 ,  C25D3/56 ,  H01C7/00 ,  H01C17/16 ,  H05K1/16 ,  H05K3/02 ,  H05K3/18

    CPC分类号： H01C7/006 ,  C25D3/562 ,  H01C17/16 ,  H05K1/167 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  Y10T428/12854

    摘要： An improved multilayered circuit board material and process for making that material. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.

    Resistive metal layers and method for making same
    6.
    发明公开
    Resistive metal layers and method for making same 失效
    Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung

    公开(公告)号：EP1011111A1

    公开(公告)日：2000-06-21

    申请号：EP99124541.6

    申请日：1989-02-23

    申请人： Gould Electronics Inc.

    发明人： Clouser, Sidney J. ,  Lee, Chinho ,  Prokop, Mary Katherine ,  Whewell, Christopher J.

    IPC分类号： H01C7/00 ,  H01C17/16 ,  H05K1/16

    CPC分类号： H05K1/167 ,  H01C7/006 ,  H01C17/16 ,  H05K3/384 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/0723

    摘要： Electrodeposited planar resistive layers comprising nickel·sulfur and chromium·carbon·oxygen composites are provided. The planar resistors may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 Ω per square.

    摘要翻译： 提供了包括镍硫化物和碳氧化合物复合材料的电沉积平面电阻层。 平面电阻器可以与导电层和绝缘层组合以产生用于制备印刷电路板的层压板。 电阻层通过电镀从包含常规导电金属组分的源和非金属电阻增加添加剂源如氧，碳和/或硫的电镀浴制备。 平面电阻器具有在约15至约1000欧姆每平方的范围内的薄层电阻。

    METALLIC FILM RESISTOR HAVING FUSING FUNCTION AND METHOD FOR ITS MANUFACTURE
    8.
    发明公开
    METALLIC FILM RESISTOR HAVING FUSING FUNCTION AND METHOD FOR ITS MANUFACTURE 失效
    METALLSCHICHTWIDERSTAND MIT SCHMELZFUNKTION UND HERSTELLUNGSVERFAHREN。

    公开(公告)号：EP0664547A1

    公开(公告)日：1995-07-26

    申请号：EP94914587.4

    申请日：1994-05-02

    申请人： KIYOKAWA MEKKI KOUGYO CO., LTD

    发明人： KIYOKAWA, Tadashi

    IPC分类号： H01C13/00 ,  H01C17/16

    CPC分类号： H01C7/006 ,  H01C17/16 ,  H01H69/022 ,  H01H85/046 ,  H01H85/048 ,  H05K1/0293 ,  H05K1/167

    摘要： This film resistor is formed of an alloy whose principal components are nickel and phosphorus. On the surface of an electrically insulating base made of ceramic or the like, a conductor is provided by etching, activating, and electroless plating in that order. Then an alloy film whose principal components are nickel and phosphorus is formed not by electroless plating, but by electroplating. By adapting electroplating, it is possible to make the alloy film thinner in the central part of the surface of the insulating base than the parts of the edges. If an overcurrent is applied, fusing starts preferably at this thin part.

    摘要翻译： 该薄膜电阻由主要成分为镍和磷的合金形成。 在由陶瓷等制成的电绝缘基体的表面上，通过蚀刻，激活和化学镀依次提供导体。 然后，其主要成分是镍和磷的合金膜不是通过无电镀形成，而是通过电镀形成的。 通过适应电镀，可以使绝缘基材表面的中心部分的合金薄膜比边缘的部分更薄。 如果施加过电流，则优选在该薄部分进行熔合。