摘要:
Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
摘要:
The present invention relates to a method of preparing a composition comprising: combining a resin system, a filler system at least a portion of which is an inorganic material comprising nanoscopic particles having an average primary particle size of no greater than about 50 nm, and an initiator system to form a mixture; forming the mixture into a hardenable self-supporting structure having a first shape; wherein the hardenable self-supporting structure having a first shape has sufficient malleability to be formed into a second shape.
摘要:
This invention provides a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100°C to 200°C, molding pressure of not more than 20MPa, and molding time of 60 to 120 sec is not more than 5mmabd the light reflectance after heat curing at a wavelength of 350 nm to 800nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.
摘要:
This invention provides a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100°C to 200°C, molding pressure of not more than 20MPa, and molding time of 60 to 120 sec is not more than 5mmabd the light reflectance after heat curing at a wavelength of 350 nm to 800nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.
摘要:
A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by:
R 11 -COO-R 12 (1)
wherein R 11 and R 12 are C n H 2n+1 , and n is 1 to 30 and a compound represented by:
wherein R 1 , R 2 , and R 3 are selected from H, -OH, -OR, and -OCOC a H b with the proviso that at least one includes -OCOC a H b ; R is C n H zn+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译:一种热固性环氧树脂组合物,其包含(A)三嗪衍生物环氧树脂和酸酐的反应混合物,其中所述环氧基当量相对于酸酐当量为0.6-2.0; (B)内部脱模剂; (C)反射材料; (D)无机填料; 和(E)固化催化剂。 组分(B)的内部脱模剂包括由以下物质表示的羧酸酯:ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 11 -COO-R 12€ƒ€ƒ€ƒ€ƒ (1)其中R 11和R 12为C n H 2n + 1,n为1至30,由下式表示的化合物:其中R 1,R 2和R 3选自H,-OH,-OR, 和-OCOC a H b,条件是至少一个包括-OCOC a H b; R为C n H zn + 1(其中n为1〜30的整数),a为10〜30,b为17〜61。
摘要:
A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties. The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1): (where each of R 1 and R 2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof), and compound B having a glycidyl group in its molecule. The compound A is preferably a compound resulting from replacement of from at least one to at most n glycidyl groups among n glycidyl groups in a molecule (where n is an integer of from 2 to 16) with the functional group of the formula (1). The compound B is preferably a compound having n glycidyl groups (where n is an integer of from 2 to 16) in its molecule.
摘要:
A method for enhancing the rate of a first biodegradable polyhydroxyalkanoate comprising a copolymer, or a blend thereof, of at least two randomly repeating monomer units (RRMU), wherein the first RRMU has the structure (I) wherein R1 is H, or C1 or C2 alkyl, and n is 1 or 2; and the second RRMU is different from the first RRMU and comprises at least one monomer selected from the group consisting of the structures (II) wherein R2 is a C3-C19 alkyl or C3-C19 alkenyl, and (III) wherein m is from 2 to about 16, and wherein the copolymer has a melting point Tm1, by solution blending or melt blending the first biodegradable polyhydroxyalkanoate with (b) a second crystallizable biodegradable polyhydroxyalkanoate homopolymer or copolymer, which comprises at least one randomly repeating monomer unit having the structure (IV) wherein R3 is H, or C1 or C2 alkyl, and p is 1 or 2. The second biodegradable polyhydroxyalkanoate has a melting point Tm2, wherein Tm2 is at least about 20 °C greater than Tm1. Methods for forming shaped articles from the blending of components (a) and (b) are also disclosed.
摘要:
Compositions, particularly for forming dental products, having a hardenable self-supporting structure with sufficient malleability to be subsequently customized into a second shape and then hardened, and methods.
摘要:
The invention provides a thermosetting powder coating composition comprising (A) a vinyl copolymer having a number average molecular weight of 1,500 to 6,000, a molecular weight distribution of 1.0 to 1.5 as represented by a weight average molecular weight/a number average molecular weight and a glass transition temperature of 40 to 100°C, the copolymer containing at least one species of functional group selected from the class consisting of epoxy group, carboxyl group and hydroxyl group, and (B) a curing agent. The thermosetting powder coating composition of the invention is superior in any of the finished appearance of coating film and the blocking resistance.
摘要:
A medical material, an intermediate (polymeric material) therefor and a process for their production are disclosed. The medical material comprises a polymeric material having many epoxy groups bound to the functional groups of a polymer having functional groups capable of binding with an epoxy group and to the amino group of a compound having two or more amino groups whose amino group not binding with an epoxy group is bound to an epoxy group of a heparin derivative wherein the epoxy group of an epoxy compound having two or more epoxy groups is bound to the amino groups of heparin. This material carries heparin in a large amount without losing its activity and has excellent biocompatibility. The intermediate and the process help to increase the advantages of the above-described medical material.