摘要:
A booster circuit includes a precharge capacitor (C 2 ), a precharge driver circuit (20) having a first bootstrap circuit (C 59 , Q 58 , Q 61 ) and precharging a voltage to the precharge capacitor in a reset mode, and an output driver circuit (19) having a switching circuit (Q 21 ) for cutting off the output of the precharged voltage of the precharged capacitor in the reset mode and a second bootstrap circuit driving the switching circuit in an operation mode. The booster circuit further includes an additional switching circuit (Q 1 ) for outputting a voltage to be superimposed onto the precharge voltage in the operation mode. The booster circuit may be applicable to a dynamic semiconductor memory device, for boosting a voltage of a word line at a high speed and for improving integration.
摘要:
A semiconductor memory circuit, the operating power of which is supplied by way of respective high-voltage and low-voltage lines thereof, comprises a plurality of bit line pairs (BL, BL ); a plurality of word lines (WL); memory cells (MC) located at respective points at which the word lines cross the bit lines; an internal biassing generator, provided on a substrate of the said memory circuit and deriving from the voltage between the said high-voltage and low-voltage lines a backgate voltage (V BB ), lower than the potential (V ss ) of the said low-voltage line, for biassing the said substrate; and pre-charging circuitry (PRE) arranged for charging the bit line pairs (BL, BL ), before commencement of a read operation, to a pre-charge voltage (V c ). The said pre-charge voltage (V c ) is derived from the respective potentials (V cc and V ss ) of the said high-voltage and low-voltage lines so as to be half-way between those potentials. The use of such a pre-charge voltage serves to suppress variation in the backgate voltage, which can occur in conventional memory circuits when a large change occurs in the level of a bit line potential, and thereby avoid associated errors in data read from the memory circuit.
摘要:
A semiconductor memory device having a data inverting circuit (Qa, Qb, Qc, Qd) for selectively inverting an input/ output data (Din, Dout) of a sense amplifier (SA 1 , SA 2 , ...) in such a way that the charging states of respective memory cells (MC 1,1 ,...,MC 2,1 ,...) connected to the two bit lines (BI 1 , BI 2 ,...) in each bit line pair become equal for the same input/output data, and a clamp circuit (Q 13 , Q 14 , Q 23 ,...) for drawing the potentials of all of the bit lines to a predetermined potential in response to a clear control signal (CLR), whereby the contents of all of the memory cells can be cleared at the same time.
摘要:
A semiconductor integrated circuit having first and second power supply lines (Vcc,Vss) for receiving a power supply voltage, an external input terminal (84) for receiving an input signal, and a high voltage detection circuit (6) for detecting at the external input terminal a high voltage higher than a predetermined voltage which is higher than the power supply voltage. The high voltage detection circuit (6) comprises an input circuit (61) connected to the external input terminal (84) for generating a detection voltage; a reference voltage generating circuit (Q31-Q34) for generating a reference voltage; and a differential voltage amplifier (62) connected to receive the detection voltage and the reference voltage for amplifying the difference between the detection voltage and the reference voltage, to thereby determine whether the high voltage is applied. The input circuit comprises a level shift element (Q21-Q25) connected to the external input terminal (84) for providing the detection voltage; an impedance element (Q26-Q27) connected between the level shift element and the second power supply line (Vss); and a leak current compensating element (Q28,Q29) connected between the first power supply line (Vcc) and the level shift element for allowing a current to flow from the first power supply line through the leak current compensating element and the impedance element to the second power supply line when the high voltage is not applied to the external input terminal.
摘要:
A semiconductor integrated circuit device having a fuse-blown type ROM for storing information concerning defective bits for the replacement of defective bits in a semiconductor memory device, etc., with redundant bits. The integrated circuit device comprises fuses (F,) for constituting the ROM, pads (PB) for supplying a melting current to the fuses, and PN junctions (D 1 ) each being formed, for example, by a semiconductor substrate and a diffusion layer formed on the semiconductor substrate. Each of the fuses is melted by applying voltage to a circuit connecting the PN junction (D i ), the fuse (F 1 ), and the pad (PB) so that the PN junction (D i ) is forward biased, and thereby, supplying a large current to the fuse.
摘要:
A semiconductor memory device capable of compensating for variation in a discriminating voltage of a memory cell comprising a memory cell (MC) and a gate circuit (Qs) for coupling the memory cell to a bit line (WL). The device has a precharge circuit for precharging the bit line pair to a predetermined resultant precharge voltage in a reset state. The precharge circuit (Q5, Q6, Q4, Cps, Q7) precharges a bit line pair with the resultant precharge voltage (Vcc/2 + α) obtained by adding a compensating voltage to a precharge voltage in the reset state. The compensating voltage is adapted to compensate for variation in a memory cell discriminating voltage based on variation in a memory cell voltage caused by capacitive coupling of a word line to a memory capacitor due to a parasitic capacitance of a gate circuit in the active state, and the precharge voltage is adapted to optimize the memory cell discriminating voltage when it is assumed that the parasitic capacitance is not present.