摘要:
A rack assembly including a cooling module for liquid-to-liquid cooling, a rack and an immersion cooling (IC) rack is disclosed. The rack includes a rack cooling block that cools a rack electronic processing assembly and a rack fluid conduit that circulates a first cooling fluid through the rack cooling block and the cooling module. The IC rack includes a dielectric IC fluid, an IC cooling block immersed in the dielectric IC fluid for cooling an IC electronic processing assembly when the IC electronic processing assembly is placed in contact with the IC cooling block and an IC fluid conduit that circulates a second cooling fluid through the IC cooling block and the cooling module. The rack and the IC rack are thermally connected via the cooling module such that thermal energy can be transferred between the IC fluid conduit and the rack fluid conduit within the cooling module.
摘要:
The present invention relates to a system (100) for providing heat capacity (H) to customers (C) generated by a solid state thermal generator (16) which comprises at least one module (1). The at least one module (1) comprises a compute unit (10) provided with processors, a fan unit (12) and a heat exchanger unit (14). The compute unit (10) provides compute capacity (CAL) and a heat capacity generated by the processors, that produce heat capacity. The compute unit (10) further comprises an inner closed circuit (17) for recirculation of a cooling agent. The heat energy in the inner closed circuit (17) is exchanged to a fluid medium in an outer circuit (18) via the heat exchanger (14) that is positioned to receive the heat energy in the inner closed circuit (17). The heated fluid medium is supplied via a conduit (20) to customers (C) such that the heat capacity can be immediately consumed, stored in a heat capacity storage system (22) or be dumped. The invention also relates to a method for providing heat capacity to customers in the system and a use of heat capacity from at least one solid state thermal generator (16), to provide heat capacity to customers in the vicinity of the solid state thermal generator (16), while providing compute capacity.
摘要:
In accordance with an aspect of the present disclosure, there is provided a cooling device (10) for an underwater datacenter, which is adapted to perform heat exchange between internal devices of the underwater datacenter and seawater, the cooling device including, an inlet duct (100) located on one surface of the underwater datacenter and having a seawater introducing passage formed therealong and outlet ducts (200) located spaced apart from the inlet duct and having seawater discharging passages formed therealong.
摘要:
Methods, systems, and apparatus for liquid coolant replacement in a cooling distribution unit during operation of the cooling distribution unit. Active liquid coolant to be replaced is removed from the flow cycle of the cooling distribution unit while the coolant distribution unit is operational and providing cooling to an electronic system. Additionally, replacement liquid coolant is provided to the flow cycle while the coolant distribution unit is operational and providing cooling to an electronic system.
摘要:
A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air.
摘要:
In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.
摘要:
The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure.
摘要:
Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.