Abstract:
An antenna element 1 is formed such that a plurality of turning parts 13, 15, 17 are formed by being turned back in zigzag in parallel to a ground conductor film 2 while extending perpendicularly thereto and the lengths of segments 12, 14, 16, 18 between the turning parts are shorter on a side of the ground conductor film 2 (a side of a feeding part 4) and increase gradually as the segments are away from the ground conductor film 2. The turning parts of the antenna element 1 are formed such that the antenna resonates at two or more frequency bands, and has a fractional bandwidth of 4% or more of its frequency in a first frequency band and a fractional bandwidth of 15% or more of its frequency in a second frequency band by adjusting the lengths L 1 , L 2 and L 3 of respective segments and the intervals d 1 , d 2 and d 3 between adjacent segments. Consequently, a wideband antenna is realized in two or more multi-frequency bands, for example 2.4 to 2.5 GHz and 5 to 6 GHz, by using a single folded antenna.
Abstract:
The invention relates to a microwave antenna for flip-chip semiconductor modules, comprising two semiconductor substrates which are metallized on the surface thereof. Patch antennas, i.e. metallized flat areas which are insulated from the rest of the circuit on an outer surface of a module with a supply line to the circuit, are already known per se. They result in vertical radiation at a relatively large angle. According to the invention, a closed group of bumps are arranged in such a way that the distance of the bumps (2) to each other is less than the half wavelength (μ/2) of the microsignal which is to be radiated or received and an open radiation slot arises in at least one pair of side walls (3,4) of the semiconductor substrates (a,b) and a bump, which is connected to the circuit of the semiconductor module, is arranged between the bumps (2) and the radiation slot, enabling the microwave antenna to be excited.
Abstract:
An issue of reducing a product manufacture unit cost exists in wireless IC chips which are required to be disposable because the wireless IC chips circulate in a massive scale and require a very high collection cost. It is possible to increase the communication distance of a wireless IC chip with an on-chip antenna simply contrived for reduction of the production unit cost by increasing the size of the antenna mounted on a wireless IC chip or by increasing the output power of a reader as in a conventional way. However, because of the circumstances of the applications used and the read accuracy of the reader, the antenna cannot be mounted on a very small chip in an in-chip antenna form. When an AC magnetic field is applied to an on-chip antenna from outside, eddy current is produced in principle because the semiconductor substrate is conductive. It has been fount that the thickness of the substrate can be used as a design parameter because of the eddy current. Based on this finding, according to the invention, the thickness of the substrate is decreased to reduce or eliminate the energy loss due to the eddy current to utilize the electromagnetic wave energy for the semiconductor circuit operation as originally designed. With the thickness reduction, it is possible to increase the communication distance by preventing ineffective absorption of energy and thereby increasing the current flowing through the on-chip antenna.
Abstract:
The present invention provides an antenna device capable of automatically obtaining excellent receiving sensitivity over a wide band. The antenna device comprises a rod-shaped base made of a dielectric material or a magnetic material; a stripe-shape radiating conductor divided into a plurality of radiating conductors wound around the base; and variable capacitive elements provided to correspond to the same number of the radiating conductors. The radiating conductors and the variable capacitive elements are alternatively arranged on the base and are connected in series to each other, the radiating conductor having its one end connected to the variable capacitive element serves as an open side and the variable capacitive element having its one end connected to the radiating conductor serves as a signal feeding side, and capacitance values of the variable capacitive elements increase or decrease in the same direction to be tuned to a predetermined frequency.
Abstract:
In order to provide a small size antenna where excellent antenna properties can be stably gained, a frequency adjustment is easy and a simple measurement is possible, according to the present invention, a small size antenna formed of a conductor of at least two adjoining surfaces of a base in rectangular parallelepiped form made of dielectric ceramics is characterized in that: a step is made of a flat portion parallel to one surface of the two adjoining surfaces and an inclining portion located between the one surface and the flat portion, in a corner portion of the two surfaces on which the conductor is formed; the width of the flat portion is 0.08 mm or less; and a border portion between the flat portion and the other surface of the two adjoining surfaces is a curve having a curvature radius R of 0.03 mm to 0.2 mm.
Abstract:
A parasitic radiation electrode (3) and a driven radiation electrode (4) are formed at an interval on the surface of a dielectric base (2). A material (8) for permittivity adjustment is provided in an interval (S) between the parasitic radiation electrode (3) and the driven radiation electrode (4) where capacitance is created. The material (8) for permittivity adjustment has a lower permittivity than the dielectric base (2), so that the permittivity between the parasitic radiation electrode (3) and the driven radiation electrode (4) is below the permittivity of the dielectric base (2), reducing the capacitive coupling between the parasitic radiation electrode (3) and the driven radiation electrode (4). As a result, the resonance interaction between the parasitic radiation electrode (3) and the driven radiation electrode (4) decreases, thus improving antenna performance, without taking measures, such as an increase in the interval (S) between the parasitic radiation electrode (3) and the driven radiation electrode (4) and a decrease in permittivity of the dielectric bases (2), which may obstruct the miniaturization of a surface-mount antenna (1).
Abstract:
Disclosed is a microchip dual band antenna mounted to a printed circuit board having a ground surface and a non-ground surface. The microchip dual band antenna comprises first and second patch elements respectively surrounding both lengthwise ends of a dielectric body having a shape of a quadrangular prism; a first radiation patch separated from the first patch element and placed on an upper surface of the dielectric body to extend zigzag toward the second patch element; a second radiation patch joined to the second patch element and placed on a lower surface of the dielectric body to extend zigzag toward the first patch element by a distance less than one half of an entire length of the dielectric body, in a manner such that zigzag configurations of the first and second radiation patches are staggered with each other; and a first feeder channel defined on a front surface and adjacent to one end of the dielectric body and plated in such a way as to connect the first and second radiation patches.
Abstract:
A second matching circuit (8-2) includes a transmission line (6b) having a predetermined electrical length, and a parallel-resonant circuit (5) connected in parallel with the transmission line, and adapted to resonate at a frequency f2 and exhibit a predetermined susceptance value at a lower frequency f1. A first matching circuit (8-1) is disposed between the input terminal (2) of an antenna (1) and the second matching circuit to match the input impedance of the antenna with the characteristic impedance of an external circuit (10) at the frequency f2. The first matching circuit (8-1) includes a transmission line (a) having a predetermined electrical length, and a capacitance device (3a) connected in series to the transmission line.
Abstract:
Power non-supplied side radiation electrode 3 and power supplied side radiation electrode 4 are formed on the surface of a dielectric substrate 2 with a space therebetween. A permittivity adjusting material portion 8 is provided in the space S which is situated between the power non-supplied side radiation electrode 3 and the power supplied side radiation electrode 4, and in which a capacity occurs. The permittivity adjusting material portion 8 has a lower permittivity than that of the dielectric substrate 2, which causes the permittivity between the power non-supplied side radiation electrode 3 and the power supplied side radiation electrode 4 to be lower than that of dielectric substrate 2, and weaken the capacitive coupling between the power non-supplied side radiation electrode 3 and the power supplied side radiation electrode 4. As a result, it becomes possible to suppress the mutual interference of the resonances of the power non-supplied side radiation electrode 3 and the power supplied side radiation electrode 4, and to thereby improve antenna characteristics, without taking measures such as widening of the space S between the power non-supplied side radiation electrode 3 and the power supplied side radiation electrode 4, or a reduction of the permittivity of the dielectric substrate 2, the measures hindering the surface-mounted type antenna 1 from miniaturization.
Abstract:
A surface mounting antenna comprises a substrate (1) having one of a dielectric member and magnetic member the substrate having main surfaces and lateral surfaces connecting the main surfaces. A radiation electrode (5) is disposed on one main surface of said substrate (1) and continuing onto a lateral surface (1a) of said substrate (1) and having a matching portion (5e) on said lateral surface (1a). A feeding electrode is disposed on the lateral surface (1a) of said substrate (1) on which a portion of the radiation electrode (5) is disposed and being coupled to said matching portion (5e) of said radiation electrode (5). A loading capacitor electrode (4) is disposed on a lateral surface (1b) of said substrate (1) and connected to a first end of said radiation electrode (5). A ground terminal (2) is disposed on a lateral surface (la) of the substrate (1) and connected to a second end of said radiation electrode (5). Finally, a feeding terminal (3) is disposed on a lateral surface (1a) of the substrate (1) and connected to said feeding electrode (5).