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    THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY THEREOF
    6.
    发明公开
    THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY THEREOF 审中-公开

    公开(公告)号：EP3181639A4

    公开(公告)日：2018-04-04

    申请号：EP15832593

    申请日：2015-08-06

    申请人： KANEKA CORP

    发明人： SAEGUSA KAZUNORI

    IPC分类号： C08L67/03 ,  B32B27/36 ,  C08K3/34 ,  C08K5/49 ,  C08L23/08 ,  C08L51/04 ,  C08L69/00

    CPC分类号： C08L69/00 ,  B05D1/007 ,  B05D3/0254 ,  B05D7/02 ,  B29C45/0001 ,  B29C45/0053 ,  B29C2045/0079 ,  B29K2067/00 ,  B29K2069/00 ,  B29K2105/0023 ,  B29K2509/00 ,  B29L2031/3005 ,  B32B27/36 ,  C08K3/34 ,  C08K5/49 ,  C08L23/08 ,  C08L51/04 ,  C08L67/02 ,  C08L67/03 ,  C08L2201/08 ,  C08L2205/035 ,  C08L23/0869 ,  C08L51/06 ,  C08L51/085

    摘要： The present invention relates to a resin composition containing: 5 to 82 parts by weight of an aromatic polyester (component A); 0 to 50 parts by weight of an aromatic polycarbonate (component B) having a deflection temperature under load (A method) of 110°C or higher and 140°C or lower: 10 to 90 parts by weight of a highly heat-resistant aromatic polycarbonate (component C) having a deflection temperature under load (A method) of 145°C or higher; 0 to 10 parts by weight of a graft-copolymer (component D) containing 40 to 90% by weight of a rubbery polymer; 0 to 10 parts by weight of an ethylene copolymer (component E); 2.5 to 50 parts by weight of a silicate filler (component F); 0 to 10 parts by weight of an electric conductive filler (component G); and 0 to 2 parts by weight of a phosphorus compound (component H), provided that the total amount of the all components are 100 parts by weight, wherein the total amount of the component D and the component E is from 0.5 to 10 parts by weight, and the resin composition has a deflection temperature under load (A method) of 130°C or higher. When the resin composition is used, a resin molded article suitable for an automobile exterior or outer panel member can be provided, which maintains a coating appearance consistency with a metal site, has a heat resistance capable of coping with an high temperature exposure during the baking of the coating material, has a good surface property, has an inhibited deformation caused by a linear thermal expansion or humidity change, is light, has excellent rigidity, impact property, chemical resistance, and coating layer adhesion, and has a good flowability during processing.

    A UV CURING METHOD AND AN ASSEMBLY THEREFOR
    7.
    发明公开
    A UV CURING METHOD AND AN ASSEMBLY THEREFOR 审中-公开

    公开(公告)号：EP2580039A4

    公开(公告)日：2017-12-27

    申请号：EP11792749

    申请日：2011-06-08

    申请人： KUNGSÖRS PLAST AB

    发明人： ANDERSSON THOMAS

    IPC分类号： B29C33/40 ,  B29C35/08 ,  B29C45/37

    CPC分类号： B29C35/0805 ,  B29C33/40 ,  B29C35/0888 ,  B29C45/0053 ,  B29C2035/0827 ,  B29C2045/0075 ,  B29K2083/005 ,  B29K2827/06 ,  B29K2867/003

    摘要： It is presented a method for producing a cured polymer structure from a polymer compound which is UV curable and partly UV transparent. The method comprises injecting the polymer compound into a mold (2), which mold (2) has at least one wall (7) defining a mold space (6) for receiving the polymer compound in the mold space (6). The at least one wall (7) of the mold (2) is UV transparent and comprises a thermoplastic polymer. The polymer compound is then irradiated through the at least one wall (7), by means of at least one UV semiconductor light source, thereby curing the polymer compound to form the cured polymer structure. An assembly for producing a polymer structure and a mold (2) is also presented herein.

    WATER-PROOF CONTROL UNIT AND MANUFACTURING METHOD FOR WATER-PROOF CONTROL UNIT
    10.
    发明公开
    WATER-PROOF CONTROL UNIT AND MANUFACTURING METHOD FOR WATER-PROOF CONTROL UNIT 审中-公开
    防水控制单元及防水控制单元的制造方法

    公开(公告)号：EP3220728A1

    公开(公告)日：2017-09-20

    申请号：EP14905897.6

    申请日：2014-11-13

    申请人： Mitsubishi Electric Corporation

    发明人： SAKI, Ryoji ,  NISHIKAWA, Hideya

    IPC分类号： H05K5/06 ,  B60R16/02

    CPC分类号： B60R16/0239 ,  B29C45/0053 ,  B29C45/14778 ,  B29D99/006 ,  B29K2995/0069 ,  B60R16/02 ,  H01R13/5202 ,  H01R13/5216 ,  H05K5/0004 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/03 ,  H05K5/062

    摘要： A waterproof type control unit is provided in which a case member has: a base plate on which a case member bottom surface is formed; and a peripheral wall which is fixed to the base plate. The peripheral wall includes a first peripheral wall edge portion and a second peripheral wall edge portion, which are disposed on the case member bottom surface so as to be distant from each other, the peripheral wall surrounding a controller from the first peripheral wall edge portion to the second peripheral wall edge portion. The connector member includes a connector member main unit which is disposed in a space between the first and second peripheral wall edge portions. A peripheral wall groove, which is open toward the connector member main unit, is disposed in each of the first and second peripheral wall edge portions. A bottom surface of the peripheral wall groove is inclined with respect to the case member bottom surface. A base plate groove, which connects each peripheral wall groove, is disposed on the bottom surface of the case member. A seal material is filled into the space formed between each of an inner surface of the peripheral wall groove and an inner surface of the base plate groove, and the connector member.

    摘要翻译： 提供一种防水型控制单元，其中壳体构件具有：底板，其上形成有壳体构件底表面; 以及固定在底板上的周壁。 周壁包括第一周壁壁部分和第二周壁壁部分，所述第一周壁壁部分和第二周壁壁部分设置在壳体部件的底表面上以便彼此远离，所述周壁围绕控制器从第一周壁壁部分到 第二周壁边缘部分。 连接器构件包括连接器构件主单元，该连接器构件主单元布置在第一和第二周壁边缘部分之间的空间中。 朝向连接器构件主单元开口的周壁槽设置在第一和第二周壁边缘部分中的每一个中。 周壁槽的底面相对于壳体部件底面倾斜。 连接每个周壁槽的基板槽设置在壳体构件的底面上。 将密封材料填充到在周壁槽的内表面和基板槽的内表面中的每一个与连接器构件之间形成的空间中。