公开(公告)号：EP2973677A1

公开(公告)日：2016-01-20

申请号：EP14770295.5

申请日：2014-02-20

申请人： Applied Materials, Inc.

发明人： GAJENDRA, Manoj A.

IPC分类号： H01L21/68

CPC分类号： H01L21/681 ,  H01L21/67242 ,  H01L21/68 ,  Y10S414/136

摘要： A substrate position aligner includes a substrate holding assembly, a plurality of rollers, a rotation mechanism, and a sensor. The substrate holding assembly is configured to hold a substrate in a vertical orientation. The plurality of rollers include at least two idler rollers and a drive roller. Each roller has a point on its perimeter spaced on a common radius from a center of substrate rotation defined within the substrate holding assembly. The sensor is positioned approximately on the common radius and configured to detect the presence of an orientation cut in the substrate when the orientation cut is not orientated within a range between about - 44 degrees and about + 44 degrees from horizontal. A method of aligning a substrate having an orientation cut includes sensing a presence of the orientation cut when the orientation cut is not orientated within the above recited range.

摘要翻译： 基板位置调准器包括基板保持组件，多个滚轮，旋转机构以及传感器。 衬底保持组件被配置为以垂直方向保持衬底。 多个辊包括至少两个惰辊和驱动辊。 每个滚筒在其周边上具有与衬底保持组件内限定的衬底旋转中心在同一半径上的点。 传感器大致位于公共半径上并被配置为当定向切割未定向在与水平线成大约-44度至大约+44度之间的范围内时检测在基板中存在定向切割。 对准具有定向切割的衬底的方法包括当定向切割未定向在上述范围内时感测定向切割的存在。

公开(公告)号：EP1965411A3

公开(公告)日：2012-08-08

申请号：EP08009497.2

申请日：1999-07-28

申请人： CANON KABUSHIKI KAISHA

发明人： Korenaga, Nobushige ,  Ebinuma, Ryuichi

IPC分类号： H01L21/00 ,  G03F7/20

CPC分类号： H01L21/67242 ,  G03F7/70725 ,  H01L21/68

摘要： A stage system includes a stage being movable in a predetermined direction, a first unit for applying a force to the stage in the predetermined direction, a moving mechanism for moving one of the first unit and a structure including the first unit, a first measuring system for measuring at least one of the position and movement amount of the stage, and a second measuring system for measuring at least one of the position and movement amount of one of the first unit and the structure, wherein the stage is controlled on the basis of a measured value of the first measuring system, and wherein the moving system is controlled on the basis of a measured value of the second measuring system.

公开(公告)号：EP2191411A4

公开(公告)日：2011-06-22

申请号：EP08795382

申请日：2008-08-15

申请人： NCR CORP

发明人： SUORSA PETER A ,  HOLZ JOHN B ,  ROTH JOSEPH D

IPC分类号： G06F21/24 ,  G06Q10/00

CPC分类号： H01L21/67242 ,  B41J2/442 ,  B65D75/327 ,  B65D2203/00 ,  G06K7/14 ,  G06Q10/08 ,  G06Q50/22

摘要： A package is provided for use with a track-and-trace data management system. The package comprises a base defining a plurality of compartments, each compartment containing an item, and a cover enclosing the compartments to retain each item inside a respective compartment. Each item carries a unique item code, and the package includes at least one unique security code. The relationship between the unique item code and the at least one unique security code is maintained by the data management system.

公开(公告)号：EP1748867A4

公开(公告)日：2009-11-25

申请号：EP05743290

申请日：2005-05-23

申请人： EBARA CORP

发明人： TADA MITSUO ,  SUTO YASUNARI ,  ICHIHARA HIROFUMI ,  ITO KENYA ,  TAKAHASHI TAMAMI

IPC分类号： B24B9/06 ,  B24B9/00 ,  B24B49/12 ,  G01B11/30 ,  G01N21/95 ,  G01N21/956 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/67242 ,  B24B9/065 ,  B24B49/12 ,  G01N21/9501 ,  G01N29/44 ,  H01L21/67023 ,  H01L21/67075

公开(公告)号：EP1306886B1

公开(公告)日：2008-07-30

申请号：EP01124912.5

申请日：2001-10-18

申请人： Infineon Technologies AG

发明人： Ottow, Stefan, Dr. ,  Steuer, Ulf

IPC分类号： H01L21/00 ,  H01L21/66 ,  H01L21/306

CPC分类号： H01L21/67086 ,  H01L21/31111 ,  H01L21/67242

公开(公告)号：EP1921671A1

公开(公告)日：2008-05-14

申请号：EP06746964.3

申请日：2006-05-29

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： SEGAWA, Terutsugu, c/o Matsushita Electric Industrial Co., Ltd ,  SANADA, Minoru, c/o Matsushita Electric Industrial Co., Ltd

IPC分类号： H01L21/66

CPC分类号： H01L21/67248 ,  G01R31/2874 ,  H01L21/67103 ,  H01L21/67242 ,  H01L21/67288

摘要： A temperature regulation plate 106 is divided into at least two areas, a heater 408 for applying a temperature load in correspondence with such areas and its control system are divided and controlled independently to set temperatures, and a cooling source is controlled by comparing the measurements from temperature sensors 409 arranged in respective areas for controlling the heater 408 and switching the measurement for calculating the control output sequentially thus reducing variation in in-plane temperature of a wafer due to heating when an electric load is applied. Since consumption and burning of a probe are prevented, highly reliable wafer level burn-in method and apparatus can be provided.

摘要翻译： 温度调节板106被分成至少两个区域，加热器408用于对应于这些区域施加温度负荷，并且其控制系统被独立地分开和控制以设定温度，并且通过将来自 温度传感器409布置在用于控制加热器408的相应区域中，并且顺序地切换用于计算控制输出的测量值，从而当施加电负载时减少由于加热导致的晶片的面内温度的变化。 由于防止了探测器的消耗和燃烧，因此可提供高可靠性的晶片级老化方法和装置。

公开(公告)号：EP1637892A4

公开(公告)日：2006-08-02

申请号：EP03736028

申请日：2003-06-04

申请人： ADVANTEST CORP

发明人： NAKAMURA HIROTO

IPC分类号： G01R31/28 ,  G01R31/01 ,  H01L21/00 ,  H01L21/673

CPC分类号： G01R31/2862 ,  G01R31/01 ,  G01R31/2808 ,  G01R31/2817 ,  H01L21/67242 ,  H01L21/6734

摘要： An electronic component handling device and a method for temperature application in the electronic component handling device, the device comprising a handler (1) capable of circulating strip formats (2); the method comprising the steps of storing the plurality of strip formats (2) in magazines (3), feeding the magazines into a thermostatic oven (15), and applying a specified temperature to the strip formats (2) stored in the magazines(3), whereby the thermostatic oven (15) can be downsized and simplified, and the maintainability thereof can be increased.

公开(公告)号：EP1393354A1

公开(公告)日：2004-03-03

申请号：EP02743086.7

申请日：2002-05-23

申请人： Mattson Thermal Products GmbH

发明人： HAUF, Markus ,  STRIEBEL, Christoph

IPC分类号： H01L21/00 ,  G01J5/06 ,  C23C16/48 ,  H05B3/00 ,  C30B31/12

CPC分类号： H01L21/67248 ,  C23C16/481 ,  C30B31/12 ,  C30B33/02 ,  H01L21/67115 ,  H01L21/67242 ,  H05B3/0047 ,  Y10T29/41

摘要： The object of the invention is to measure temperature using pyrometers, in a simple and economic way, enabling precise temperature measurement, even for low temperatures. The invention presents a device and method for thermally treating substrates, wherein the substrate is exposed to at least a first and at least a second radiation; the predetermined wavelengths of the first radiation are absorbed between the first radiation source and the substrate; a radiation from the substrate is measured in the predetermined wavelength using a radiation detector arranged on the same side as a second radiation source; the second radiation from the second radiation source is modulated and determined.

公开(公告)号：EP0704106B1

公开(公告)日：2003-01-29

申请号：EP95916425.2

申请日：1995-04-17

申请人： MICRON TECHNOLOGY, INC.

发明人： FARNWORTH, Warren, M. ,  FOLARON, Jennifer, L. ,  FOLARON, Robert, J. ,  HEMBREE, David, R. ,  JACOBSON, John, O. ,  NELSON, Jay, C. ,  WARREN, Lelan, D.

IPC分类号： H01L21/00 ,  H05K13/08

CPC分类号： H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： An apparatus for automatically positioning electronic die within temporary packages to enable continuity testing and the like between the die bond pads and the temporary package electrical interconnects is provided. The apparatus includes a robot having a programmable robot arm with a gripper assembly, die and lid feeder stations, a die inverter, and a plurality of cameras or image producers. The cameras take several pictures of the die and temporary packages to precisely align the die bond pads with the temporary package electrical interconnects. A predetermined assembly position is located along a conveyor that conveys a carrier between a first position, corresponding to an inlet, and a second position, corresponding to an outlet. The die, a restraining device and temporary package are assembled at the predetermined assembly position and tested for continuity therebetween. The apparatus further includes a fifth camera which locates the die at a wafer handler. The apparatus has a control mechanism including a microprocessor and associated program routines that selectively control the robot arm (i) to move the gripper assembly to the lid feeder station to pick up a lid, (ii) to move the gripper assembly along with the lid to pick up the die following photographing by the rough die camera, (iii) to move the gripper assembly along with the lid and the die to a position to be photographed by the fine die camera, and (iv) to move the lid and the die to the predetermined assembly position located along the conveyor. The method and apparatus may also be used for disassembly.

公开(公告)号：EP0906174B1

公开(公告)日：2002-08-28

申请号：EP97925193.1

申请日：1997-06-11

申请人： Unova U.K. Limited

发明人： STOCKER, Mark, Andrew ,  FALKNER, Dermot, Robert ,  MORANTZ, Paul, Mastin, Howard ,  PIERSE, Michael, George

IPC分类号： B24B41/00 ,  B23Q3/18 ,  B24B9/06 ,  B24B49/12 ,  B24B47/22

CPC分类号： B24B53/07 ,  B23Q3/186 ,  B23Q17/24 ,  B24B5/04 ,  B24B5/06 ,  B24B5/065 ,  B24B9/065 ,  B24B17/04 ,  B24B17/06 ,  B24B41/02 ,  B24B41/04 ,  B24B49/02 ,  B24B49/12 ,  H01L21/02013 ,  H01L21/02021 ,  H01L21/67242 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A workpiece alignment and shifting system for moving circular workpieces from a first inspection station to a second machining station, comprises workpiece holding means for attachment to the face of a disc workpiece to move the latter from one position to another. Robotic means controls the position of the workpiece holding means and is adapted to move in at least two orthogonal directions, both of which are parallel to the plane of the disc when it occupies the first station. The disc is rotated in the inspection station and in the machining station and inspection means determines the position of the geometric centre of the disc as it is rotated. Computing means calculates from data delivered by the inspection means the two shifts required along the orthogonal directions of movement of the robotic means, to move the geometric centre of the disc to a second desired position whose coordinates are known. The computing means includes memory means for storing the said coordinates. The coordinates are those of the centre of rotation of the workpiece holder or chuck in the said second station. The workpiece holding means is vacuum operated. A three axis robot is employed to pick and place disc-like wafers of semi-conductor material for edge grinding, and movement along two of the robot axes, X and Z, is used to control the centering of the wafer on a vacuum chuck in the second grinding station.