POLISHING PAD AND METHOD FOR PRODUCING SAME
    8.
    发明授权
    POLISHING PAD AND METHOD FOR PRODUCING SAME 有权
    抛光垫及其制造方法

    公开(公告)号:EP2806453B1

    公开(公告)日:2018-05-02

    申请号:EP12841356.4

    申请日:2012-10-12

    摘要: Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method for producing the polishing pad. The polishing pad is for polishing a semiconductor device and includes a polishing layer having a polyurethane-polyurea resin molded body containing cells of a substantially spherical shape. The polyurethane-polyurea resin molded body has a ratio of closed cells of 60 to 98%. The polyurethane-polyurea resin molded body has a ratio tan´ of a loss modulus E" to a storage modulus E' (loss modulus/storage modulus) of 0.15 to 0.30. The storage modulus E' is 1 to 100 MPa. The polyurethane-polyurea resin molded body has a density D of 0.4 to 0.8 g/cm 3 .