Abstract:
An automated defect inspection system (10) has been invented and is used to inspect patterned wafers, whole wafers, broken wafers, partial wafers, waffle packs, MCMs, etc. The inspection system is specifically intended and designed for second optical wafer inspection for such defects as metalization defects, such as scratches, voids, corrosion and bridging, as well as diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
Abstract:
A stereoscopic three-dimensional optical metrology system (100) and method accurately measure the location of physical features (129) on a test article (120) in a manner that is fast and robust to surface contour discontinuities. Disclosed embodiments may image a test article (120) from two or more perspectives through a substantially transparent fiducial plate (190) bearing a fiducial marking (199); camera (111,112) viewing angles and apparent relative distances between a feature on a test article (120) and one or more fiducials (199) may enable accurate calculation of feature position.
Abstract:
Disclosed are methods and apparatus for reducing thermal loading of a film (220) disposed while measuring the thickness of the film in an area about a measurement site. The method includes steps of bringing an optical assembly of the measurement system (75) into focus, aligning a beam spot with the measurement site, turning on one of a dither EOM (205) of a dither AOM of a piezo-electric dither assembly to sweep the beam spot in an area about the measurement site, thereby reducing the thermal loading within the measurement site, making a measurement data to determine an average film thickness in the measurement area.