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公开(公告)号：EP4366094A3
公开(公告)日：2024-07-17
申请号：EP24160288.7
申请日：2018-05-11
发明人： DEANGELO, Tim
CPC分类号： H01R12/52 , H05K1/11 , H05K1/145 , H05K3/368 , H05K2201/1018920130101 , H05K2201/1029520130101 , H05K2201/201820130101 , B33Y80/00 , H01R12/58 , H05K1/144 , H05K3/366 , H05K2201/04220130101
摘要： A circuit card assembly (10; 110; 210; 310) includes a first printed wiring board (28; 128; 228; 328) with a first receiving feature (38; 138; 238; 338) and a trace (12; 112; 212; 312) attached to the first printed wiring board (28; 128; 228; 328). The three dimensional trace (12; 112; 212; 312) is formed by layer-by-layer additive manufacturing. The three dimensional trace (12; 112; 212; 312) includes first (14; 114; 214; 314) and second ends. The first end (14; 114; 214; 314) of the three dimensional trace (12; 112; 212; 312) engages with the first receiving feature (38; 138; 238; 338) of the first printed wiring board (28; 128; 228; 328). The second end of the three dimensional trace (12; 112; 212; 312) is configured to engage with a second printed wiring board (40; 140; 240; 340).
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52.发明公开
公开(公告)号：EP4395999A1
公开(公告)日：2024-07-10
申请号：EP22777477.5
申请日：2022-09-01
CPC分类号： B33Y10/00 , B33Y80/00 , A61C13/0019 , A61C13/0004
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公开(公告)号：EP4395694A1
公开(公告)日：2024-07-10
申请号：EP22773126.2
申请日：2022-08-31
申请人： Exocad GmbH
CPC分类号： A61C13/0004 , A61C13/10 , B33Y50/00 , B33Y80/00
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公开(公告)号：EP4395684A1
公开(公告)日：2024-07-10
申请号：EP22772574.4
申请日：2022-08-29
IPC分类号： A61C5/77 , A61C5/82 , A61C13/107 , A61C13/08 , B33Y80/00
CPC分类号： A61C13/0001 , B33Y80/00 , A61C13/081 , A61C5/77 , A61C5/30 , A61C5/85 , A61C5/20 , A61C13/225
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公开(公告)号：EP4349601A3
公开(公告)日：2024-07-10
申请号：EP24159584.2
申请日：2020-02-10
IPC分类号： B29C64/106 , B29C64/209 , B29C64/336 , B33Y10/00 , B33Y30/00 , B33Y40/10 , B33Y70/00 , B33Y80/00 , B29B7/00 , B29B7/74 , B29B7/32
CPC分类号： B29C64/209 , B33Y10/00 , B33Y30/00 , B33Y40/10 , B33Y80/00 , B29C64/106 , B29C64/336 , B33Y70/00 , B29B7/7457 , B29B7/748 , B29B7/325 , B29B7/007
摘要： Coreactive three-dimensional printing of parts using coreactive compositions is disclosed. Coreactive additive manufacturing can be used to fabricate parts having a wide range of properties.
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公开(公告)号：EP3765776B1
公开(公告)日：2024-07-10
申请号：EP19767440.1
申请日：2019-03-13
IPC分类号： F16L13/10 , F16L47/02 , F16L17/06 , F16L17/02 , F16L13/11 , B22F7/06 , B22F7/08 , B32B5/16 , B32B5/30 , B32B7/12 , B32B37/12 , B32B15/01 , B33Y10/00 , B33Y80/00 , B33Y40/00 , B33Y30/00
CPC分类号： B32B15/01 , B22F7/08 , B22F2999/0020130101 , B33Y80/00 , B33Y10/00 , B33Y30/00 , B22F7/062 , B32B37/1284 , B32B5/30 , B32B7/12 , B32B2605/0820130101 , B32B2605/1220130101 , B32B2250/0220130101 , B32B2605/1820130101 , B32B2264/10520130101 , B32B5/16 , Y02P10/25 , F16L13/103 , F16L47/02 , B22F12/52 , B22F12/49 , B22F10/28 , B22F12/22 , B33Y40/00
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公开(公告)号：EP4392992A1
公开(公告)日：2024-07-03
申请号：EP22777419.7
申请日：2022-08-29
发明人： TOTEMEIER, Aaron
CPC分类号： G21C3/3265 , G21C3/3267 , G21C3/04 , G21C3/16 , G21C21/02 , B33Y80/00 , B22F2998/0020130101 , Y02E30/30
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公开(公告)号：EP4269000B1
公开(公告)日：2024-07-03
申请号：EP22176511.8
申请日：2022-05-31
IPC分类号： B22F10/10 , B33Y10/00 , B33Y40/20 , B33Y80/00 , H01F1/00 , B22F5/10 , B22F7/06 , B22F10/18 , H01F3/08 , B22F3/10 , B22F10/64 , B22F12/53 , B22F12/55 , H01F3/02 , H01F41/02 , H02K15/02 , H01F3/10
CPC分类号： B33Y10/00 , B33Y80/00 , C22C2202/0220130101 , B22F10/10 , B33Y40/20 , B22F5/10 , B22F7/06 , B22F10/18 , B22F3/1021 , B22F10/64 , B22F12/53 , B22F12/55 , H01F3/02 , H01F41/0233 , H01F2003/10620130101 , H02K15/02 , B22F2203/0520130101 , B22F2999/0020130101 , H02K1/02 , H01F1/00 , H02K1/2781 , H02K15/00
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公开(公告)号：EP4257916B1
公开(公告)日：2024-07-03
申请号：EP22166482.4
申请日：2022-04-04
CPC分类号： G01B5/003 , G01B3/28 , B23P15/00 , B22F10/28 , B33Y80/00 , B33Y10/00 , F01L2303/0120200501 , F01L2303/0020200501 , F01L2301/0020200501
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