摘要:
The invention relates to a method for treating a wood board. According to the invention, a composition containing a hydrophobic agent is provided onto the surface of the wood board and coating agent is provided over it to form a coating layer.
摘要:
The invention relates to a binder for producing materials based on wood chips and/or wood fibers. The aim of the invention is to design a binder which is used for producing and gluing materials based on wood chips and/or wood fibers, contains natural protein components, significantly reduces or even eliminates the drawbacks of the prior art, and can be economically produced and used. Said aim is achieved by a binder which is used for materials based on wood chips and/or wood fibers, comprises an aldehyde-based condensation resin and other additives, and is characterized in that the binder comprises a water-soluble reactive additive containing a peptide/amino acid mixture without moieties of water-insoluble and high-viscosity proteins. The invention also relates to a method for producing said binder as well as a molded article.
摘要:
The invention relates to a method for treating a wood board. According to the invention, a composition containing a hydrophobic agent is provided onto the surface of the wood board and coating agent is provided over it to form a coating layer.
摘要:
There is disclosed a process for the continuous production of an aqueous amino formaldehyde resin solution, preferably melamine formaldehyde resin solution (MF) or urea formaldehyde resin solution (UF) or melamine-urea-formaldehyde resin (MUF) comprising the steps of: a. preparing a reaction mixture of an amino compound and an aqueous formaldehyde, b. adding a catalyst to the reaction mixture, c. condensation reacting the reaction mixture in the presence of the catalyst, characterised in that, in step a) the amino compound and the formaldehyde are added as a concentrated aqueous solution or as a solid to a total solid content in the reaction mixture of 40 - 85 wt% (dry weight relative to the total weight of the reaction mixture), wherein in step c) the condensation reaction takes place in a continuous plug flow of the reaction mixture and wherein, in step b) the catalyst is continuously added and finely dispersed into the reaction mixture through one or more addition points and in optional step d) adding an amount of amino compound after condensation, in optional step e) removing water to reach a higher solid content.
摘要:
A method of joining a first and a second substrate of wood based materials is described, the method comprising the steps of: - applying a water based adhesive composition onto a first surface of said first substrate, - drying a surface layer of a second surface of the second substrate, - bringing together the first surface and a second surface of the second substrate, and - pressing the two surfaces against each other until an initial bonding is established.
摘要:
Resin compositions (A) and (B) are described: wherein resin composition (A) comprises a naturally occurring component or derivative thereof comprising protein, an aromatic hydroxyl compound-aldehyde resin and an amino resin, wherein the naturally occurring component or derivative thereof is chemically bound to the aromatic hydroxyl compound-aldehyde resin to form an ncPF resin and the naturally occurring component or derivative thereof is optionally chemically bound to the amino resin; wherein resin composition (B) comprises a condensation product of a naturally occurring component or derivative thereof, an aromatic hydroxyl compound-aldehyde resin and at least 20 wt % of urea based on the total mass of the resin composition, wherein at least 50 wt % of the naturally occurring component or derivative thereof is chemically bound directly or indirectly to the aromatic hydroxyl compound-aldehyde resin (ncPF), and wherein the naturally occurring component or derivative thereof comprises protein. The resin compositions can be used as a binder for lignocellulosic or cellulosic materials which have an excellent combination of low formaldehyde emissions and high strength. Also described are low formaldehyde emissions wood products comprising unique binder combinations.
摘要:
An adhesive system comprising the following parts: a) a urea formaldehyde resin adhesive part; b) a hardener part comprising one or more curing agents(s), c) a polymer dispersion; and d) a formaldehyde scavenger, wherein part d) comprises a combination of urea and resorcinol, is described. A formaldehyde scavenger and a process for manufacturing of an adhesive system is also described.
摘要:
The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprisinga 50 – 70 wt% melamine-formaldehyde (MF) type resin in 25 –40 wt% water and adhesive component II comprising 25 –40 wt% of a water based dispersion adhesive, 15 –40 wt% of a formaldehyde scavengerand an acidic compound in an amount such that the pH of adhesive component II is 1.5 –6.5,wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH 2 ) between 0.2 and 0.7.
摘要:
A method for gluing of wood or wood based products using EPI (Emulsion-Polymer-Isocyanate) adhesive, where the adhesive is applied to one or both of the surfaces to be glued, the surfaces that are to be glued are joined and the surfaces are forced together until the adhesive is adequately hardened, wherein water is sprayed onto the surface or surfaces onto which adhesive is applied after application of adhesive and before the surfaces are joined, and where the amount of water sprayed on the surface or surfaces onto which adhesive is applied, constitutes from about 2% to about 25% of the applied amount of adhesive, is described.