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    A HOUSING FOR A HIGH VOLTAGE COMPONENT, AN ELECTRIC SYSTEM AND A VEHICLE
    33.
    发明公开
    A HOUSING FOR A HIGH VOLTAGE COMPONENT, AN ELECTRIC SYSTEM AND A VEHICLE 审中-公开

    公开(公告)号：EP4397546A1

    公开(公告)日：2024-07-10

    申请号：EP23175939.0

    申请日：2023-05-30

    申请人： VOLVO TRUCK CORPORATION

    发明人： Melaugh, John ,  Eriksson, Tommie

    IPC分类号： B60R16/03 ,  B60R16/023 ,  B60L58/00 ,  G01R31/36 ,  H01R13/447 ,  H01R13/648 ,  H05K5/04 ,  H01R13/70

    CPC分类号： B60R16/0239 ,  B60R16/03 ,  H05K5/04 ,  B60L3/04 ,  B60L58/12

    摘要： The disclosure relates to a housing (1) for a high voltage component (10) protected by a hazardous voltage interlock loop (12). The housing (1) comprises an inner compartment (14) configured to at least partially enclose a high voltage component (10), an inner cover (16) configured to prevent access to the inner compartment (14), an outer cover (20) movable to and from a first position, and configured to cover and to prevent access to the at least one fastening device (18) of the inner cover (16), and a switch (22) configured to close the hazardous voltage interlock loop (12) when the outer cover (20) is in the first position. The outer cover (20) is releasably fixable in relation to the inner cover (16) in the first position by a hand-operated locking mechanism, and the switch (22) is configured to open the hazardous voltage interlock loop (12) to discharge an electric potential of the high voltage component (10) when the outer cover (20) is moved from the first position. The disclosure further relates to a high voltage electric system comprising the housing (1) and to a vehicle (3) comprising the high voltage electric system (2).

    ELECTRONIC DEVICE COMPRISING METAL MEMBER
    36.
    发明公开
    ELECTRONIC DEVICE COMPRISING METAL MEMBER 审中-实审

    公开(公告)号：EP4383964A1

    公开(公告)日：2024-06-12

    申请号：EP22883769.6

    申请日：2022-09-05

    申请人： Samsung Electronics Co., Ltd.

    发明人： IM, Junghyun ,  PARK, Joungki ,  PARK, Jinwoo ,  BAEK, Seungchang ,  LEE, Yoonhee ,  CHOI, Jungwoo ,  CHO, Sungho ,  HWANG, Hangyu ,  CHOI, Jongchul

    IPC分类号： H05K5/04 ,  H05K5/00 ,  H04M1/02

    CPC分类号： H05K5/00 ,  H05K5/04 ,  H04M1/0202 ,  H04M1/0277

    摘要： An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion. Various other embodiments identified through the specification are possible.