COMPOSITION, CURABLE COMPOSITION, AND CURED PRODUCT

    公开(公告)号:EP4053214A1

    公开(公告)日:2022-09-07

    申请号:EP20899432.7

    申请日:2020-11-25

    IPC分类号: C08L63/00 C08K5/1515

    摘要: Provided is a composition having excellent compatibility with a fluorine-free epoxy resin even though the composition contains a fluorine-containing epoxy resin. The composition contains:
    a compound (D) represented by the following formula (D):

    wherein m is an integer of 0 to 6; p is 0 or 1; q is an integer of 0 to 6; Rf is a C1-C8 perfluoroalkyl group optionally containing oxygen with one fluorine atom being optionally replaced by a hydrogen atom, and a compound (E) represented by the following formula (E):

    wherein n is an integer of 0 or greater; and M is a group represented by the following formula (E1):

    a group represented by the following formula (E2):

    or a group represented by the following formula (E3):

    wherein Z is hydrogen or a C1-C10 fluoroalkyl group.

    HOLLOW FINE PARTICLE PRODUCTION METHOD AND HOLLOW FINE PARTICLES

    公开(公告)号:EP3967715A1

    公开(公告)日:2022-03-16

    申请号:EP20801443.1

    申请日:2020-04-03

    IPC分类号: C08F20/22 C08F2/26

    摘要: The disclosure provides a method for producing hollow fine particles containing a fluorine-containing resin and having a large average particle size. The method for producing hollow fine particles containing a fluorine-containing resin includes a step A of providing hollow fine particles by dispersing a solution containing a fluorine-containing monomer, an oil-soluble initiator, and a non-polymerizable solvent in water containing a fluorine-containing surfactant and thereby polymerizing the fluorine-containing monomer.

    FLUORINE-CONTAINING EPOXY RESIN FOR ELECTRICAL MATERIALS AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:EP3960788A1

    公开(公告)日:2022-03-02

    申请号:EP20821998.0

    申请日:2020-05-27

    IPC分类号: C08G59/02 C08G59/30

    摘要: Provided is a fluorine-containing epoxy resin for an electronic component, having a low permittivity and a low dissipation factor as well as a small coefficient of linear expansion. The fluorine-containing epoxy resin for an electronic component is represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being


    the formula (E2) being

    the formula (E3) being