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公开(公告)号:EP3586059A1
公开(公告)日:2020-01-01
申请号:EP18709241.6
申请日:2018-02-24
IPC分类号: F21V7/00 , F21V14/02 , F21V14/04 , F21Y109/00 , F21Y105/16 , F21Y115/10
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公开(公告)号:EP3465844A1
公开(公告)日:2019-04-10
申请号:EP17725943.9
申请日:2017-05-23
发明人: BECHTEL, Hans-Helmut , HECHTFISCHER, Ulrich , DIEDERICH, Thomas , HEIDEMANN, Matthias , VAN DER VEEN, Niels, Jeroen
IPC分类号: H01S5/00 , F21K9/64 , F21Y109/00
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公开(公告)号:EP4357669A1
公开(公告)日:2024-04-24
申请号:EP22824822.5
申请日:2022-06-02
发明人: TADA, Reiki , HANYA, Akihiko
IPC分类号: F21V19/00 , F21Y107/70 , F21Y109/00 , F21Y115/10 , F21Y115/30 , F21S41/19
CPC分类号: F21V19/00 , F21S41/19 , F21Y2115/1020160801 , F21Y2109/0020160801 , F21Y2115/3020160801 , F21Y2107/7020160801
摘要: Provided is an on-vehicle illumination device which is compact, does not have a space therein, and is capable of realizing a complex curved surface shape. The on-vehicle illumination device includes a light-emitting element disposed on a wiring pattern on a substrate, and an outer lens layer made of a resin and mounted on the light-emitting element. The substrate has a shape curved along a curvature of the outer lens layer in a front-rear direction.
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公开(公告)号:EP3415807B1
公开(公告)日:2024-02-28
申请号:EP18185878.8
申请日:2013-05-29
发明人: Pan, Shyi-ing , Cheng, Wei-Kang , Huang Chih-Shu , Lee, Chen-Hong , Yeh, Shih-Yu , Pu, Chi-Chih , Yang, Cheng-Kuang , Tang, Shih-Chieh , Hong, Siang-Fu , Wang, Tzu-Hsiang
IPC分类号: F21K9/232 , H01L25/075 , H01L27/15 , H01L33/44 , H01L33/48 , H01L33/50 , H01L33/62 , F21K9/27 , F21K9/65 , F21Y107/00 , F21Y107/50 , F21Y109/00 , F21Y115/10 , H01L23/00 , H01L33/00
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公开(公告)号:EP4270498A3
公开(公告)日:2023-12-27
申请号:EP23186332.5
申请日:2021-02-26
申请人: Signify Holding B.V.
IPC分类号: F21K9/232 , F21V3/04 , H01L25/075 , F21Y115/10 , F21Y113/13 , F21Y103/10 , F21Y109/00 , H01L33/02 , H01L33/54
摘要: The present invention relates to a color tunable and/or color temperature tunable LED filament (20, 22, 24), said LED filament comprising an elongated carrier (220), said elongated carrier comprising a first major surface (222) and a second major surface (224) arranged opposite to said first major surface, a plurality of LEDs (210) arranged in at least one linear array on said first surface of said elongated carrier, wherein the plurality of LEDs includes LEDs of different colors and/or different color temperatures, a first elongated transparent or substantially transparent layer (230) covering the plurality of LEDs on the first major surface and also at least partly covering said first major surface, and a first elongated light scattering layer (240), arranged to at least partially cover said first transparent or substantially transparent layer.
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公开(公告)号:EP3962781B1
公开(公告)日:2023-11-29
申请号:EP20725668.6
申请日:2020-05-06
发明人: SONNLEITNER, Tobias , SÜß, Thorsten , JAHN, Thomas
IPC分类号: B60Q3/78 , F21V11/14 , F21V5/00 , F21V8/00 , B60Q3/54 , B60R13/02 , F21Y109/00 , F21Y115/10 , F21Y113/10 , F21Y103/20
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公开(公告)号:EP4237742A1
公开(公告)日:2023-09-06
申请号:EP21798348.5
申请日:2021-10-20
申请人: Signify Holding B.V.
IPC分类号: F21K9/00 , F21Y105/12 , F21Y109/00 , F21Y113/10 , F21Y115/10
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公开(公告)号:EP3321565B1
公开(公告)日:2020-03-04
申请号:EP16726474.6
申请日:2016-01-05
发明人: YIN, Zhi
IPC分类号: G02F1/1335 , F21V8/00 , F21Y109/00
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公开(公告)号:EP3454369A1
公开(公告)日:2019-03-13
申请号:EP18196452.9
申请日:2013-05-29
申请人: Epistar Corporation
发明人: PAN, Shyi-Ming , CHENG, Wei-Kang , HUANG, Chih-Shu , LEE, Chen-Hong , YEH, Shih-Yu , PU, Chi-Chih , YANG, Cheng-Kuang , TANG, Shih-Chieh , HONG, Siang-Fu , WANG, Tzu-Hsiang
IPC分类号: H01L25/075 , H01L33/50 , F21Y107/50 , F21Y109/00 , F21Y115/10 , H01L33/64
摘要: A light emitting element (1; 310) includes a transparent substrate (2) and a plurality of light emitting diode (LED) chips (3; 14). The transparent substrate (2) has a support surface (210) and a second main surface (21B) disposed opposite to each other. At least some of the LED chips (3; 14) are disposed on the support surface (210) and light emitting surfaces (34) of the LED chips (3; 14) and at least a part of the support surface (210) form a first main surface (21A) where light is emitted from. Each of the LED chips (3; 14) includes a first electrode (16; 31A) and a second electrode (18; 31B). Light emitted from at least one of the LED chips (3; 14) passes through the transparent substrate (2) and emerges from the second main surface (21B). An illumination device (10; 10'; 11; 50; 301; 302; 303; 304) includes at least one light emitting element (1; 310) and a supporting base (5; 26; 324). The light emitting element (1; 310) is disposed on the supporting base (5; 26; 324), and an angle is formed between the light emitting element (1; 310) and the supporting base (5; 26; 324).
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公开(公告)号:EP3406961A1
公开(公告)日:2018-11-28
申请号:EP18159107.4
申请日:2018-02-28
IPC分类号: F21K9/90 , F21V23/06 , B32B17/10 , F21Y115/10 , F21Y105/10 , F21Y109/00
CPC分类号: H01L25/13 , B32B17/10036 , B32B17/10541 , F21K9/90 , F21V19/002 , F21V23/001 , F21V23/06 , F21Y2105/10 , F21Y2105/16 , F21Y2109/00 , F21Y2115/10 , H01L33/483 , H01L33/62 , H01L2933/0066
摘要: A light-emitting device (100) includes:
- a flexible, light-permeable laminar substrate (102) of e.g. a plastic material such as polyethylene naphtalate - PEN,
- a distribution of laminar electrically-powered light radiation sources (100a) such as LEDs of the Chip Scale Package - CSP type on the laminar substrate (102),
- a layout of laminar e.g. ink-printed, electrically-conductive traces (102a) on the laminar substrate (102) serving the electrically-powered light radiation sources (100a).
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