公开(公告)号：EP2994809A1

公开(公告)日：2016-03-16

申请号：EP14795158.6

申请日：2014-05-06

Applicant: Green Revolution Cooling, Inc.

Inventor： BEST, Christiaan Scott

IPC: G06F1/20

CPC classification number: H05K7/2079 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20236 ,  H05K7/20781

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract translation: 计算系统包括一个或多个包括一个或多个机架的机架行。 机架包括一个或多个容纳一个或多个服务器中的至少一个服务器的液体冷却剂的罐，以及用于从一个或多个服务器中的至少一个服务器移除热量的液体冷却剂。 在机架行旁边或两个机架行之间提供通道。 过道包括一个楼层。 服务人员可以在地板上行走至少一行中的一个或多个机架中的至少一个。 至少部分地在通道下方的冷却部件移动液体以从至少一个机架中的至少一个服务器移除热量。 机架，地板和冷却部件可能是耐火的。

公开(公告)号：EP2973689A1

公开(公告)日：2016-01-20

申请号：EP14774761.2

申请日：2014-02-19

Applicant: Tactus Technology, Inc.

Inventor： YAIRI, Micah ,  CIESLA, Craig ,  CONSTANTINE, Perry, George ,  WEIGAND, Dave, Lind

IPC: H01L23/473

CPC classification number: H01L23/34 ,  G06F1/1694 ,  G06F1/203 ,  G06F1/206 ,  G06F3/016 ,  G06F2200/201 ,  G06F2203/04809 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20981 ,  H01L2924/00

Abstract: One variation of a system for cooling an electrical component within a computing device - including a digital display - includes: an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage including a first end and a second end; a heat exchange layer arranged across a viewing surface of the digital display, including a transparent material, and defining a fluid channel extending across a portion of the digital display, the fluid channel including a fluid inlet coupled to the first end of the fluid passage and a fluid outlet coupled to the second end of the fluid passage; a transparent fluid; and a displacement device configured to circulate the transparent fluid between the internal heatsink and the fluid channel.

公开(公告)号：EP2787801A4

公开(公告)日：2016-01-06

申请号：EP11876495

申请日：2011-12-01

Applicant: FUJITSU LTD

Inventor： KONDO MASAO ,  FUKUDA HIROYUKI ,  UMEMIYA SHIGEYOSHI ,  ENDO HIROSHI

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20736 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20818 ,  H05K7/20836 ,  Y02D10/16

Abstract: [Problem] To provide an electronic device rack and an information processing apparatus capable of efficiently cooling electronic devices even when the amount of heat generated per rack reaches 30 kW or larger. [Solving Means] An electronic device rack 10 includes a plurality of panels 10a, 10b, 10c, ... surrounding a first space. Moreover, the electronic device rack 10 includes: an electronic-device housing unit 11 disposed in the first space and configured to house electronic devices 15; a heat exchanger 12 disposed in the first space at a position away from the electronic-device housing unit 11; a second space 21 provided between the electronic-device housing unit 11 and the heat exchanger 12 and isolated from the rest of the first space; and an air blower 13 configured to circulate air inside the first space through the electronic-device housing unit 11, the second space 21, and the heat exchanger 12 in the described order.

公开(公告)号：EP2918151A1

公开(公告)日：2015-09-16

申请号：EP13853840.0

申请日：2013-09-24

Applicant: Silicon Graphics International Corp.

Inventor： DEAN, Steven J. ,  RAMSEIER, Roger ,  MALONEY, Mark ,  COLLINS, David R.

IPC: H05K5/04

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

公开(公告)号：EP1923771B1

公开(公告)日：2015-05-20

申请号：EP08100686.8

申请日：2004-11-08

Applicant: Asetek A/S

Inventor： Eriksen, André Sloth

IPC: G06F1/20

CPC classification number: G06F1/206 ,  F28D15/00 ,  F28F2250/08 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20154 ,  H05K7/20263 ,  H05K7/20272

公开(公告)号：EP2774016A1

公开(公告)日：2014-09-10

申请号：EP12845101.0

申请日：2012-11-05

Applicant: Parker-Hannifin Corporation

Inventor： LOUVAR, Timothy Douglas ,  HUNNICUTT, Jessica Anne

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F1/185 ,  G06F2200/201 ,  H05K7/20254

Abstract: An electronic module cooling apparatus and method for cooling a plurality of electronic modules each including a circuit board to which one or more electronic components are mounted, in particular memory modules, disposed on a substrate in spaced-apart parallel relationship. The apparatus and method provide for effective cooling of the electronic modules while still allowing for insertion and removal of the electronic modules from a common substrate and/or providing for biased contact with electrical components of the electronic modules. In a particular embodiment, the apparatus provides for liquid cooling memory boards, allowing heat to be removed from the electronic components that are contained in densely populated enclosures without the need for air flow.

公开(公告)号：EP2734021A1

公开(公告)日：2014-05-21

申请号：EP12815511.6

申请日：2012-07-05

Applicant: NEC Corporation

Inventor： INABA, Kenichi ,  YOSHIKAWA, Minoru ,  SAKAMOTO, Hitoshi ,  CHIBA, Masaki ,  MATSUNAGA, Arihiro

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20309 ,  F28D15/0266 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20727 ,  H05K7/20818

Abstract: A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.

Abstract translation: 一种冷却系统，包括：用于通过与外部空气进行热交换来蒸发制冷剂的蒸发器; 冷凝器，其通过使制冷剂和冷却介质彼此进行热交换而将气态制冷剂冷凝成液体制冷剂; 连接蒸发器和冷凝器的气体制冷剂管和液体制冷剂管; 所述蒸发器包括：设置在所述蒸发器的最高位置的上部集管，并且通过所述气体制冷剂管与所述冷凝器连接，所述气体制冷剂管通过所述气体制冷剂流动; 设置在蒸发器的最低位置的下部集管，并且通过液体制冷剂管与冷凝器连接，通过液体制冷剂管流动液体制冷剂; 中间集管，设置在上部集管和下部集管之间的中间位置，并通过液体制冷剂管与冷凝器连接，通过液体制冷剂管流动液体制冷剂; 上部蒸发器，布置在上部集管和中间集管之间，包括上部蒸汽发生管，其具有用于将中间集管的制冷剂引导到上部集管的第一流动路径，同时使中间集管的制冷剂执行 与外部空气进行热交换，并且具有用于将下部集管的制冷剂导向上部集管的第二流路，同时使下部集管的制冷剂与外部空气进行热交换; 以及下部蒸发器，设置在下部集管和中间集管之间，包括下部蒸汽发生管，其具有插入中间集管的第三流路，同时使下部集管的制冷剂与外部空气进行热交换， 下部蒸汽发生管与上部蒸汽发生管的第二流路连通。

公开(公告)号：EP2653949A4

公开(公告)日：2014-01-08

申请号：EP12853729

申请日：2012-05-02

Applicant: HUAWEI TECH CO LTD

Inventor： YANG CHENGPENG ,  PENG YAOFENG

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2673683A1

公开(公告)日：2013-12-18

申请号：EP12704352.9

申请日：2012-02-07

Applicant: Dell Products, L.P.

Inventor： SCHMITT, Ty ,  BAILEY, Mark M. ,  DUNCAN, Taylor

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/1497 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20745

Abstract: In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.

Abstract translation: 根据本公开，提出了一种具有模块化数据中心中的模式的模块化流体处理系统的系统和方法。 根据本申请，模块化数据中心可以包括模块化主要结构。 模块化主要结构可以包括布置在其内的机架中的多个信息处理系统。 模块化数据中心还可以包括模块化流体处理系统，该系统至少部分地根据多种模式使流体循环通过模块化主要结构。 模块化流体处理系统可以设计成适应模块化数据中心将在其中运行的环境条件以及模块化主要结构的使用要求。

公开(公告)号：EP2604941A1

公开(公告)日：2013-06-19

申请号：EP11816416.9

申请日：2011-08-09

Applicant: Hitachi Plant Technologies, Ltd. ,  Hitachi, Ltd.

Inventor： KASHIRAJIMA, Yasuhiro ,  ITO, Junichi ,  YOSHIDA, Tomohiro ,  SENDA, Masakatsu ,  MIKAMI, Teruo ,  SAWAMOTO, Hideo ,  IDEI, Akio ,  KOYANO, Koichi

IPC: F24F11/02 ,  F24F7/06 ,  F24F11/04 ,  F25B49/02 ,  G06F1/20

CPC classification number: G06F1/20 ,  F24F11/77 ,  F24F2221/40 ,  F25B5/00 ,  F25B49/00 ,  F25B2600/112 ,  F25B2600/2513 ,  F25B2700/197 ,  F25B2700/2117 ,  F25B2700/21171 ,  G06F2200/201 ,  H05K7/20827 ,  Y02B30/743

Abstract: Provided is an apparatus for operating a cooling system in an abnormal state, and the cooling system includes plurality of evaporators that suck warm air exhausted from a plurality of electronic equipments installed in an equipment room with fans, cool the warm air through heat exchange with a refrigerant flowing in each cooling coil, and supply cool air into the equipment room; and a condenser disposed at a position higher than the plurality of evaporators, so as to cool the refrigerant circulated naturally between the condenser and each evaporator. The cooling system adjusts a supplied air temperature of air supplied from each evaporator by adjusting an opening degree of each flow regulating valve that adjusts a flow rate of the refrigerant flowing in each cooling coil. The apparatus includes deviation information detecting means for sequentially detecting deviation information between an maximum cooling capacity and a current cooling capacity in operation for each of the plurality of evaporators; and fan controlling means for reducing or stopping a rotational frequency of a fan for an evaporator which has deviation information exceeding a predefined abnormal determining threshold value among the plurality of evaporators.

Abstract translation: 提供一种用于操作处于异常状态的冷却系统的装置，并且冷却系统包括多个蒸发器，其吸收从安装在具有风扇的设备室中的多个电子设备排出的热空气，通过与 在每个冷却盘管中流动的制冷剂，并向设备室供应冷气; 以及冷凝器，其设置在比所述多个蒸发器高的位置，以冷却在冷凝器和每个蒸发器之间自然循环的制冷剂。 冷却系统通过调节调节在每个冷却盘管中流动的制冷剂的流量的每个流量调节阀的开度来调节从每个蒸发器供应的空气的供应空气温度。 该装置包括偏差信息检测装置，用于在多个蒸发器中的每一个上顺序地检测运行中的最大冷却能力和当前冷却能力之间的偏差信息; 以及风扇控制装置，用于减少或停止具有超过多个蒸发器中的预定异常判定阈值的偏差信息的蒸发器的风扇的转速。