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31.
公开(公告)号:EP1556904B1
公开(公告)日:2018-12-05
申请号:EP03776808.2
申请日:2003-10-21
发明人: BRAUNE, Bert , BRUNNER, Herbert
CPC分类号: H01L33/505 , H01L33/38 , H01L2224/11 , H01L2933/0016 , H01L2933/0041
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公开(公告)号:EP1658643B1
公开(公告)日:2018-11-14
申请号:EP04762553.8
申请日:2004-07-30
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公开(公告)号:EP2160773B1
公开(公告)日:2018-11-07
申请号:EP08773275.6
申请日:2008-06-23
发明人: GRÖTSCH, Stefan , LINDER, Norbert
CPC分类号: H01L33/46 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
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公开(公告)号:EP2591511B1
公开(公告)日:2018-10-31
申请号:EP11743203.9
申请日:2011-07-01
CPC分类号: H01L33/52 , H01L31/0203 , H01L31/18 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83951 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
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公开(公告)号:EP1761959B1
公开(公告)日:2018-10-24
申请号:EP05753601.3
申请日:2005-05-18
CPC分类号: H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2224/48091 , H01L2924/0002 , H01L2924/00 , H01L2924/00014
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公开(公告)号:EP2220733B1
公开(公告)日:2018-10-10
申请号:EP08863511.5
申请日:2008-12-16
发明人: REILL, Wolfgang , TAUTZ, Sönke , BRICK, Peter , STRAUSS, Uwe
CPC分类号: H01S5/22 , H01S5/1017 , H01S5/1064 , H01S5/4031
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公开(公告)号:EP2283520B1
公开(公告)日:2018-09-26
申请号:EP09749489.2
申请日:2009-05-13
IPC分类号: H01L27/15
CPC分类号: H01S5/0261 , H01L25/167 , H01L27/32 , H01L2924/0002 , H01S5/36 , H01S5/4025 , H01L2924/00
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公开(公告)号:EP2517270B1
公开(公告)日:2018-09-12
申请号:EP10788084.1
申请日:2010-12-13
CPC分类号: H01L33/50 , H01L33/025 , H01L33/08 , H01L33/20 , H01L33/58 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
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公开(公告)号:EP2255396B1
公开(公告)日:2018-08-29
申请号:EP09712047.1
申请日:2009-02-19
发明人: PREUSS, Stephan , JÄGER, Harald
IPC分类号: H01L33/52
CPC分类号: H01L33/52 , H01L2924/0002 , H01L2924/00
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公开(公告)号:EP3360167A1
公开(公告)日:2018-08-15
申请号:EP16775745.9
申请日:2016-10-05
发明人: RICHTER, Daniel
IPC分类号: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L25/16
CPC分类号: H01L33/62 , G02B6/426 , G02B6/4283 , H01L25/0753 , H01L33/486 , H01L2933/0066
摘要: The invention relates to an optoelectronic component having at least one optoelectronic semiconductor chip, wherein the at least one optoelectronic semiconductor chip is arranged on a top side of a lead frame section (9), wherein the lead frame section (9) has a stiffening structure protruding away from the lead frame section (9) laterally, and wherein the lead frame section (9), the stiffening structure, and the at least one optoelectronic semiconductor chip are embedded in an electrically insulating housing.
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