摘要:
Provided herein is technology relating to polymer composite materials and particularly, but not exclusively, to graphene-polymer composite materials and methods for producing graphene-polymer composite materials by exfoliating graphite directly in a resin such as a liquid thermoset resin.
摘要:
It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).
摘要:
The present invention relates to a method of preparing a composition comprising: combining a resin system, a filler system at least a portion of which is an inorganic material comprising nanoscopic particles having an average primary particle size of no greater than about 50 nm, and an initiator system to form a mixture; forming the mixture into a hardenable self-supporting structure having a first shape; wherein the hardenable self-supporting structure having a first shape has sufficient malleability to be formed into a second shape.
摘要:
Liquid coating compositions are disclosed that include (a) at least one film forming resin, (b) at least one flatting agent, and (c) at least on compound formed from a polyfunctional isocyanurate. Also disclosed are methods for coating a substrate with such compositions, multi-layer composite coatings wherein at least one layer is deposited from such compositions, and substrates at least partially coated with such compositions. Methods for enhancing the flatting capability of at least one flatting agent in a liquid coating composition are also disclosed.
摘要:
A crystalline epoxy resin is modified to provide an epoxy resin composition capable of producing a cured product with excellent cured product properties. The modified epoxy resin composition comprises compound A having in its molecule a functional group represented by formula (1):
(where each of R 1 and R 2 is an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group, or a halogenated, aminated or nitrated derivative thereof), and compound B having a glycidyl group in its molecule. The compound A is preferably a compound resulting from replacement of from at least one to at most n glycidyl groups among n glycidyl groups in a molecule (where n is an integer of from 2 to 16) with the functional group of the formula (1). The compound B is preferably a compound having n glycidyl groups (where n is an integer of from 2 to 16) in its molecule.
摘要:
A resinous substance obtained by reacting a rosin compound containing 1 to 10 equivalents of carboxylic groups per kilogram with triglycidyl isocyanurate. A process for producing it is also disclosed.
摘要:
A compostion of triglycidylisocyanurate, having reduced tackiness, consists of a solid mixture of at least triglycidylisocyanurate and a non-reactive polyester.
摘要:
An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).