RAPID CURING AND HIGH THIXOTROPY EPOXY ADHESIVE COMPOSITIONS

    公开(公告)号:EP3162829B1

    公开(公告)日:2018-08-15

    申请号:EP15192110.3

    申请日:2015-10-29

    发明人: Bardts, Mareike

    摘要: The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa x 1/s, when measured at 23°C according to the test method described in the experimental section. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding small parts in manufacturing operations in aeronautic and aerospace industries. The present disclosure also relates to method of using such epoxy resin based curable compositions.

    TWO PACK TYPE CURABLE POLYORGANOSILOXANE COMPOSITION AND USE OF SAME
    7.
    发明公开
    TWO PACK TYPE CURABLE POLYORGANOSILOXANE COMPOSITION AND USE OF SAME 审中-公开
    ZWEITEILIGEHÄRTBAREPOLYORGANOSILOXANZUSAMMENSETZUNG UND VERWENDUNG DAVON

    公开(公告)号:EP2865719A1

    公开(公告)日:2015-04-29

    申请号:EP13807603.9

    申请日:2013-06-21

    摘要: The invention provides a two-pack curable polyorganosiloxane composition having an excellent rapid curing property, and methods for producing an adhered article using the compositions. The two-pack curable polyorganosiloxane composition consisting of a first component and a second component, the composition comprising: (A) an alkenyl group-containing polyorganosiloxane that contains two or more alkenyl groups in the molecule; (B) a polyorganohydrogensiloxane that has two or more hydrogen atoms bonded to a silicon atom in the molecule; and (C) a platinum group catalyst, wherein the ratio of the number of the hydrogen atoms bonded to silicon atoms in (B), H B , to the number of the alkenyl groups in (A), Vi A , is 0.5 to 10.0; the content of (C) is 0.5 to 2000 ppm in terms of a platinum group metal; the first component comprises (A) and (C); and the second component comprises (B).

    摘要翻译: 本发明提供了具有优异的快速固化性能的双组分可固化聚有机硅氧烷组合物,以及使用该组合物生产粘附制品的方法。 由第一组分和第二组分组成的双组分可固化聚有机硅氧烷组合物,所述组合物包含:(A)分子中含有两个或更多个烯基的含烯基的聚有机硅氧烷; (B)分子中具有与硅原子键合的2个以上氢原子的聚有机氢硅氧烷; 和(C)铂族催化剂,其中(B)中与B原子键合的氢原子数Hb与(A)中的链烯基数ViA的比率为0.5〜10.0; 根据铂族金属,(C)的含量为0.5〜2000ppm; 第一组分包括(A)和(C); 并且第二组分包含(B)。

    WASSERBASIERTER 2-KOMPONENTEN KLEBSTOFF
    10.
    发明公开
    WASSERBASIERTER 2-KOMPONENTEN KLEBSTOFF 审中-公开
    水基2个组件ADHESIVE

    公开(公告)号:EP2470612A1

    公开(公告)日:2012-07-04

    申请号:EP10730786.0

    申请日:2010-07-07

    IPC分类号: C09J5/04 C08J5/12 C09J111/02

    摘要: The invention relates to a method for gluing two substrates together, wherein one substrate is coated with a layer of an aqueous adhesive containing dispersions from chlorinated polyolefins and additives having a pH of 10 to 13. An activator solution is applied to the first or second substrate in a subsequent step, wherein the activator solution contains substances comprising acid groups, and gluing the coated surfaces together using light pressure. The invention describes a 2-part adhesive consisting of a storage-stable aqueous adhesive dispersion containing 25 to 50% by weight chlorinated polyolefins, 5 to 30% by weight additional polymers, and additives and water having a pH value of 9 to 13 and an activator solution as a second component, wherein the activator solution contains carboxylic acids, sulfonic acids, phosphonic acids, polymers comprising carboxylic acid or sulfonic acid groups, inorganic acid salts or Lewis acids, and water or organic solvents.