公开(公告)号：EP4401245A3

公开(公告)日：2024-10-09

申请号：EP24160128.5

申请日：2017-12-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： WANG, Hanyang ,  KHRIPKOV, Alexander ,  TU, Dongxing ,  LUO, Hongting ,  MILOSAVLJEVIC, Zlatoljub ,  LI, Linsheng

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q23/00

CPC classification number: H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q23/00

Abstract: A communication device (102; 202; 302) comprising: a millimetre wave antenna arrangement (104) comprising a distributed millimetre wave antenna radiating element (106, 108, 110) and a corresponding fixed millimetre wave antenna radiating element (112, 114, 116); a Radio Frequency Integrated Circuit; wherein the fixed millimetre wave antenna radiating element is arranged together with the Radio Frequency Integrated Circuit (118) on a first substrate (120); wherein the distributed millimetre wave antenna radiating element is arranged on at least one second substrate (122; 124) spaced apart from the first substrate; and a switching arrangement (126) configured to selectively connect either the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit or the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit. An associated method in a communication device, and an associated computer program product.

公开(公告)号：EP4020711B1

公开(公告)日：2024-10-09

申请号：EP21195238.7

申请日：2021-09-07

IPC: H01Q15/00 ,  H01Q1/22 ,  H01Q15/14 ,  H01L23/552 ,  H01L23/66 ,  G06F13/14 ,  G06F13/40 ,  H01L23/00 ,  H01L25/03 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L2224/1623520130101 ,  H01L2924/1519220130101 ,  H01L2924/153120130101 ,  H01L2224/1614620130101 ,  H01L2224/1614520130101 ,  H01L2224/1622720130101 ,  H01L2224/1718120130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0654120130101 ,  H01L2225/0656520130101 ,  H01L25/0652 ,  H01L2225/0653120130101 ,  H01L2223/667720130101 ,  H01L25/10 ,  H01L25/03 ,  H01L2924/1531120130101 ,  H01L23/66 ,  H01Q1/2283 ,  H01L24/16 ,  H01L24/17 ,  H01L2225/104720130101 ,  H01L2924/143420130101 ,  H01L2924/143620130101 ,  H01L2924/143220130101 ,  H01L25/0655 ,  H01L23/552 ,  H01L2924/302520130101 ,  H01Q15/002 ,  H01Q15/148 ,  G06F13/14 ,  G06F13/4068

公开(公告)号：EP3949011B1

公开(公告)日：2024-10-09

申请号：EP20713616.9

申请日：2020-03-23

IPC: H01Q1/22 ,  H01P5/107 ,  H01Q19/08

CPC classification number: H01P5/107 ,  H01Q1/225 ,  H01Q1/2283 ,  H01Q19/08

公开(公告)号：EP3955375B1

公开(公告)日：2024-09-25

申请号：EP20786719.3

申请日：2020-04-07

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q23/00 ,  G06K19/077

CPC classification number: H01Q7/00 ,  H01Q23/00 ,  G06K19/07749 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/2283

公开(公告)号：EP3547362B1

公开(公告)日：2024-08-21

申请号：EP19160265.5

申请日：2019-03-01

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01Q1/22 ,  H01Q21/06 ,  H01Q21/28 ,  H01L23/538 ,  H01Q9/04 ,  H01P5/16

CPC classification number: H01L23/3171 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/96 ,  H01L2223/667720130101 ,  H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/1816220130101 ,  H01L2224/1413320130101 ,  H01L2224/1622520130101 ,  H01L2224/1310120130101 ,  H01L24/13 ,  H01Q1/2283 ,  H01Q21/28 ,  H01Q9/0407 ,  H01Q21/065 ,  H01P5/16 ,  H01L2223/662720130101 ,  H01L2224/7320920130101 ,  H01L2224/7310420130101 ,  H01L2224/1308220130101

公开(公告)号：EP4402753A1

公开(公告)日：2024-07-24

申请号：EP22873788.8

申请日：2022-09-16

Applicant: Jabil Inc.

Inventor： TIMMINS, Ian, Jeffery ,  RAFIE, Babak, Zarrin ,  FALTON, Youssef ,  FINNELL, John

IPC: H01Q1/38 ,  H01Q21/06 ,  H01Q3/00

CPC classification number: H01Q1/38 ,  H01Q3/26 ,  H01Q21/24 ,  H01Q21/065 ,  H01Q1/2283

公开(公告)号：EP4401245A2

公开(公告)日：2024-07-17

申请号：EP24160128.5

申请日：2017-12-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： WANG, Hanyang ,  KHRIPKOV, Alexander ,  TU, Dongxing ,  LUO, Hongting ,  MILOSAVLJEVIC, Zlatoljub ,  LI, Linsheng

IPC: H01Q23/00

CPC classification number: H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q23/00

Abstract: A communication device (102; 202; 302) comprising: a millimetre wave antenna arrangement (104) comprising a distributed millimetre wave antenna radiating element (106, 108, 110) and a corresponding fixed millimetre wave antenna radiating element (112, 114, 116); a Radio Frequency Integrated Circuit; wherein the fixed millimetre wave antenna radiating element is arranged together with the Radio Frequency Integrated Circuit (118) on a first substrate (120); wherein the distributed millimetre wave antenna radiating element is arranged on at least one second substrate (122; 124) spaced apart from the first substrate; and a switching arrangement (126) configured to selectively connect either the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit or the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit. An associated method in a communication device, and an associated computer program product.

公开(公告)号：EP4396961A1

公开(公告)日：2024-07-10

申请号：EP22765587.5

申请日：2022-08-25

Applicant: Teknologian Tutkimuskeskus VTT OY

Inventor： VARONEN, Mikko ,  PARVEG, Dristy ,  RANTAKARI, Pekka ,  LAMMINEN, Antti ,  ERMOLOV, Vladimir ,  SÄILY, Jussi ,  KARTTAAVI, Timo

IPC: H04B7/06 ,  H04B7/08 ,  H01Q3/26 ,  H01Q21/00 ,  H04B1/38

CPC classification number: H04B7/0617 ,  H04B7/084 ,  H01Q3/26 ,  H01Q21/0025 ,  H01Q1/2283

公开(公告)号：EP4386989A1

公开(公告)日：2024-06-19

申请号：EP22881258.2

申请日：2022-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： YUN, Sumin ,  KIM, Hosaeng ,  PARK, Seongjin ,  JANG, Woomin ,  JONG, Jehun ,  JO, Jaehoon

IPC: H01Q9/04 ,  H01Q3/36 ,  H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q5/321 ,  H01Q1/521 ,  H01Q9/0414 ,  H01Q21/065

Abstract: An example electronic device may include an antenna module including a printed circuit board, a plurality of conductive patches including a first conductive patch and a second conductive patch, an RFIC which is disposed on the second surface of the printed circuit board and includes a first tuning circuit, and a first conductive structure which includes a first portion extending from the first conductive patch, a second portion extending from the second conductive patch and connected to the first portion at a point positioned at one end of the first portion, and a first common portion connected to the first tuning circuit and connecting the first conductive patch and the second conductive patch to the first tuning circuit, a ground, and a wireless communication circuit, and the wireless communication circuit may be configured to feed the plurality of conductive patches to receive a signal in a designated frequency band.

公开(公告)号：EP3840114B1

公开(公告)日：2024-05-29

申请号：EP20212279.2

申请日：2020-12-07

IPC: H01Q1/22 ,  H01Q13/06 ,  H01Q21/06 ,  H01Q21/00 ,  G01S7/03 ,  H01L23/13 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  G01S13/931 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01Q13/06 ,  H01Q21/064 ,  H01Q21/0087 ,  H01L23/66 ,  H01L2223/667720130101 ,  G01S7/032 ,  H01L23/5389 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49833 ,  G01S13/931 ,  H01L2223/662720130101 ,  H01L2224/2419520130101 ,  H01L2224/1210520130101 ,  H01L24/19 ,  H01L24/20 ,  H01L2924/1816220130101