公开(公告)号：EP3329035A1

公开(公告)日：2018-06-06

申请号：EP16742266

申请日：2016-07-21

申请人： BASF SE

发明人： KIRSTE AXEL ,  URBAN TOBIAS ,  NICOLINI FABIO ,  LUTTER SIMONE ,  RICHTER FRANK ,  CEZANNE ANDRE

IPC分类号： C23C18/20 ,  C08J3/09 ,  C23C18/26 ,  C23C18/30

CPC分类号： C23C18/26 ,  C08J3/096 ,  C23C18/2073 ,  C23C18/30

摘要： The invention relates to a process for coating plastics or plastic surfaces with metals, especially plastics composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (e.g. ABS blends), wherein the process comprises the pretreatment of the plastic surfaces with a composition C (etch solution) comprising at least two different ionic liquids IL1 and IL2.

公开(公告)号：EP3327176A1

公开(公告)日：2018-05-30

申请号：EP17208657.1

申请日：2014-10-16

申请人： Okuno Chemical Industries Co., Ltd.

发明人： NAGAMINE, Shingo ,  KITA, Koji ,  OTSUKA, Kuniaki

IPC分类号： C23C18/24 ,  C09K13/04 ,  C23C18/16 ,  C08J7/14 ,  C25B1/28 ,  C23F1/14 ,  C23F3/02 ,  C23C18/20 ,  C23C18/30 ,  H01L21/02 ,  H01L21/306

CPC分类号： C09K13/00 ,  C08J7/14 ,  C09K13/04 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23F1/14 ,  C23F3/02 ,  C25B1/28 ,  C25D5/14 ,  H01L21/02052 ,  H01L21/30604

摘要： The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (2):
(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and
wherein the aqueous solution optionally further satisfies at least one of the following conditions (1) and (3):
(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, and
(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.

公开(公告)号：EP3173508A4

公开(公告)日：2018-03-28

申请号：EP15825092

申请日：2015-07-15

申请人： MAXELL HOLDINGS LTD

发明人： KITO AKIKO ,  YUSA ATSUSHI ,  USUKI NAOKI ,  YAMAMOTO SATOSHI ,  GOTO HIDETO ,  SUENAGA MASASHI

IPC分类号： C23C18/30 ,  B29C45/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28

CPC分类号： H05K3/187 ,  B29B9/12 ,  B29C45/00 ,  B29C45/0053 ,  B29C45/372 ,  B29C59/022 ,  B29K2105/0014 ,  B29K2995/0092 ,  B29L2009/005 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/2033 ,  C23C18/204 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C23C18/40

摘要： There is provided a method for producing a plated part (plated component) wherein the method suppresses the formation of any electroless plating film at portions other than a predetermined pattern in accordance with a simple and easy production process, and the electroless plating film can be formed at only the predetermined pattern. A method for producing a plated part (plated component) includes: applying a catalyst inactivator to a surface of a base member; irradiating with light or heating a part of the surface of the base member to which the catalyst inactivator is applied; allowing the surface of the base member to retain an electroless plating catalyst; and bringing an electroless plating solution into contact with the surface of the base member retaining the electroless plating catalyst to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

公开(公告)号：EP3296429A1

公开(公告)日：2018-03-21

申请号：EP17190254.7

申请日：2017-09-08

申请人： Rohm and Haas Electronic Materials LLC

发明人： CHAN, Hung Tat ,  YIP, Ka Ming ,  CHAN, Chit Yiu ,  YEE, Kwok Wai

IPC分类号： C23C18/16 ,  C23C18/38 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30

CPC分类号： C23C18/1612 ,  B05D1/02 ,  B05D1/18 ,  B05D3/007 ,  B05D3/06 ,  B05D5/068 ,  B05D5/08 ,  B05D2201/02 ,  B05D2505/00 ,  C08J7/045 ,  C08J2379/02 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

摘要： Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.

摘要翻译： 屏蔽涂层被施加到聚合物基底上以用于基底的选择性金属化。 屏蔽涂层包括底漆组分和疏水性顶涂层。 首先将底漆施涂到聚合物基材上，接着施涂顶涂层组分。 然后选择性蚀刻屏蔽涂层以形成所需电流图案的轮廓。 将催化剂施加到图案化的聚合物基底上，然后在蚀刻部分中进行无电金属镀敷。 含有屏蔽涂层的聚合物基材部分抑制无电镀金属。 底漆含有多胺，面漆含有疏水性烷基有机化合物。

公开(公告)号：EP3293286A1

公开(公告)日：2018-03-14

申请号：EP17190257.0

申请日：2017-09-08

申请人： Rohm and Haas Electronic Materials LLC

发明人： CHAN, Hung Tat ,  YIP, Ka Ming ,  CHAN, Chit Yiu ,  YEE, Kwok Wai

IPC分类号： C23C18/16 ,  C23C18/38 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30

CPC分类号： C23C18/1641 ,  C09K13/00 ,  C23C18/1605 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

摘要： Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain five-membered heterocyclic nitrogen compounds and the top coat contains hydrophobic alky organic compounds.

摘要翻译： 屏蔽涂层被施加到聚合物基底上以用于基底的选择性金属化。 屏蔽涂层包括底漆组分和疏水性顶涂层。 首先将底漆施涂到聚合物基材上，接着施涂顶涂层组分。 然后选择性蚀刻屏蔽涂层以形成所需电流图案的轮廓。 将催化剂施加到图案化的聚合物基底上，然后在蚀刻部分中进行无电金属镀敷。 含有屏蔽涂层的聚合物基材部分抑制无电镀金属。 底漆含有五元杂环氮化合物，面漆含有疏水性烷基有机化合物。

公开(公告)号：EP3287465A1

公开(公告)日：2018-02-28

申请号：EP17187827.5

申请日：2017-08-24

申请人： LCY Chemical Corp.

发明人： LIN, Yu-Tien ,  LEE, I-Tsun ,  HSU, Chan-Chia

IPC分类号： C07F15/00 ,  C07F15/04 ,  B01J31/12 ,  C23C18/30

CPC分类号： C07F15/0066 ,  C07F15/045

摘要： The disclosure provides a metal catalyst having a structure as shown in the Formula (1) or Formula (2), wherein M is palladium, copper, platinum, nickel or silver ions; X is fluorine, chlorine, bromine or iodine; and L is a chelator ligand of nitrogen-containing aromatic ring. The disclosure also provides a manufacturing method and applications of the metal catalyst in metal plating.

摘要翻译： 本发明提供具有式（1）或式（2）所示结构的金属催化剂，其中M为钯，铜，铂，镍或银离子; X是氟，氯，溴或碘; L是含氮芳香环的螯合配体。 本发明还提供了金属催化剂在金属电镀中的制造方法和应用。

公开(公告)号：EP2236647B1

公开(公告)日：2018-02-21

申请号：EP08868090.5

申请日：2008-12-05

申请人： FUJIFILM Corporation

发明人： SATO, Masataka

IPC分类号： C23C18/30 ,  C23C18/16 ,  C23C18/20

CPC分类号： C23C18/2086 ,  C23C18/1608 ,  C23C18/30

摘要： A method for adsorbing a catalyst, including: a step of applying, to a substrate, a photocurable composition which contains a compound having a polymerizable group and a group that is interactive with a plating catalyst or a precursor thereof, and that, when photo-cured, forms a surface-hydrophobic cured material satisfying the following Requirements 1 and 2; a step of curing the curable composition by pattern-wise exposure, a step of removing uncured materials by development; and a step of bringing an aqueous plating catalyst solution containing a plating catalyst or a precursor thereof and an organic solvent into contact with the substrate, wherein when a palladium-containing test liquid is brought into contact with the substrate having the patterned surface-hydrophobic cured material layer formed thereon, A mg/m 2 and B mg/m 2 , which respectively refer to a palladium adsorption in an area having the surface-hydrophobic cured material layer formed thereon and a palladium adsorption in an area not having the surface-hydrophobic cured material layer formed thereon, satisfy the following relationship Formulae (A) and (B): Requirement 1: saturated water absorption under the conditions of 25°C and a relative humidity of 50% is from 0.01 to 5% by mass, Requirement 2: saturated water absorption under the conditions of 25°C and a relative humidity of 95% is from 0.05 to 10% by mass, 10 mg / m 2 ‰¤ A ‰¤ 150 mg / m 2 0 mg / m 2 ‰¤ B ‰¤ 5 mg / m 2 .

公开(公告)号：EP3228729A1

公开(公告)日：2017-10-11

申请号：EP16163748.3

申请日：2016-04-04

申请人： COVENTYA S.p.A.

发明人： Dalbin, Sandrine ,  Pommier, Nicolas ,  Schiavon, Gianluigi ,  Pies, Peter

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C18/24 ,  C23C18/30

CPC分类号： C23C18/1625 ,  C23C18/2073 ,  C23C18/24 ,  C23C18/30

摘要： The invention refers to a process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath.

摘要翻译： 本发明涉及具有塑料表面的物品的金属化方法，该方法避免了将物品固定在电镀槽内的齿条的金属化。

公开(公告)号：EP3221491A1

公开(公告)日：2017-09-27

申请号：EP15795206.0

申请日：2015-11-19

申请人： Solvay Specialty Polymers Italy S.p.A.

发明人： COJOCARU, Paula ,  TRIULZI, Francesco Maria ,  APOSTOLO, Marco ,  ORIANI, Andrea Vittorio ,  SPREAFICO, Marco Alberto

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C18/30

CPC分类号： C23C18/1687 ,  C23C18/1633 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/206 ,  C23C18/30

摘要： The present invention relates to a multi-layered elastomer article and to a method for its manufacturing. The multi-layered article made of an elastomeric composition [composition (C)] comprising at least one elastomer, said article having at least one surface [surface (S)] comprising: —nitrogen-containing groups [groups (N)] and —at least one layer [layer (L1)] adhered to said surface (S) comprising at least one metal compound [compound (M)].

摘要翻译： 本发明涉及多层弹性体制品及其制造方法。 由包含至少一种弹性体的弹性体组合物[组合物（C）]制成的多层制品，所述制品具有至少一个[表面（S）]表面，所述表面包含： - 含氮基团[基团（N）]和 - 粘附在包含至少一种金属化合物[化合物（M）]的所述表面（S）上的至少一层[层（L1）]。

公开(公告)号：EP3181723A3

公开(公告)日：2017-08-16

申请号：EP16202713.0

申请日：2016-12-07

申请人： Rohm and Haas Electronic Materials LLC

发明人： CLEARY, Donald E.

IPC分类号： C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  H05K3/18 ,  H05K3/42 ,  C23C18/32 ,  C23C18/38 ,  C23C18/50 ,  C23C18/48

CPC分类号： H05K3/422 ,  B01J31/06 ,  B01J31/26 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C18/50 ,  H05K3/181 ,  H05K2203/0709

摘要： Catalysts include nanoparticles of catalytic metal and starch as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.

摘要翻译： 催化剂包括催化金属和淀粉的纳米颗粒作为稳定剂，所述催化剂金属和淀粉的摩尔比使得催化剂在储存和无电金属镀覆期间稳定化。 该催化剂对环境无害并且不含锡。 催化剂很好地粘附到包括通孔壁的印刷电路板的介电材料上。