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    JOINT, COOLING SYSTEM, AND COMPUTER APPARATUS
    1.
    发明公开
    JOINT, COOLING SYSTEM, AND COMPUTER APPARATUS 审中-实审

    公开(公告)号：EP4403814A3

    公开(公告)日：2024-09-11

    申请号：EP24161711.7

    申请日：2020-07-15

    申请人： Huawei Technologies Co., Ltd.

    发明人： GONG, Xinhu ,  CHEN, Haofeng ,  XIA, Gaoliang

    IPC分类号： F16L37/373 ,  F16L37/084 ,  F16L37/23 ,  G06F1/20 ,  F16L37/34

    CPC分类号： F16L37/23 ,  F16L37/373 ,  G06F1/20 ,  G06F2200/20120130101 ,  F16L37/34

    摘要： A joint, a cooling system, and a computer apparatus are provided. The joint includes a male module (10) and a female module (20) capable of docking with each other. The male module (10) includes a core rod (11) and a sliding cylinder (12) that is slidably sleeved on an outer periphery of the core rod (11). A first valve port (122) is disposed in the sliding cylinder (12), and the core rod (11) is provided with a piston head (111) that is in hermetic fit with the first valve port (122). The female module (20) includes a valve body (21) and a piston (22). A first channel (213) is disposed in the valve body (21), the piston (22) is slidably disposed in the first channel (213), and a second valve port (212) that is in hermetic fit with the piston (22) is disposed in the first channel (213). One end of the sliding cylinder (12) is provided with a first docking port (121), the valve body (21) is provided with a second docking port (211) communicating with the first channel (213), and after the first docking port (121) and the second docking port (211) are docked hermetically, the core rod (11) slides in a direction of extending from the first docking port (121), the piston head (111) is separated from the first valve port (122), the core rod (11) sliding pushes the piston (22) to slide in a direction of retracting into the second docking port (211), and the piston (22) is separated from the second valve port (212). During use, problems of docking failure and flow channel blocking can be avoided.

    ELECTRONIC DEVICE
    5.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP4411513A1

    公开(公告)日：2024-08-07

    申请号：EP23208501.9

    申请日：2023-11-08

    申请人： Toshiba TEC Kabushiki Kaisha

    发明人： HARADA, Shintaro

    IPC分类号： G06F1/20 ,  G06F1/18

    CPC分类号： G06F1/20 ,  G06F1/181

    摘要： An electronic device in an embodiment includes a housing including a hollow first space section with one surface of the hollow first space section opened and including a first ventilation hole, a lid provided to close the opening of the housing, including a hollow second space section, and including a second ventilation hole, a heat sink provided in the first space section and configured to radiate heat generated from an electronic component housed in the housing, and a fan provided in the first space section and configured to cool the heat sink with a flow of air caused by the fan rotating. The lid includes a ventilation port in a position facing the fan and separates the first space section and the second space section excluding the ventilation port.

    ELECTRONIC DEVICE
    8.
    发明公开
    ELECTRONIC DEVICE 审中-实审

    公开(公告)号：EP4394547A1

    公开(公告)日：2024-07-03

    申请号：EP22882685.5

    申请日：2022-10-11

    申请人： Huawei Technologies Co., Ltd.

    发明人： ZOU, Liujun

    IPC分类号： G06F1/16

    CPC分类号： Y02D10/00 ,  G06F1/20 ,  G06F1/16

    摘要： An embodiment of this application provides an electronic device. The electronic device includes a fan, a housing, a heat dissipation assembly, and a heat emitting component. The fan, the heat dissipation assembly, and the heat emitting component are disposed in the housing. The fan includes a first side plate and a second side plate. The fan may be connected to the housing through the first side plate and the second side plate. In addition, the first side plate, the second side plate, the housing, and the heat dissipation assembly may enclose an air outlet channel, and the air outlet channel communicates with an air outlet of the fan and an air exhaust vent of the housing. The first side plate and the second side plate are connected to the housing, so that the first side plate and the second side plate can seal a side gap of the air outlet channel. This improves sealing performance of the air outlet channel, and therefore improves a heat dissipation capability of the electronic device.

    DUAL COOLING PASSAGE-BASED LIQUID-COOLED HEAT DISSIPATION STRUCTURE
    10.
    发明公开
    DUAL COOLING PASSAGE-BASED LIQUID-COOLED HEAT DISSIPATION STRUCTURE 审中-实审

    公开(公告)号：EP4383968A1

    公开(公告)日：2024-06-12

    申请号：EP22860439.3

    申请日：2022-08-22

    申请人： Huawei Technologies Co., Ltd.

    发明人： JIA, Hui ,  WANG, Guangjing ,  CHI, Shanjiu

    IPC分类号： H05K7/20 ,  G06F1/20

    CPC分类号： H05K7/20 ,  G06F1/20

    摘要： This application provides a liquid cooling heat dissipation structure based on dual cooling paths, and specifically provides a liquid cooling node and a liquid cooling heat dissipation cabinet. The liquid cooling node includes a sealed compartment, a cooling component, two first connectors, and two second connectors. The sealed compartment is filled with a first medium. The cooling component is disposed in the sealed compartment, and the cooling component is filled with a second medium. The first connectors are disposed on a side wall of the sealed compartment, and are communicated with the sealed compartment to form a first cooling path. The second connectors are disposed on the side wall of the sealed compartment, and are communicated with the cooling component to form a second cooling path. In this application, a heat dissipation problem of a single high-power main chip can be resolved, so that an entire data center node maintains a low temperature for a long time.