IMAGING METHOD AND IMAGING APPARATUS
    62.
    发明公开

    公开(公告)号:EP3358338A1

    公开(公告)日:2018-08-08

    申请号:EP16851695.3

    申请日:2016-09-28

    IPC分类号: G01N22/00

    摘要: An imaging method includes a step of radiating a wave to a target object (10), a step of receiving a scattered wave as a result of the wave being scattered at the target object (10), and a step of reconstructing an image regarding internal information of the target object (10) on the basis of scattered wave data indicating the scattered wave. In the step of reconstructing the image, a reconstruction function is derived by solving a partial differential equation by using the scattered wave data and an analysis model indicating a shape, and the image regarding the internal information of the target object (10) is reconstructed by using the reconstruction function. Here, the partial differential equation is an equation satisfied by the reconstruction function for reconstructing the image regarding the internal information of the target object (10).

    SHAPE EVALUATION METHOD AND SHAPE EVALUATION APPARATUS
    65.
    发明公开
    SHAPE EVALUATION METHOD AND SHAPE EVALUATION APPARATUS 审中-公开
    形状评估方法和形状评估装置

    公开(公告)号:EP3255379A1

    公开(公告)日:2017-12-13

    申请号:EP16746628.3

    申请日:2016-02-02

    IPC分类号: G01B21/30

    摘要: A shape evaluation method according to the present invention comprises: a shape error calculation step that calculates a shape error, which is an error between a designed shape and a shape to be evaluated; and a visible error detection step that detects visible shape errors on the basis of the shape error and predetermined visual characteristic data.

    摘要翻译: 根据本发明的形状评估方法包括:形状误差计算步骤,用于计算作为设计形状和待评估形状之间的误差的形状误差; 以及可视错误检测步骤,基于所述形状错误和预定视觉特征数据来检测可见形状错误。

    ON-CHIP MONITOR CIRCUIT AND SEMICONDUCTOR CHIP
    66.
    发明公开
    ON-CHIP MONITOR CIRCUIT AND SEMICONDUCTOR CHIP 审中-公开
    片上监视电路和半导体芯片

    公开(公告)号:EP3246717A1

    公开(公告)日:2017-11-22

    申请号:EP16737338.0

    申请日:2016-01-12

    摘要: Provided is an on-chip monitor circuit mounted on a semiconductor chip that is equipped with a security function module for performing a security function process on an input signal and outputting a security function signal, the on-chip monitor circuit comprising a monitor circuit for monitoring signal waveforms of the semiconductor chip, wherein the circuit is provided with a first storage means for storing data that designates a window period in which to perform a test of the semiconductor chip, and a control means for performing control to operate the circuit during the window period, when a prescribed test signal is inputted to the security function module. By using the on-chip monitor circuit in a semiconductor chip of which security is required, security attacks, e.g., a Trojan horse or the like, intended to embed a malicious circuit in the production stage of security function module-equipped semiconductor chips, can be prevented.

    摘要翻译: 提供了一种安装在半导体芯片上的片上监控电路,其配备有安全功能模块,用于对输入信号执行安全功能处理并输出安全功能信号,片上监控电路包括监控电路,用于监控 其中该电路设置有用于存储数据的第一存储装置,该数据指定用于执行半导体芯片的测试的窗口周期,以及控制装置,用于执行控制以在窗口期间操作电路 期间,当规定的测试信号被输入到安全功能模块时。 通过在需要安全性的半导体芯片中使用片上监控电路,在安全功能模块配备的半导体芯片的生产阶段中,旨在嵌入恶意电路的安全攻击,例如特洛伊木马等可以 被阻止。

    LATENT HEAT TRANSFER MATERIAL MICRO-ENCAPSULATED IN HARD SHELL, AND PRODUCTION METHOD FOR SAME
    68.
    发明公开
    LATENT HEAT TRANSFER MATERIAL MICRO-ENCAPSULATED IN HARD SHELL, AND PRODUCTION METHOD FOR SAME 审中-公开
    在EINER HARTEN SCHALE MIKROVERKAPSELTES LATENTESWÄRMEÜBERTRAGUNGSMATERIALUND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号:EP3037496A1

    公开(公告)日:2016-06-29

    申请号:EP14838477.9

    申请日:2014-08-25

    摘要: Provided is a latent heat transfer material that is micro-encapsulated, said material exhibiting superior mechanical strength and heat resistance. A production method for the latent heat transfer material that is micro-encapsulated in a hard shell comprises: 1) a step in which a perforate hollow silica particle is manufactured; 2) a step in which the phase change material is sealed inside the perforate hollow silica particle by inserting the perforate hollow silica particle in a molten solution of the phase change material and repeatedly subj ecting the same to vibrations such as ultrasound oscillations; 3) a step in which the perforate hollow silica particle having the phase change material sealed within is washed in a saturated aqueous solution of the phase change material; and 4) a step in which perhydropolysilazane is used to coat the outer shell of the perforate hollow silica particle with silica.

    摘要翻译: 提供了微胶囊化的潜热传递材料,所述材料表现出优异的机械强度和耐热性。 微胶囊化在硬壳中的潜热传输材料的制造方法包括:1)制造穿孔中空二氧化硅粒子的工序; 2)通过将穿孔中空二氧化硅颗粒插入相变材料的熔融溶液中并将其重复地反射到诸如超声波振动的振动中,将相变材料密封在穿孔中空二氧化硅颗粒内的步骤; 3)将相变材料密封的穿孔中空二氧化硅颗粒在相变材料的饱和水溶液中洗涤的步骤; 和4)使用全氢聚硅氮烷以二氧化硅涂覆穿孔中空二氧化硅颗粒的外壳的步骤。

    DISTRIBUTION ANALYZING DEVICE AND DISTRIBUTION ANALYZING METHOD
    69.
    发明公开
    DISTRIBUTION ANALYZING DEVICE AND DISTRIBUTION ANALYZING METHOD 有权
    分析的分布分析装置和分发方法

    公开(公告)号:EP2960668A1

    公开(公告)日:2015-12-30

    申请号:EP14753850.8

    申请日:2014-02-13

    发明人: KIMURA, Kenjiro

    IPC分类号: G01R33/10 G01R29/14

    CPC分类号: G01R33/10

    摘要: A distribution analyzing device (20) includes: an obtaining unit (21) which obtains measurement data of a field measured, through a sensor sensing area, independently at each of rotation angles and at each of grid coordinate positions of the sensor sensing area; and a calculation unit (22) which calculates a distribution of the field from the measurement data, using an arithmetic expression obtained by deriving a target harmonic function, which indicates the distribution of the field, using a condition that a convolution of the target harmonic function and a shape function, which indicates a shape of a cross section of the finite sensor sensing area along a plane parallel to the measurement plane, is equal to a provisional harmonic function derived by solving the Laplace equation using the measurement data and a size of the sensor sensing area in a direction perpendicular to the measurement plane.