Epoxy resin composition and electronic part
    24.
    发明公开
    Epoxy resin composition and electronic part 审中-公开
    Epoxydharzzusammensetzung und elektronisches Teil

    公开(公告)号:EP2123712A1

    公开(公告)日:2009-11-25

    申请号:EP08156421.3

    申请日:2008-05-19

    IPC分类号: C08L63/00 C08L85/02 C08L61/00

    摘要: The epoxy resin of the invention comprises (A) an epoxy resin, (B) at least one member selected from the group consisting of a phenolic hydroxyl group-containng compound, a urea resin and a melamine resin, (C) a crosslinked phenoxyphosphazene compound, and (D) an inorganic filler powder, the amount of component (C) being in the range of 0.01 to 30 wt.% based on the total amount of components (A), (B) and (C), and the amount of component (D) being in the range of 60 to 98 wt.% based on the total amount of components (A), (B), (C) and (D). Wherein the inorganic filler is a pyrogenically produced silica, which has been hydrophobized with Hexamethyldisilazane (HMDS) and then structurally modified by a ball mill.

    摘要翻译: 本发明的环氧树脂包含(A)环氧树脂,(B)选自酚羟基含有化合物,脲醛树脂和三聚氰胺树脂中的至少一种,(C)交联的苯氧基磷腈化合物 和(D)无机填料粉末,组分(C)的量相对于组分(A),(B)和(C)的总量为0.01〜30重量%,和 的组分(D)的含量相对于组分(A),(B),(C)和(D)的总量在60至98重量%的范围内。 其中无机填料是由六甲基二硅氮烷(HMDS)疏水化然后用球磨机进行结构改性的热解法生产的二氧化硅。