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公开(公告)号：EP3329035B1
公开(公告)日：2019-05-22
申请号：EP16742266.6
申请日：2016-07-21
申请人： BASF SE
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公开(公告)号：EP3329036A1
公开(公告)日：2018-06-06
申请号：EP16742269.0
申请日：2016-07-21
申请人： BASF SE
发明人： KIRSTE, Axel , URBAN, Tobias , NICOLINI, Fabio , LUTTER, Simone , RICHTER, Frank , CEZANNE, Andre
CPC分类号： C23C18/26 , C23C18/1641 , C23C18/1651 , C23C18/2026 , C23C18/2073 , C23C18/2086 , C23C18/30 , C23C18/34 , C23C18/40
摘要： The invention relates to a process for coating plastic surfaces with metals, especially plastic surfaces composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (ABS blends), using an etch solution (composition C) comprising at least one ionic liquid IL, wherein the process comprises the treating of the plastic surface after the etching with an aqueous rinse solution RS while applying ultrasound.
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3.发明公开
公开(公告)号：EP0770705A1
公开(公告)日：1997-05-02
申请号：EP96907745.2
申请日：1996-04-01
申请人： Kao Corporation
发明人： UEYAMA, Kenichi Kao Corporation, Research , TSURUGA, Tetsuya Kao Corporation, Research , ICHIMURA, Ikuhisa Kao Corporation, Research , OKUDA, Shinsuke Kao Corporation, Research
摘要： A method and an apparatus for producing a stamper capable of producing in a high yield a stamper for producing a high quality optical disk. According to the conventional production technology of stampers, primary tin ions in a sensitizer containing the tin ions used for electric conduction treatment of a substrate surface are readily oxidized by dissolved oxygen and cause defects during the production of stampers. Therefore, even when a production apparatus is automated, substantially daily maintenance is necessary so as to keep satisfactory yield. The present invention carries out the electric conduction treatment of the substrate surface by treating the substrate surface by a treating solution containing a compound having a betaine structure and a polyoxyethylenealkylamine compound, then treating it by a colloidal solution containing tin and palladium and further conducting electroless plating. In this way, the present invention makes the maintenance work easier in an automated process and makes it possible to produce a high quality stamper with a high production yield.
摘要翻译： 一种用于制造在能够以高收率制造用于产生高质量的光盘的压模的压模的方法和装置。 。根据压模的常规的生产技术，在敏化剂初级锡离子含有用于导电处理的表面基板的锡离子容易被溶解的氧和引起的缺陷的生产压模的过程中被氧化。 因此，即使当制造装置是自动的，基本上每日保养是必要的，以便保持令人满意的产率。 本发明通过用处理溶液含有具有甜菜碱结构和聚氧乙烯烷基化合物的化合物处理所述基板表面上，然后用含有锡和钯的胶体溶液处理它，并进一步地进行非电解镀进行基板表面的电传导处理 ， 以这种方式，本发明使得在维护工作变得更加容易，在自动过程，并且使得能够制造高品质的压模以高生产成品率。
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4.发明授权PROCESS AND COMPOSITION FOR PREPARING PRINTED CIRCUIT THROUGH-HOLES FOR METALLIZATION 失效用于生产印刷电路具有用于金属化持续洞。
公开(公告)号：EP0368943B1
公开(公告)日：1994-02-23
申请号：EP89901384.1
申请日：1988-12-09
CPC分类号： C23C18/22 , H05K3/0055 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796 , H05K2203/122
摘要： Disclosed herein is a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) for subsequent metallization, in which the through-hole surfaces are treated with a substantially water-immiscible organic liquid which acts upon the insulating substrate of the board, and preferably in the form of a substantially homogeneous, clear mixture comprised of the water-immiscible organic liquid, water, an alkali metal compound and a surfactant component, followed by treatment of the through-hole surfaces with an alkaline permanganate solution. The process can be used as a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
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5.发明公开PROCESS AND COMPOSITION FOR PREPARING PRINTED CIRCUIT THROUGH-HOLES FOR METALLIZATION 失效用于制备用于金属化的印刷电路的方法和组合物
公开(公告)号：EP0368943A4
公开(公告)日：1991-09-11
申请号：EP89901384
申请日：1989-11-10
IPC分类号： C11D7/60 , C23C18/20 , C23C18/22 , C23C18/28 , H05K3/00 , H05K3/26 , H05K3/42 , H05K3/46 , C23C18/26 , C23C18/30 , C23C30/00
CPC分类号： C23C18/22 , H05K3/0055 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796 , H05K2203/122
摘要： Disclosed herein is a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) for subsequent metallization, in which the through-hole surfaces are treated with a substantially water-immiscible organic liquid which acts upon the insulating substrate of the board, and preferably in the form of a substantially homogeneous, clear mixture comprised of the water-immiscible organic liquid, water, an alkali metal compound and a surfactant component, followed by treatment of the through-hole surfaces with an alkaline permanganate solution. The process can be used as a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
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6.发明公开
公开(公告)号：EP4223905A1
公开(公告)日：2023-08-09
申请号：EP22155710.1
申请日：2022-02-08
摘要： The present invention relates to a method for etching at least one surface of a sulfur-containing thermoplastic resin-substrate, the method comprising the steps (A) to (C), wherein step (C) is an etching step including a contacting with a liquid etching composition. The liquid etching composition comprises (a) a mineral acid selected from the group consisting of sulfuric acid and nitric acid, and (b) a dialkyl sulfoxide and/or a phenyl-comprising sulfoxide.
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8.发明授权Composition and process for conditioning the surface of polycarbonate resins prior to metal plating 失效用于调节金属镀层前的聚碳酸酯树脂表面的组成和方法
公开(公告)号：EP0316061B1
公开(公告)日：1992-11-25
申请号：EP88308753.8
申请日：1988-09-21
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公开(公告)号：EP0241754B1
公开(公告)日：1990-05-16
申请号：EP87104147.1
申请日：1987-03-20
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10.发明公开
公开(公告)号：EP0317748A2
公开(公告)日：1989-05-31
申请号：EP88116755.5
申请日：1988-10-10
发明人： Römer, Michael, Dr. , Stein, Ludwig
IPC分类号： C23C18/26
摘要： Die Erfindung betrifft ein Verfahren zur Vorbehandlung von Kunststoffen, insbesondere von Polyetherimid, Polycarbonat und Poly(ester-co-carbonat), für die haftfeste chemische Metallisierung, dadurch gekennzeichnet, daß die Kunststoffe mit einer quaternären Base gelöst in einem organischen Lösungsmittel behandelt werden.
摘要翻译： 塑料，特别是聚醚酰亚胺，聚碳酸酯和聚（酯 - 碳酸酯），通过用溶解在有机溶剂中的季碱来处理塑料，进行预处理，以牢固粘附化学金属化。
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