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公开(公告)号：EP4227341A1
公开(公告)日：2023-08-16
申请号：EP21877492.5
申请日：2021-09-30
IPC分类号： C08G59/06 , C08G59/62 , C08G59/68 , C08L83/04 , C08L101/00 , C08L63/00 , H01F1/26 , C08K3/08
摘要： A resin molding material of the present invention contains (A) soft magnetic particles, (B) a silica fine powder having an average particle diameter of equal to or more than 0.1 um and equal to or less than 2.0 um, and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass, and a content of the silica fine powder (B) is equal to or less than 1.5% by mass.
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公开(公告)号：EP4204510A1
公开(公告)日：2023-07-05
申请号：EP21878719.0
申请日：2021-10-05
发明人： KEEHAN, Donald J. , YANG, Joey , XIONG, Cheng , PASATTA, Jeremy
IPC分类号： C09J163/08 , C08G59/38 , C09D163/04 , B32B15/092 , C08G59/68 , C08G59/50 , B32B1/02 , B32B27/38
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公开(公告)号：EP3938420B1
公开(公告)日：2023-06-07
申请号：EP20709586.0
申请日：2020-03-10
发明人： SIMON, Hubert , RUDIN, Markus , MULLOT, Nicolas
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公开(公告)号：EP3569626B1
公开(公告)日：2023-03-01
申请号：EP18738683.4
申请日：2018-01-09
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公开(公告)号：EP3567065B1
公开(公告)日：2023-03-01
申请号：EP19173065.4
申请日：2019-05-07
发明人： Kim, Yun Ju , Chun, Hyun Aee , Park, Su Jin , Park, Sook Yeon
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公开(公告)号：EP4130094A1
公开(公告)日：2023-02-08
申请号：EP20929256.4
申请日：2020-04-24
申请人： Namics Corporation
发明人： NAKAI, Yuya , YAMAGUCHI, Takashi
IPC分类号： C08G59/68 , C08G59/40 , C09J163/00 , H01L23/29 , H01L23/31
摘要： An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R 1 is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R 2 and R 3 are each independently a group selected from hydrogen and C1-C6 alkyls.)
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18.发明公开
公开(公告)号：EP4127019A1
公开(公告)日：2023-02-08
申请号：EP21711886.8
申请日：2021-03-17
申请人： BASF Coatings GmbH
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公开(公告)号：EP4127017A1
公开(公告)日：2023-02-08
申请号：EP21713042.6
申请日：2021-03-23
发明人： LALEVÉE, Jacques , MOKBEL, Haifaa , KAVALLI, Tuba , WOLF, Romain
IPC分类号： C08G59/24 , C08G59/42 , C09J163/00 , C08G59/40 , C08G59/68
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公开(公告)号：EP4050061A1
公开(公告)日：2022-08-31
申请号：EP21159691.1
申请日：2021-02-26
申请人： Henkel AG & Co. KGaA
IPC分类号： C08J3/24 , C08G59/68 , C08G65/10 , C08G65/18 , C08J3/28 , C08L63/00 , C09J11/04 , C09J11/06 , C09J163/00
摘要： The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition:
from 1 to 10 wt.% of a) at least one oxetane compound according to Formula (I) below:
wherein: R 1 and R 2 are H, C 1 -C 6 alkyl, C 6 -C 18 aryl or C 7 -C 18 aralkyl;
each R 3 is independently a C 1 -C 12 alkylene group, C 6 -C 18 arylene group, C 2 -C 12 alkenylene group or a poly(C 1 -C 6 alkyleneoxy) group; and,
n is an integer of from 1 to 3;
from 5 to 20 wt.% of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt.% of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide;
from 0.1 to 5 wt.% of c) at least one ionic photoacid generator;
from 0 to 10 wt.% of d) at least one free radical photoinitiator;
from 0.01 to 5 wt.% of e) at least one near-infrared absorbing dye; and,
from 50 to 90 wt.% of f) particulate filler.
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