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公开(公告)号:EP0635514B1
公开(公告)日:1999-05-12
申请号:EP94304922.1
申请日:1994-07-05
发明人: Mahood, James A.
IPC分类号: C07F9/6574 , C08K5/527
CPC分类号: C08J9/18 , C07F9/65742 , C08J2323/02 , C08K5/527 , D01F1/10 , D01F6/04 , D01F6/06 , C08L23/02
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82.Preparation of expanded fluorine type resin products 失效
标题翻译: Fluorharz Schaum und dessen Herstellungsverfahren公开(公告)号:EP0908487A2
公开(公告)日:1999-04-14
申请号:EP98204435.6
申请日:1994-11-09
发明人: Hane, Toshioki , Koike, Hisao
CPC分类号: B24D18/00 , B24B37/04 , B24B37/24 , B24D11/00 , B24D13/14 , C08J9/122 , C08J9/127 , C08J9/144 , C08J9/149 , C08J9/18 , C08J9/28 , C08J2201/03 , C08J2201/032 , C08J2201/0502 , C08J2203/142 , C08J2205/052 , C08J2323/02 , C08J2327/12
摘要: Expanded fluorine type resin products are prepared by adding, to a thermoplastic fluorine type resin without a cross-linking structure, 0.4 to 20% by weight of a C 1 to C 8 -fluorocarbon having a boiling point lower than the crystalline melting point of the resin and 0.01 to 1% by weight of at least one compound selected from the group consisting of water and alcohols having a boiling point of 150°C or less and a latent heat of evaporation of 7.0 kcal/mol or more, and expanding the mixed resin. By this process sheet materials suitable as polishing cloths may be prepared.
摘要翻译: 通过向不具有交联结构的热塑性氟类树脂中加入0.4〜20重量%的沸点低于树脂的结晶熔点的C1〜C8-碳氟化合物来制备膨胀型氟树脂产品, 0.01〜1重量%的沸石为150℃以下,蒸发潜热为7.0kcal / mol以上的水和醇组成的组中的至少一种化合物,使该混合树脂膨胀。 通过该工艺可以制备适合作为抛光布的片材材料。
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公开(公告)号:EP0646619B1
公开(公告)日:1999-04-07
申请号:EP94111740.0
申请日:1994-07-28
CPC分类号: C08J9/18 , C08J2203/14 , C08J2323/16
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84.STYRENE RESIN FOAMING MATERIAL AND HEAT INSULATING MATERIAL USING THE SAME FOR CONSTRUCTION 失效
标题翻译: 苯乙烯系树脂发泡材料和绝缘材料用这种是建立公开(公告)号:EP0860466A4
公开(公告)日:1999-02-24
申请号:EP96937518
申请日:1996-11-07
申请人: SEKISUI PLASTICS
发明人: MORIOKA IKUO , ARAMOMI YUKIO , SHIMADA MUTSUHIKO
CPC分类号: C08J9/232 , C08J9/14 , C08J9/18 , C08J2203/14 , C08J2325/06
摘要: A styrene resin foaming material has a density ς of 0.02-0.008 g/cm3, a melt tension of the styrene resin of 5-40 gf. The relation between an average cell diameter d(νm) and the density ς is given by (1). The relation between a thermal conductivity μ(kcal/m.h. °C) and the density ς is given by (2): μ ≤ 0.0001 x 1/ς + 0.023. Accordingly, the styrene resin foaming material has a low material conductivity and excellent heat insulating property in spite of a low density (high ratio expansion foam) thereof.
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公开(公告)号:EP0702054B1
公开(公告)日:1998-12-23
申请号:EP95306365.8
申请日:1995-09-12
发明人: Mahood, James Alan
CPC分类号: D01F6/06 , C07F9/65742 , C08J9/18 , C08J2323/02 , C08K5/527 , D01F1/10 , D01F6/04 , C08L23/02
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公开(公告)号:EP0702053B1
公开(公告)日:1998-12-23
申请号:EP95306364.1
申请日:1995-09-12
发明人: Mahood, James Alan
CPC分类号: D01F6/06 , C07F9/65742 , C08J9/18 , C08J2323/02 , C08K5/527 , D01F1/10 , D01F6/04 , C08L23/02
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公开(公告)号:EP0604794B1
公开(公告)日:1998-04-15
申请号:EP93119670.3
申请日:1993-12-07
申请人: JSP CORPORATION
发明人: Tokoro, Hisao , Shioya, Satoru , Hinokawa, Akira
CPC分类号: C08J9/228 , C08J9/0066 , C08J9/18 , C08J2203/06 , C08J2323/02
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公开(公告)号:EP0569143B1
公开(公告)日:1998-03-18
申请号:EP93302971.2
申请日:1993-04-19
发明人: Takahashi, Takeshi, c/o Showa Denko K. K. , Kamei, Ryosuke, c/o Showa Denko K. K. , Terazono, Shigenori, c/o Showa Denko K. K. , Takahashi, Tetuya, c/o Showa Denko K. K. , Nakamura, Akira, c/o Showa Denko K. K. , Takiyama, Eiichiro
CPC分类号: C08J9/18 , B29K2003/00 , B32B27/10 , B32B27/36 , C08G18/0895 , C08G18/4236 , C08G18/4238 , C08G18/4241 , C08G18/4283 , C08G18/4286 , C08G18/4854 , C08G63/16 , C08G63/20 , C08G63/916 , C08G2101/00 , C08G2101/0008 , C08G2230/00 , C08G2250/00 , C08J5/18 , C08J9/04 , C08J9/06 , C08J9/14 , C08J2201/03 , C08J2367/00 , C08J2367/02 , C08J2375/06 , D01D5/42 , D01F6/625 , D01F6/70 , D04H13/02
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公开(公告)号:EP0569148B1
公开(公告)日:1998-02-04
申请号:EP93302976.1
申请日:1993-04-19
发明人: Kondo, Haruhiko, c/o Showa Denko K.K. , Imaizumi, Mitsuhiro, c/o Showa Denko K.K. , Kamei, Ryosuke, c/o Showa Denko K.K. , Kimura, Hideharu, c/o Showa Denko K.K. , Takiyama, Eiichiro
CPC分类号: C08J9/18 , B29K2003/00 , B32B27/10 , B32B27/36 , C08G18/0895 , C08G18/4236 , C08G18/4238 , C08G18/4241 , C08G18/4283 , C08G18/4286 , C08G18/4854 , C08G63/16 , C08G63/20 , C08G63/916 , C08G2101/00 , C08G2101/0008 , C08G2230/00 , C08G2250/00 , C08J5/18 , C08J9/04 , C08J9/06 , C08J9/14 , C08J2201/03 , C08J2367/00 , C08J2367/02 , C08J2375/06 , D01D5/42 , D01F6/625 , D01F6/70 , D04H13/02
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90.
公开(公告)号:EP0164855B2
公开(公告)日:1998-01-28
申请号:EP85302980.9
申请日:1985-04-26
CPC分类号: C08J9/18 , B29C44/3461 , C08J9/122 , C08J2203/06 , C08J2323/02 , Y10S264/05 , Y10S264/09 , Y10S264/13 , Y10S264/15 , Y10S264/16
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