公开(公告)号：EP1710660A2

公开(公告)日：2006-10-11

申请号：EP06006968.9

申请日：2006-03-31

Applicant: HITACHI, LTD.

Inventor： Terakado, Shuichi Hitachi, Ltd IPG 12th Floor ,  Nishihara, Atsuo Hitachi, Ltd IPG 12th Floor ,  Ohashi, Shigeo Hitachi, Ltd IPG 12th Floor ,  Minamitani, Rintaro Hitachi, Ltd IPG 12th Floor ,  Naganawa, Takashi Hitachi, Ltd IPG 12th Floor

IPC: G06F1/20

CPC classification number: G06F1/203 ,  F28F3/12 ,  F28F13/06 ,  G06F2200/201

Abstract: The invention relates to a cooling jacket (100) for use in electronic apparatus having a heat-generating element (200) therein, for transmitting heat generated from the heat-generating element (200) into a liquid coolant flowing therein. The cooling jacket (100) comprises a cover (130) building up a heat transfer surface to be in contact with a surface of the heat-generating element (200), a passage (110) for the liquid coolant, which is formed neighboring the heat transfer surface and wound round in an "S"-like manner inside the main body (120) of the cooling jacket (100), and an inlet (111) and an outlet (112) attached at both ends of the flow passage for the liquid coolant, and further a dispersion member (150) is disposed in the flow passage, being built up by gathering a plural number of members (150), each of which has a "U"-like cross-section and an aspect ratio of 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element (200) thereto with high efficiency, and thereby enabling to cool down the heat-generating element (200), fully, even with a relatively small amount or volume of the liquid coolant.

Abstract translation: 本发明涉及一种用于电子设备的冷却套（100），其中具有发热元件（200），用于将从发热元件（200）产生的热量传递到流过其中的液体冷却剂。 冷却套（100）包括构成传热表面以与发热元件（200）的表面接触的盖（130），用于液体冷却剂的通道（110），其形成为邻近 传热表面并且在冷却套（100）的主体（120）内以“S”状的方式缠绕，并且在流动通道的两端附接入口（111）和出口（112），用于 液体冷却剂，另外，分散部件（150）设置在流路中，通过聚集多个构件（150）构成，每个构件具有“U”状横截面和纵横比 10〜20，从而使液体冷却剂在其中扩散，从而将发热元件（200）的热量高效地传递到其中，从而能够完全均匀地冷却发热元件（200） 具有相对少量或体积的液体冷却剂。

公开(公告)号：EP1571533A2

公开(公告)日：2005-09-07

申请号：EP04005451.2

申请日：2004-03-08

Applicant: Hitachi, Ltd.

Inventor： Naganawa, Takashi c/o Hitachi, Ltd.,Int.Prop.Group ,  Minamitani, Rintaro c/o Hitachi,Ltd.,Int.Prop.Gr. ,  Ohashi, Shigeo c/o Hitachi, Ltd.,Int. Prop.Group ,  Nishihara, Atsuo c/o Hitachi, Ltd.,Int. Prop.Group

IPC: G06F1/20

CPC classification number: H05K7/20009 ,  F04D9/007 ,  F04D13/0673 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A liquid cooling system being freely applicable to various kinds of electronic apparatuses, for cooling a CPU, which is mounted within a housing (100), the system comprises: a cooling jacket (50), a radiator (60) and a circulation pump, wherein the circulation pump is built up with a centrifugal pump, in which a rotor (730) having a plural number of blades formed in a centrifugal manner, a pump chamber (741) receiving the rotor in an inside thereof, and a field coil (712) of an electric motor for driving the rotor rotationally are formed into one body, and the pump chamber is disposed to be located below the electric motor, thereby achieving the structure so that a liquid coolant fills up the pump chamber when stopping, in spite of the disposition of the circulation pump.

Abstract translation: 一种液体冷却系统，可自由地应用于各种电子设备，用于冷却安装在壳体（100）内的CPU，系统包括：冷却套（50），散热器（60）和循环泵， 其中循环泵由离心泵构成，其中具有以离心方式形成的多个叶片的转子（730），在其内部接纳转子的泵室（741）和励磁线圈（ 旋转地驱动转子的电动机形成为一体，泵室设置在电动机的下方，从而实现了在停止时液体冷却剂填充泵室的结构，尽管如此 的循环泵的配置。

公开(公告)号：EP1297730B1

公开(公告)日：2005-09-07

申请号：EP01948645.5

申请日：2001-06-21

Applicant: INTEL CORPORATION

Inventor： SENYK, Borys ,  MORESCO, Larry

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A method including sensing a temperature of an electronic component in a portable computing device; circulating a fluid between one of a first heat transfer plate and a second heat transfer plate in response to a threshold temperature being sensed; and stopping the circulating in response to sensing a temperature is below the threshold temperature. A heat exchanging system including a first heat transfer plate coupled to an electronic component and to a second heat transfer plate; and a fluid for circulating through one of the first heat transfer plate and the second heat transfer plate in response to a threshold temperature being sensed by a sensor. An apparatus including a heat generating element; a first heat transfer plate coupled to the heat generating element; a second heat transfer plate; and a fluid for circulating through a tube, the first part and the second part of the portable computing device in response to a threshold temperature being sensed by a sensor.

公开(公告)号：EP1538884A2

公开(公告)日：2005-06-08

申请号：EP04005163.3

申请日：2004-03-04

Applicant: Hitachi, Ltd.

Inventor： Matsushima, Hitoshi, Hitachi Ltd, Int. Prop. Group ,  Matsushita, Shinji, Hitachi Ltd, Int. Prop. Group ,  Asano, Ichirou, Hitachi, Ltd., Intel. Prop. Group ,  Takeuchi, Tsunenori, Hitachi Ltd, Int. Prop. Group ,  Suzuki, Osamu, Hitachi, Ltd., Intel. Prop. Group

IPC: H05K7/20 ,  H01L23/473

CPC classification number: F28F3/12 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates (1), each being formed through the punching process, are piled up in the width direction thereof, for each piece thereof, and are bonded with each other. A cooling liquid flows in a flow passage (8) defined between the laminating plates, and the laminating plates themselves function as a cooling fin.

Abstract translation: 一种液体冷却夹套和一种用于电子设备中的系统，其冷却能力或性能优选，工时较少且制造成本较低且需要处理，并且可应用于狭窄空间中，其中多个层压 通过冲压工艺形成的板（1）在其宽度方向上堆叠，并且彼此接合。 冷却液流入在层压板之间限定的流道（8）中，并且层压板本身用作冷却片。

公开(公告)号：EP1511369A2

公开(公告)日：2005-03-02

申请号：EP04005161.7

申请日：2004-03-04

Applicant: Hitachi, Ltd.

Inventor： Minamitani, Rintaro ,  Matsushita, Shinji ,  Ohashi, Shigeo ,  Kondo, Yoshihiro ,  Naganawa, Takashi ,  Suzuki, Osamu

IPC: H05K7/20

CPC classification number: H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump (1) for supplying a cooling liquid; a heat-receiving jacket (2), being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag (9), having an ion exchange resin (11) and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag (9) is exchangeable.

Abstract translation: 一种用于电子设备的液体冷却系统，其尺寸超小型并且薄，并且适于冷却例如具有大量发热量的发热部件的发热部件，例如维持 其耐腐蚀性长时间包括：用于供应冷却液的泵（1）; 供给冷却液的受热套（2），用于从电子部件接收热量; 散热器，供给通过热接收护套的冷却液用于辐射热; 以及用于使通过散热器的路线中的冷却液循环回所述泵的流路，其中具有离子交换树脂（11）的离子交换袋（9）和其中包围的袋子被设置在 液体冷却系统的组成部分和/或离子交换袋（9）是可更换的。

公开(公告)号：EP1445683A2

公开(公告)日：2004-08-11

申请号：EP03029441.7

申请日：2003-12-19

Applicant: Kabushiki Kaisha Toshiba

Inventor： Arai, Satoru ,  Ariga, Koji ,  Tashiro, Naoki ,  Mamata, Tohru

IPC: G06F1/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

Abstract: An electronic apparatus includes a housing (20), a first heat-generating member (30) provided in the housing (20), a heat-radiating member thermally connected to the first heat-generating member, a first fan module (23) guiding air to the heat-radiating member (21), a second heat-generating member (37) provided in the housing (20), a second fan module (28) discharging air out of the housing (20), and a wall section (22) provided in the housing, located between the first fan module (23) and the second fan module (28).

公开(公告)号：EP1411417A2

公开(公告)日：2004-04-21

申请号：EP03017799.2

申请日：2003-08-04

Applicant: Kabushiki Kaisha Toshiba

Inventor： Tomioka, Kentaro ,  Hisano, Katsumi ,  Takamatsu, Tomonao ,  Tanimoto, Mitsuyoshi ,  Kusaka, Hiroyuki ,  Kinoshita, Teruo

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201 ,  G06F2200/203

Abstract: An electronic apparatus (1) comprising a housing (7), a display panel (8) provided in the housing (7) and having a back wall (8b), and a heat-radiating portion (30) provided in the housing (8) to radiate the heat generated by a heat-generating component (23).
The heat-radiating portion (30) opposes the back wall (8b) of the display panel (8a). The display panel (8) and the heat-radiating portion (30) are coupled to each other by support members (55, 56). The support members (55, 56) hold the display panel (8) and the heat-radiating portion (30) at specific positions in the housing (7).

Abstract translation: （1）包括：壳体（7），一个显示面板的电子设备（8）设置在所述壳体（7）和具有后壁（图8B），并设置在外壳中的热辐射部分（30）（8 ）以辐射由发热部件（23产生的热）。 散热部（30）相对的后壁（8b）的显示面板的（8A）。 显示面板（8）和所述散热部分（30）由支承件（55，56）彼此联接。 支撑部件（55，56）保持在显示面板（8），并在特定位置在所述壳体（7）的散热部分（30）。

公开(公告)号：EP0767415B1

公开(公告)日：2003-12-10

申请号：EP96307020.6

申请日：1996-09-26

Applicant: NCR International, Inc.

Inventor： Aguilera, Rafael E.

IPC: G06F1/20 ,  G02F1/133

CPC classification number: G02F1/133382 ,  F28D15/0266 ,  F28D2021/0029 ,  F28F3/025 ,  G06F1/203 ,  G06F2200/201

公开(公告)号：EP1207446A4

公开(公告)日：2002-08-28

申请号：EP00914015

申请日：2000-03-24

Applicant: DONG GUANGJI

Inventor： DONG GUANGJI

IPC: F25D1/02 ,  G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201

Abstract: A computer heat-radiation system comprises an endotherm means, the endotherm means can be pasted on the exothermic unit inside the computer and connected with a liquid circle means. The liquid circle means can at least connect in-series with the radiating-pipe pasted on the radiating-flange; the said radiating-flange is on the ectotheca of the housing. The most of the heat radiated from the computer can be emitted to the outside of computer, and the noise raised by running is fall down greatly because of the cancel of the computer inter-fan.

公开(公告)号：EP0969354A3

公开(公告)日：2000-02-09

申请号：EP99112514.7

申请日：1999-07-01

Applicant: SHOWA ALUMINUM CORPORATION

Inventor： Ohta, Keiichiro ,  Furukawa, Yuichi

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02

CPC classification number: G06F1/203 ,  F28D15/0233 ,  G06F2200/201

Abstract: A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a heat removal opening. A heat sink disposed within the housing comprises a metal body having a heat pipe portion, and a radiation fin attached to the body in the vicinity of the heat removal opening and opposed to the opening. The heat-generating electronic component, such as CPU, is held in contact with the metal body at a location away from the fin attached portion thereof.