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    A DEVICE COMPRISING HEAT PRODUCING COMPONENTS WITH LIQUID SUBMERSION COOLING
    3.
    发明公开
    A DEVICE COMPRISING HEAT PRODUCING COMPONENTS WITH LIQUID SUBMERSION COOLING 审中-公开

    公开(公告)号：EP3380907A1

    公开(公告)日：2018-10-03

    申请号：EP16798513.4

    申请日：2016-11-21

    Applicant: Aecorsis B.V.

    Inventor： BRINK, Dirk Roelof

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: H05K7/20236 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20245 ,  H05K7/20772

    Abstract: A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

    VALVE FAILURE PREDICTIONS
    6.
    发明公开
    VALVE FAILURE PREDICTIONS 审中-公开

    公开(公告)号：EP3281081A4

    公开(公告)日：2018-04-11

    申请号：EP15903252

    申请日：2015-09-04

    Applicant: HEWLETT PACKARD ENTPR DEVELOPMENT LP

    Inventor： CADER TAHIR ,  FRANZ JOHN

    IPC: G06F1/20 ,  G06F11/00

    CPC classification number: G06F1/206 ,  G06F11/00 ,  G06F2200/201

    Abstract: In one implementation, a system for valve failure prediction includes a temperature engine to determine a temperature of a liquid exiting a cooling device, a flowrate engine to compare an actual flow rate of the liquid exiting the cooling device to a flow rate threshold, a prediction engine to determine when a valve of the cooling device is malfunctioning based on the comparison of the actual flow rate and the flow rate threshold, and a notification engine to notify a user when the valve of the cooling device is malfunctioning.

    TERMINAL HEAT DISSIPATION APPARATUS AND MOBILE TERMINAL
    10.
    发明公开
    TERMINAL HEAT DISSIPATION APPARATUS AND MOBILE TERMINAL 审中-公开
    终端散热装置和移动终端

    公开(公告)号：EP3193570A1

    公开(公告)日：2017-07-19

    申请号：EP14881852.9

    申请日：2014-11-10

    Applicant: ZTE Corporation

    Inventor： ZHANG, Yongliang

    IPC: H05K7/20

    CPC classification number: H05K7/20336 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1675 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  H04W88/02 ,  H05K7/2099 ,  H05K9/006

    Abstract: The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield. By means of the disclosure, the problem in the related art that heat cannot be quickly conducted to the heat pipe due to the back-and-forth conversion of the conductive medium in the thermal conductive path is solved, and heat can therefore be quickly conducted to the heat pipe, speeding up an effect of heat dissipation.

    Abstract translation: 本发明公开了一种终端散热装置和移动终端，包括：热源芯片，热管和屏蔽罩，所述屏蔽罩位于热源芯片和热管之间，并与热源 源芯片和热管通过相同类型的柔性导热固体; 并且在与屏蔽层接触的柔性导热固体之间的连接位置处设置微孔阵列。 借助于本发明，解决了现有技术中由于导热介质在导热路径中发生往返变换而无法将热量快速传导至热管的问题，因此可以快速进行热量 加热管，加快散热效果。

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