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    CONNECTOR, MANUFACTURING METHOD, INTERCONNECTION SYSTEM, AND COMMUNICATION DEVICE
    5.
    发明公开
    CONNECTOR, MANUFACTURING METHOD, INTERCONNECTION SYSTEM, AND COMMUNICATION DEVICE 审中-实审

    公开(公告)号：EP4369534A1

    公开(公告)日：2024-05-15

    申请号：EP22868928.7

    申请日：2022-08-16

    申请人： Huawei Technologies Co., Ltd.

    发明人： CAO, Shuzhao ,  QIU, Shuang ,  YANG, Xichen ,  ZHANG, Jie

    IPC分类号： H01R43/18 ,  H01R13/6591 ,  H01R13/648 ,  H01R13/40 ,  H01R13/46

    CPC分类号： H01R43/18 ,  H01R13/648 ,  H01R13/6591 ,  H01R13/46 ,  H01R13/40 ,  H01R43/00 ,  H01R12/73 ,  H01R12/7082 ,  H05K1/144 ,  H05K2201/201820130101 ,  H05K2201/04220130101

    摘要： This application provides a connector, a connector preparation method, an interconnection system, and a communication device, to achieve comparatively low costs, comparatively good electrical performance, and connector fabrication process simplification. The connector may include a base structure. At least one first via hole is disposed between a first surface and second surface of the base structure. The first surface has a first metal layer and a first clearance region that is in one-to-one correspondence with the at least one first via hole. The first clearance region is of a ring-shaped structure. The first via hole is located in a region encircled by the corresponding first clearance region. The first clearance region does not overlap the first metal layer. The second surface has a second metal layer and a second clearance region that is in one-to-one correspondence with the at least one first via hole. The second clearance region is of a ring-shaped structure. The first via hole is located in a region encircled by the corresponding second clearance region. The second clearance region does not overlap the second metal layer. A surface, of the base structure, other than the first surface and the second surface has a third metal layer.