HYBRID COOLING ARRANGEMENT FOR AUTONOMOUS AND IMMERSION COOLED RACKS

    公开(公告)号:EP4432798A1

    公开(公告)日:2024-09-18

    申请号:EP23305366.9

    申请日:2023-03-16

    申请人: OVH

    IPC分类号: H05K7/20

    摘要: A rack assembly including a cooling module for liquid-to-liquid cooling, a rack and an immersion cooling (IC) rack is disclosed. The rack includes a rack cooling block that cools a rack electronic processing assembly and a rack fluid conduit that circulates a first cooling fluid through the rack cooling block and the cooling module. The IC rack includes a dielectric IC fluid, an IC cooling block immersed in the dielectric IC fluid for cooling an IC electronic processing assembly when the IC electronic processing assembly is placed in contact with the IC cooling block and an IC fluid conduit that circulates a second cooling fluid through the IC cooling block and the cooling module. The rack and the IC rack are thermally connected via the cooling module such that thermal energy can be transferred between the IC fluid conduit and the rack fluid conduit within the cooling module.

    A SYSTEM, METHOD AND USE FOR PROVIDING THERMAL CAPACITY, GENERATED AS WASTE HEAT BY SOLID STATE TECHNOLOGY, TO CUSTOMERS

    公开(公告)号:EP4422367A1

    公开(公告)日:2024-08-28

    申请号:EP23158424.4

    申请日:2023-02-24

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20745 H05K7/2079

    摘要: The present invention relates to a system (100) for providing heat capacity (H) to customers (C) generated by a solid state thermal generator (16) which comprises at least one module (1). The at least one module (1) comprises a compute unit (10) provided with processors, a fan unit (12) and a heat exchanger unit (14). The compute unit (10) provides compute capacity (CAL) and a heat capacity generated by the processors, that produce heat capacity. The compute unit (10) further comprises an inner closed circuit (17) for recirculation of a cooling agent. The heat energy in the inner closed circuit (17) is exchanged to a fluid medium in an outer circuit (18) via the heat exchanger (14) that is positioned to receive the heat energy in the inner closed circuit (17). The heated fluid medium is supplied via a conduit (20) to customers (C) such that the heat capacity can be immediately consumed, stored in a heat capacity storage system (22) or be dumped. The invention also relates to a method for providing heat capacity to customers in the system and a use of heat capacity from at least one solid state thermal generator (16), to provide heat capacity to customers in the vicinity of the solid state thermal generator (16), while providing compute capacity.

    CONTINUOUS FEED LIQUID COOLANT REPLACEMENT
    4.
    发明公开

    公开(公告)号:EP4358663A1

    公开(公告)日:2024-04-24

    申请号:EP23175137.1

    申请日:2023-05-24

    申请人: Google LLC

    IPC分类号: H05K7/20

    摘要: Methods, systems, and apparatus for liquid coolant replacement in a cooling distribution unit during operation of the cooling distribution unit. Active liquid coolant to be replaced is removed from the flow cycle of the cooling distribution unit while the coolant distribution unit is operational and providing cooling to an electronic system. Additionally, replacement liquid coolant is provided to the flow cycle while the coolant distribution unit is operational and providing cooling to an electronic system.

    DATACENTER IMMERSED IN COOLING LIQUID
    9.
    发明公开
    DATACENTER IMMERSED IN COOLING LIQUID 审中-公开
    DATACENTER浸入冷却液中

    公开(公告)号:EP3162174A1

    公开(公告)日:2017-05-03

    申请号:EP15739707.6

    申请日:2015-06-26

    IPC分类号: H05K7/14 H05K7/20

    摘要: The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure.

    摘要翻译: 本发明涉及容纳在密封容器中的数据中心或部分数据中心(例如,数据中心模块)。 容器可以填充有冷却流体,例如电介质流体,以帮助冷却数据中心部件。 容器及其内部数据中心或数据中心部分可以浸没在水中,在这种情况下,流体也有助于平衡外部水压。